JPH0831351B2 - Covered wire soldering method - Google Patents
Covered wire soldering methodInfo
- Publication number
- JPH0831351B2 JPH0831351B2 JP2004988A JP498890A JPH0831351B2 JP H0831351 B2 JPH0831351 B2 JP H0831351B2 JP 2004988 A JP2004988 A JP 2004988A JP 498890 A JP498890 A JP 498890A JP H0831351 B2 JPH0831351 B2 JP H0831351B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- terminal
- coated
- wire
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品などに使用される被覆導線の半田
づけ方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a coated conductive wire used in electronic parts and the like.
従来の技術 第２図は、細線の樹脂被覆導線６が巻回されたコイル
７を有するボイスコイルについて、その端子５に前記細
線６を半田づけする状態を示すものである。導線６は、
銅線の外周に樹脂が被覆されたものである。2. Description of the Related Art FIG. 2 shows a voice coil having a coil 7 around which a thin resin-coated conductor wire 6 is wound, in which the thin wire 6 is soldered to its terminals 5. Conductor 6 is
The outer periphery of the copper wire is coated with resin.
樹脂被覆導線６と端子５の接点にクリーム半田８を塗
り、端子５の、クリーム半田８を塗った面と反対の面に
YAGレーザ９を照射する。すると、端子５はYAGレーザ９
を吸収して発熱し、端子５に巻かれた樹脂被覆導線６の
被覆が溶けて、端子５と導線とは電気的に導通されると
共に半田８が溶融して半田づけされる。Cream solder 8 is applied to the contact point between the resin-coated conductor 6 and the terminal 5, and the surface of the terminal 5 opposite to the surface coated with the cream solder 8 is applied.
Irradiate the YAG laser 9. Then, the terminal 5 is the YAG laser 9
Is absorbed to generate heat, the coating of the resin-coated conductor wire 6 wound around the terminal 5 is melted, the terminal 5 and the conductor wire are electrically connected, and the solder 8 is melted and soldered.
発明が解決しようとする課題 従来の方法では、YAGレーザ光を端子に照射すること
によって端子を加熱し、この熱で樹脂被覆を溶かすと同
時に半田づけを行っている。Problems to be Solved by the Invention In the conventional method, the terminals are heated by irradiating the terminals with YAG laser light, and the heat is used to melt the resin coating and at the same time perform soldering.
この場合、導線の樹脂被覆は半田づけ部において完全
に除去されるべきであるが、この半田づけ部の被覆導線
部は端子５に隠れているので直接にYAGレーザ光９で加
熱除去されるのではなく、レーザ光９で加熱された端子
５からの伝熱で間接的に加熱され被覆が溶融除去される
ものである。そのために、樹脂の被覆除去が完全に行な
われない状態で導線６が端子５に半田づけされてしまう
ことがあり、端子５と導線６との導通不良が10％程度発
生していた。また、樹脂被覆を溶融除去するためには端
子５をかなりの高温にしなければならず、その他の部分
への熱的影響も問題になる。In this case, the resin coating of the conductive wire should be completely removed at the soldering portion, but since the coated conductive wire portion of this soldering portion is hidden by the terminal 5, it is directly heated and removed by the YAG laser beam 9. Instead, it is indirectly heated by heat transfer from the terminal 5 heated by the laser beam 9 to melt and remove the coating. Therefore, the conductive wire 6 may be soldered to the terminal 5 in a state where the resin coating is not completely removed, and a poor conduction between the terminal 5 and the conductive wire 6 occurs in about 10%. In addition, in order to melt and remove the resin coating, the terminal 5 must be heated to a considerably high temperature, and the thermal influence on other parts also becomes a problem.
本発明は、上述した課題を解決することを目的とす
る。The present invention aims to solve the above-mentioned problems.
課題を解決するための手段 上記課題を解決するための手段は、YAGレーザによる
半田づけに先立ち、CO2レーザ発振器と、このレーザ発
振器で発生したパルスレーザ光を伝送する赤外用光ファ
イバ及び光学系とを用い、前記赤外用光ファイバ及び光
学系により伝送されたCO2レーザ光を樹脂被覆線に直接
に照射することにより、被覆を分解除去した後、樹脂被
覆線と端子とを半田づけすることである。Means for Solving the Problems Means for solving the above problems are, prior to soldering with a YAG laser, a CO 2 laser oscillator, an infrared optical fiber for transmitting pulsed laser light generated by this laser oscillator, and an optical system. By directly irradiating the resin-coated wire with the CO 2 laser light transmitted by the infrared optical fiber and the optical system by using and, after the coating is decomposed and removed, the resin-coated wire and the terminal are soldered. Is.
