JPH0794066B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH0794066B2 JPH0794066B2 JP62273713A JP27371387A JPH0794066B2 JP H0794066 B2 JPH0794066 B2 JP H0794066B2 JP 62273713 A JP62273713 A JP 62273713A JP 27371387 A JP27371387 A JP 27371387A JP H0794066 B2 JPH0794066 B2 JP H0794066B2
- Authority
- JP
- Japan
- Prior art keywords
- copper wire
- soldered
- solder
- coated copper
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、輻射熱を熱源とした被覆銅線の半田付方法に
関するものである。TECHNICAL FIELD The present invention relates to a method for soldering a coated copper wire using radiant heat as a heat source.
従来の技術 近年、電子部品のチップ化、高密度化に伴い、半田付方
法も多様化しており、従来の半田ゴテによる半田付、あ
るいは浸漬式半田付方法以外に、熱源としてレーザ光線
や赤外線、光ビーム等の輻射熱を利用する半田付方法が
開発され、すでに実用段階に達してきたものもある。そ
の中で、レーザ光線は集光スポットが小さく、非接触の
微小半田付方法として実用価値大と注目されつつある。2. Description of the Related Art In recent years, as electronic parts have been made into chips and have become higher in density, soldering methods have also diversified, and in addition to conventional soldering iron soldering or immersion soldering methods, laser beams or infrared rays as heat sources, A soldering method utilizing radiant heat from a light beam or the like has been developed, and some have already reached a practical stage. Among them, a laser beam has a small focused spot and is attracting attention as a non-contact minute soldering method with great practical value.
発明が解決しようとする問題点 しかしながら被覆銅線を被半田付材料に付着させる半田
付において、熱源としてレーザ光線等の輻射線を被半田
付部に照射するだけの方法では、 （１） 溶融した半田が被半田付部から被半田付部以外
の部位へ流動し、被覆銅線の半田付が不能となる。Problems to be Solved by the Invention However, in soldering in which a coated copper wire is attached to a material to be soldered, a method of merely irradiating a portion to be soldered with a radiation ray such as a laser beam as a heat source is (1) melted. The solder flows from the portion to be soldered to a portion other than the portion to be soldered, and the coated copper wire cannot be soldered.
（２） 上記（１）に対して、溶融半田が被半田付部に
残留する場合でも、被覆銅線が溶融半田に覆われていな
いと、溶融半田からの被覆銅線への熱伝導が不充分で被
膜除去が不完全となり、その結果十分な接合強度が得ら
れない。(2) In contrast to the above (1), even if the molten solder remains on the soldered portion, if the coated copper wire is not covered with the molten solder, the heat conduction from the molten solder to the coated copper wire is unsuccessful. If it is sufficient, film removal will be incomplete, and as a result, sufficient bonding strength cannot be obtained.
などの問題点を有しており、実用化の妨げとなってい
た。However, there are problems such as the above, which hinders practical use.
本発明は上記問題点を解決するもので、熱源として輻射
熱を利用する半田付方法において、半田付時に溶融半田
が被半田付部以外の部位へ流動する現象を防止し、被覆
銅線に対して溶融半田を確実に覆わせることにより被覆
銅線の被膜を完全に除去することを目的とした半田付方
法を提供するものである。The present invention is to solve the above problems, in a soldering method utilizing radiant heat as a heat source, to prevent the phenomenon that the molten solder flows to a portion other than the soldered portion during soldering, to the coated copper wire It is intended to provide a soldering method aiming at completely removing a coating film of a coated copper wire by surely covering molten solder.
問題点を解決するための手段 上記問題点を解決するために本発明の半田付方法は、輻
射線を被半田付部に照射することによって半田を溶融す
る際に、被半田付部に、半田付時の熱量で変形、変質し
ないバックアップ治具を接触させる方法としたり、ある
いは被半田付部に半田溜まりのための凹凸部を設けてか
ら上記半田付を行うようにするものである。Means for Solving the Problems In order to solve the above problems, the soldering method of the present invention is such that when the solder is melted by irradiating the soldered portion with radiation, the soldered portion is soldered. A method of contacting a backup jig that does not deform or deteriorate due to the amount of heat at the time of soldering, or an uneven portion for a solder pool is provided on the soldered portion, and then the soldering is performed.