作用 樹脂にCO2レーザ光（波長10.6μｍ）を直接に照射し
た場合、樹脂に対するCO2レーザ光の吸収は大きいた
め、樹脂は確実に加熱蒸発され除去される。また、CO2
レーザ光は金属に対する反射率は大きいので、樹脂被覆
線に照射した場合、心線を傷つけずに被覆だけを除去す
ることができる。また、樹脂の被覆を除去するにあた
り、CO2レーザはごく短時間樹脂に照射するだけでよ
く、半田づけ部以外を熱的に損傷することもない。Action When the resin is directly irradiated with CO 2 laser light (wavelength 10.6 μm), the resin absorbs the CO 2 laser light so much that the resin is reliably heated and evaporated to be removed. Also, CO 2
Since the laser light has a high reflectance to metal, when the resin coated wire is irradiated, only the coating can be removed without damaging the core wire. Further, when removing the resin coating, the CO 2 laser only has to irradiate the resin for a very short time, and the parts other than the soldering part are not thermally damaged.
また、CO2レーザ光を伝送する際、ミラーによる伝送
方法を用いると電子部品の端子のような細かい部分に照
射することはできないが、赤外用光ファイバを用いて伝
送すれば細かい部分に照射することができ、分岐も容易
である。Also, when transmitting CO 2 laser light, it is not possible to irradiate fine parts such as the terminals of electronic parts if the transmission method using a mirror is used, but if it is transmitted using an infrared optical fiber, it irradiates fine parts. It is possible and easy to branch.
実施例 本発明の実施例を図を用いて説明する。Example An example of the present invention will be described with reference to the drawings.
第１図（ａ）は、本発明の実施例である半田づけ方法
を示すものである。第１図（ｂ）は、第１図（ａ）にお
ける端子５のレーザ光照射部分を、集光レンズ４側から
見た拡大図である。FIG. 1 (a) shows a soldering method which is an embodiment of the present invention. FIG. 1B is an enlarged view of the laser light irradiation portion of the terminal 5 in FIG. 1A viewed from the condenser lens 4 side.
１は、CO2レーザ発振器、２は、KRS−５を原料とする
赤外用光ファイバ、３は、光ファイバ２から出射したCO
2レーザ光、４は、集光レンズ、５は、ボイスコイルの
端子、６は、樹脂被覆導線、７は、コイルである。1 is a CO 2 laser oscillator, 2 is an infrared optical fiber made of KRS-5 as a raw material, and 3 is CO emitted from the optical fiber 2.
2 laser light, 4 a condenser lens, 5 a voice coil terminal, 6 a resin-coated conductor, and 7 a coil.
導線６の樹脂被覆の剥離は以下のように行う。CO2レ
ーザ発振器１で発生した出力20W、パルス幅50msのCO2レ
ーザ光３を、２本の赤外用光ファイバ２に分岐して入射
する。この赤外用光ファイバ２により伝送されたCO2レ
ーザ光３を集光レンズ４でビーム径700μｍ程度に集光
し、前もって端子５に巻き付けられた、コイル７から延
長するポリウレタンを被覆した直径50μｍの樹脂被覆導
線６に照射する。端子部の導線６のポリウレタン被覆は
このように直接CO2レーザが照射されるので容易にかつ
確実に蒸発除去され、端子５とは確実に電気的導通が行
なわれる。The resin coating of the conducting wire 6 is peeled off as follows. A CO 2 laser beam 3 having an output of 20 W and a pulse width of 50 ms generated by the CO 2 laser oscillator 1 is branched and incident on two infrared optical fibers 2. The CO 2 laser light 3 transmitted by the infrared optical fiber 2 is condensed by a condenser lens 4 to a beam diameter of about 700 μm, and is wound on the terminal 5 in advance and is coated with polyurethane extending from the coil 7 and has a diameter of 50 μm. The resin-coated conductor wire 6 is irradiated. Since the CO 2 laser is directly irradiated on the polyurethane coating of the conductor 6 of the terminal portion, the polyurethane coating is easily and surely removed by evaporation, so that the terminal 5 is reliably electrically connected.
また、導線６は端子５に巻き付けられた後にレーザ照
射をうけるので、必要とする部分のみの被覆を除去する
ことができる。もし導線を端子に巻き付ける前にレーザ
照射して被覆を除去する場合には、巻き付け誤差を考慮
すると、必要以上の長さにわたって被覆を除去しなけれ
ばならないばかりか、レーザ照射の為に細線の位置を自
動的に検出しなければならない困難を伴う。Further, since the conductive wire 6 is irradiated with the laser after being wound around the terminal 5, it is possible to remove the coating of only a necessary portion. If the coating is removed by laser irradiation before winding the conductor wire around the terminal, considering the winding error, it is necessary to remove the coating for a length longer than necessary, and the position of the fine wire for laser irradiation. With the difficulty of having to detect automatically.
本実施例では、導線を端子５に巻き付けた後に、端子
部に向けてCO2レーザを照射しているので、必要最小限
の被覆のみが除去されると共に、レーザの照射部の位置
検出としては、端子５を検出すればよいから、細線を検
出する場合に比べて、検出がきわめて容易である。従っ
て、大量生産ラインにも容易に対応できる。In this embodiment, since the CO 2 laser is irradiated toward the terminal portion after the conductive wire is wound around the terminal 5, only the minimum necessary coating is removed and the position of the laser irradiation portion is detected. Since it is sufficient to detect the terminal 5, the detection is extremely easy as compared with the case of detecting a thin line. Therefore, it can be easily applied to a mass production line.
そして端子部に従来と同様の位置にクリーム半田を塗
り、YAGレーザを従来と同じく端子５の上部から照射し
て半田づけを行う。この場合、従来の方法と違って、YA
Gレーザによって樹脂被覆を溶融除去する必要がないの
で、端子をあまり高温にする必要がなく、他の部分への
熱的影響が少ない。また、CO2レーザ光３の伝送手段と
して赤外用光ファイバ２を用いているため、ミラーを使
った伝送法に比べて、細かい部分に照射するのが容易で
あり、分岐も容易である。Then, the solder paste is applied to the terminal portion at the same position as in the conventional case, and YAG laser is irradiated from the upper portion of the terminal 5 as in the conventional case to perform soldering. In this case, unlike the conventional method, YA
Since it is not necessary to melt and remove the resin coating with the G laser, it is not necessary to heat the terminals so much that thermal influence on other parts is small. Further, since the infrared optical fiber 2 is used as a transmission means of the CO 2 laser light 3, it is easier to irradiate a fine portion and branching is easier than in the transmission method using a mirror.
上記方法で半田づけを行った結果、導線６と端子５の
電気的導通はきわめて良好で従来の課題を解決できるこ
とが確認された。As a result of soldering by the above method, it was confirmed that the electrical continuity between the conductive wire 6 and the terminal 5 was extremely good and the conventional problems could be solved.
なお、本実施例ではポリウレタンを被覆した導線を用
いたが、他の樹脂を被覆した線を用いた場合でも、適当
な照射条件（出力・パルス幅・ビーム径）を選べば、上
記方法により、被覆を剥離することができ、半田づけ工
程において同様の効果が実現できる。In this example, the conductor wire coated with polyurethane was used, but even when a wire coated with another resin is used, if appropriate irradiation conditions (output, pulse width, beam diameter) are selected, the above method can be used. The coating can be peeled off and the same effect can be realized in the soldering process.
発明の効果 以上の説明から明らかなように、本発明の方法を用い
れば、樹脂被覆線を端子に半田づけする際、前もって、
CO2レーザ発振器と、このレーザ発振器で発生したパル
スレーザ光を伝送する赤外用光ファイバ及び光学系とを
用いて、前記赤外用光ファイバ及び光学系により伝送さ
れてCO2レーザ光を樹脂被覆線に照射して、被覆を分解
除去することが可能であるから、半田づけ工程における
歩留まりを著しく向上できる効果を有する。EFFECTS OF THE INVENTION As is apparent from the above description, when the method of the present invention is used, when the resin-coated wire is soldered to the terminal,
A CO 2 laser oscillator and an infrared optical fiber and an optical system for transmitting a pulsed laser beam generated by the laser oscillator are used, and the CO 2 laser light transmitted by the infrared optical fiber and the optical system is coated with a resin. Since the coating can be decomposed and removed by irradiating the substrate, the yield in the soldering process can be significantly improved.