作用 前記手段によると、輻射線を被半田付部に照射すること
によって溶融した半田が、自らの表面張力の作用によっ
てバックアップ治具と上記被半田付部の間隙あるいは、
上記被半田付部に半田溜まりのための凹凸部を設けた場
合にはこの凹凸部に集結するため、被半田付部から被半
田付部以外の部位へ溶融半田が流動する現象を阻止する
ことができるだけでなく、被覆銅線を溶融半田で確実に
覆うことができ、被覆銅線への熱伝導が確実に行え、被
覆銅線の被膜を確実に溶融分解することができる。以上
の結果として信頼性の高い被覆銅線と被半田付材料との
半田付ができることになる。Action According to the means, the solder melted by irradiating the soldered portion with the radiation, the gap between the backup jig and the soldered portion by the action of its own surface tension, or
When the uneven portion for solder accumulation is provided on the soldered portion, it is gathered on the uneven portion, so that the phenomenon that the molten solder flows from the soldered portion to a portion other than the soldered portion is prevented. In addition, the coated copper wire can be reliably covered with the molten solder, the heat conduction to the coated copper wire can be reliably performed, and the coating film of the coated copper wire can be reliably melted and decomposed. As a result of the above, it is possible to solder the coated copper wire and the material to be soldered with high reliability.
実施例 以下、本発明の一実施例を添付図面に基づいて説明す
る。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings.
第６図に、本発明の一実施例の対象である被半田付材料
の詳細図を示す。第６図において、１はフープ状端子、
２はフェライトコア、３はポリウレタン被覆銅線であ
る。フェライトコア２に巻線されたポリウレタン銅線３
の始終端は、それぞれ被半田付部である端子１のランド
部1aに巻付けられることによって位置決めされている。FIG. 6 shows a detailed view of the material to be soldered which is the object of one embodiment of the present invention. In FIG. 6, 1 is a hoop-shaped terminal,
2 is a ferrite core and 3 is a polyurethane-coated copper wire. Polyurethane copper wire 3 wound around ferrite core 2
The starting and terminating points are positioned by being wound around the land portion 1a of the terminal 1 which is the soldered portion.
次に、第１図〜第５図は、本発明の実施例を作用の順に
示した状態図である。図中、４は図示されていない機構
によって定量塗布されたクリーム半田、５は図示されて
いない動力によって上下し、ランド部1aに接触するバッ
クアップ治具、６はレーザ光線、７はレーザ光線６を集
光させるレーザ出射光学系である。第１図〜第５図に示
した被半田付材料のフープ状端子１、ポリウレタン被覆
銅線３は第６図のＸ−Ｘ断面図として表わしている。ま
たこの被半田付材料は、図示されていない動力によって
紙面と垂直方向に間欠送りされ、位置決めされるもので
ある。Next, FIGS. 1 to 5 are state diagrams showing an embodiment of the present invention in the order of operation. In the figure, 4 is a cream solder which is quantitatively applied by a mechanism (not shown), 5 is a backup jig which moves up and down by a power (not shown) and contacts the land portion 1a, 6 is a laser beam, and 7 is a laser beam 6. It is a laser emission optical system for condensing. The hoop-shaped terminal 1 and the polyurethane-coated copper wire 3 of the material to be soldered shown in FIGS. 1 to 5 are shown as a cross-sectional view taken along line XX in FIG. The material to be soldered is intermittently fed and positioned in the direction perpendicular to the paper surface by a power (not shown).
第１図に示すように、ランド部1aにクリーム半田４を定
量塗布した後、第２図に示すように、バックアップ治具
５をランド部1aに接触させ、次に第３図に示すようにレ
ーザ光線６をランド部1aに照射する。ここで端子１のラ
ンド部1aが温度上昇することによってクリーム半田４が
溶融した際、溶融半田自体の表面張力により、端子１の
ランド部1aとバックアップ治具５の間に溶融半田が集結
するため、溶融半田のランド部1a以外の部位への流動が
阻止できる。この作用によって溶融半田の熱を全ての方
向から確実にポリウレタン被覆銅線３に伝達することが
できるようになり、従って上記端子１に巻付けられてラ
ンド部1aに密着したポリウレタン被覆銅線３のポリウレ
タン被膜が溶融分解して銅線に半田のぬれが形成でき、
溶融半田の自らの表面張力の作用も加わって半田付に必
要な半田がランド部1aの銅線の周囲に残るようになる。
このようにして一定時間レーザ光線６を照射した後、第
４図に示すようにレーザ光線６のランド部1aへの照射を
停止し、次に半田が溶融状態を維持している時間内に第
５図のようにバックアップ治具５をランド部1aより離し
て溶融した半田を冷却して凝固させることにより半田付
を完了する。As shown in FIG. 1, after the cream solder 4 is quantitatively applied to the land portion 1a, the backup jig 5 is brought into contact with the land portion 1a as shown in FIG. 2, and then as shown in FIG. The land portion 1a is irradiated with the laser beam 6. Here, when the cream solder 4 is melted due to the temperature rise of the land 1a of the terminal 1, the molten solder gathers between the land 1a of the terminal 1 and the backup jig 5 due to the surface tension of the molten solder itself. It is possible to prevent the molten solder from flowing to a portion other than the land portion 1a. By this action, the heat of the molten solder can be surely transferred to the polyurethane-coated copper wire 3 from all directions, and accordingly, the polyurethane-coated copper wire 3 wound around the terminal 1 and closely adhered to the land portion 1a The polyurethane film melts and decomposes, and solder wetness can be formed on the copper wire,
The effect of the surface tension of the molten solder is also added, so that the solder necessary for soldering remains around the copper wire of the land 1a.
After irradiating the laser beam 6 for a certain time in this way, the irradiation of the laser beam 6 to the land portion 1a is stopped as shown in FIG. As shown in FIG. 5, the backup jig 5 is separated from the land portion 1a, and the molten solder is cooled and solidified to complete the soldering.
以上が、本発明による実施例であり、次に他の実施例を
説明する。The above is the embodiment according to the present invention, and another embodiment will be described below.
第７図及び第８図は、端子１の被半田付部の構造を、溶
融半田が自らの表面張力の作用によって、被半田付部に
位置決めされたポリウレタン被覆銅線３を完全に覆って
被半田付部以外に流動しないようにしたものであり、第
７図に示すものは端子１の被半田付部に凹部８を設け、
この凹部８を溶融した半田の溜まり部とするもので、ま
た第８図は端子１に接着剤９を塗布して凸状壁を設け、
この凸状壁を溶融した半田の溜まり部とするものであ
る。このようにすることにより、上記第１図〜第５図を
用いて説明した本発明の実施例による効果に加え、溶融
半田が被半田付部以外の部位への流動するのを阻止する
ことができるようになるため、より信頼性の高い半田付
を行うことができるようになる。7 and 8 show the structure of the soldered portion of the terminal 1 in which the molten solder completely covers the polyurethane-coated copper wire 3 positioned in the soldered portion by the action of its own surface tension. The structure shown in FIG. 7 is designed so as not to flow except for the soldered portion.
This concave portion 8 is used as a pool of molten solder, and in FIG. 8, an adhesive 9 is applied to the terminal 1 to form a convex wall,
This convex wall serves as a pool of molten solder. By doing so, in addition to the effect of the embodiment of the present invention described with reference to FIGS. 1 to 5, it is possible to prevent the molten solder from flowing to a portion other than the soldered portion. As a result, it becomes possible to carry out soldering with higher reliability.