第１図（ａ）は本発明の半田づけ方法の実施例の説明
図、第１図（ｂ）は、第１図（ａ）におけるレーザ光照
射部分の拡大図、第２図は従来の半田づけ方法の説明図
である。 １……CO2レーザ発振器、２……赤外用光ファイバ、３
……CO2レーザ光、４……集光レンズ、５……端子、６
……樹脂被覆導線、７……コイル、８……クリーム半
田、９……YAGレーザ光。FIG. 1 (a) is an explanatory view of an embodiment of a soldering method of the present invention, FIG. 1 (b) is an enlarged view of a laser beam irradiation portion in FIG. 1 (a), and FIG. 2 is a conventional solder. It is explanatory drawing of the attachment method. 1 ... CO 2 laser oscillator, 2 ... Infrared optical fiber, 3
…… CO 2 laser light, 4 …… Condensing lens, 5 …… Terminal, 6
...... Resin-coated wire, 7 ... Coil, 8 ... Cream solder, 9 ... YAG laser light.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−118367（ＪＰ，Ａ) 特開 昭63−203273（ＪＰ，Ａ) 特開 昭60−104907（ＪＰ，Ａ) 実開 昭61−38818（ＪＰ，Ｕ) ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-1-118367 (JP, A) JP-A-63-203273 (JP, A) JP-A-60-104907 (JP, A) Actual development Sho-61- 38818 (JP, U)
Claims (1)
線半田づけ方法であって、前記樹脂被覆導線を前記端子
に巻き付けた後、CO2レーザ発振器より発生したパルス
レーザ光を赤外用光ファイバにより伝送して、前記樹脂
被覆導線に直接照射して前記樹脂被覆を分解除去し、そ
の後、前記樹脂被覆除去された導線部と前記端子とを半
田づけすることを特徴とする被覆線半田づけ方法。1. A coated wire soldering method for soldering a resin-coated conductor wire and a terminal, wherein after the resin-coated conductor wire is wound around the terminal, pulsed laser light generated from a CO 2 laser oscillator is emitted as infrared light. The coated wire soldering is characterized in that the resin coated conductive wire is directly irradiated onto the resin coated wire to decompose and remove the resin coating, and then the conductive wire portion having the resin coated removed and the terminal are soldered. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004988A JPH0831351B2 (en) | 1990-01-12 | 1990-01-12 | Covered wire soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004988A JPH0831351B2 (en) | 1990-01-12 | 1990-01-12 | Covered wire soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03210783A JPH03210783A (en) | 1991-09-13 |
| JPH0831351B2 true JPH0831351B2 (en) | 1996-03-27 |
Family
ID=11598992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004988A Expired - Lifetime JPH0831351B2 (en) | 1990-01-12 | 1990-01-12 | Covered wire soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831351B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2740385B2 (en) * | 1992-01-27 | 1998-04-15 | 松下電工株式会社 | Brazing method for insulated conductor |
| US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
| DE102007007618B3 (en) * | 2007-02-13 | 2008-04-24 | Lkt Klebtechnik Gmbh | Method for joining coated components or wires using a laser used in the production of e.g. micro-systems comprises directing a laser pulse onto the joining site during the joining step and varying the pulse shape |
| JP2014082426A (en) * | 2012-10-18 | 2014-05-08 | Murata Mfg Co Ltd | Method of manufacturing wound coil component |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60104907A (en) * | 1983-11-14 | 1985-06-10 | Olympus Optical Co Ltd | Probe for laser scalpel |
| JPS6138818U (en) * | 1984-08-09 | 1986-03-11 | 富士通株式会社 | Covered wire terminal processing equipment |
| JPS63203273A (en) * | 1987-02-19 | 1988-08-23 | Toshiba Corp | Laser beam soldering equipment |
| JPH0794066B2 (en) * | 1987-10-29 | 1995-10-11 | 松下電器産業株式会社 | Soldering method |
-
1990
- 1990-01-12 JP JP2004988A patent/JPH0831351B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03210783A (en) | 1991-09-13 |
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