なお上記実施例では熱源としてレーザ光線６を利用した
が、他に光ビーム、赤外線等いかなる輻射線を利用して
もよく、これらの被半田付部への照射方向もいかなる方
向でもよい。また、供給する半田はクリーム半田４以外
のいかなる形状、性質の半田でもよく、またいかなる供
給方法でも同様の効果が得られる。たとえばメッキ半田
のごとくあらかじめ被半田付材料に載置されている半田
でもよい。Although the laser beam 6 is used as the heat source in the above embodiment, any other radiation such as a light beam or infrared ray may be used, and the direction of irradiation to these soldered portions may be any direction. Further, the solder to be supplied may be solder of any shape and property other than the cream solder 4, and the same effect can be obtained by any supply method. For example, solder that has been placed on the material to be soldered in advance, such as plated solder, may be used.
また、バックアップ治具５の形状は、被半田付部の構造
に対して適切なものであればいかなる形状でもよい。更
に、凹部８とした端子１の被半田付部の構造も、溶融半
田が自らの表面張力の作用によって被覆銅線を完全に覆
うという機能を発揮するものであれば、いかなる形状、
方法でもよい。The shape of the backup jig 5 may be any shape as long as it is suitable for the structure of the soldered portion. Further, the structure of the portion to be soldered of the terminal 1 which is the concave portion 8 may be any shape as long as the molten solder has a function of completely covering the coated copper wire by the action of its own surface tension,
It may be a method.
発明の効果 以上のように、本発明は輻射線を熱源とした被覆銅線の
半田付方法において、銅線が半田に十分覆われた信頼性
の高い半田付が実現でき、その実用的効果は極めて大で
ある。As described above, in the present invention, in the method of soldering a coated copper wire using radiation as a heat source, highly reliable soldering in which a copper wire is sufficiently covered with solder can be realized, and its practical effect is It is extremely large.
第１図〜第５図は本発明の半田付方法の一実施例を示す
断面図、第６図は同半田付の対象となるコイル部品の斜
視図、第７図，第８図は他の実施例の断面図である。 １……フープ状端子、1a……ランド部、２……フェライ
トコア、３……ポリウレタン被覆銅線、４……クリーム
半田、５……バックアップ治具、６……レーザ光線、７
……レーザ出射光学系、８……凹部、９……接着剤。1 to 5 are cross-sectional views showing an embodiment of the soldering method of the present invention, FIG. 6 is a perspective view of a coil component to be soldered, and FIGS. It is sectional drawing of an Example. 1 ... Hoop-shaped terminal, 1a ... Land part, 2 ... Ferrite core, 3 ... Polyurethane-coated copper wire, 4 ... Cream solder, 5 ... Backup jig, 6 ... Laser beam, 7
...... Laser emitting optical system, 8 ...... Concave, 9 ...... Adhesive.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 尅朗 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 谷崎 利男 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭49−47875（ＪＰ，Ａ) 実開 昭61−148464（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Taro Sato, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Toshio Tanizaki, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References Japanese Unexamined Patent Publication No. 49-47875 (JP, A) Actually developed 61-148464 (JP, U)
Claims (2)
上に配置し、上記被覆銅線の始終端部のそれぞれを上記
端子に巻付け接続し、この巻付け接続部にクリーム半田
を塗布して被半田付部を形成し、この被半田付部にバッ
クアップ治具を接触させ、次いで上記被半田付部に輻射
線を照射することによって上記クリーム半田を溶融して
被半田付部の被覆銅線に溶融半田を強制的に覆わせ、こ
の溶融半田の熱で上記被半田付部の被覆銅線の被膜を除
去することを特徴とする半田付方法。1. A ferrite core around which a coated copper wire is wound is arranged on a terminal, each of the start and end portions of the coated copper wire is wound and connected to the terminal, and cream solder is applied to the wound connection portion. To form a soldered portion, a backup jig is brought into contact with the soldered portion, and then the cream solder is melted by irradiating the soldered portion with radiation to coat the soldered portion. A soldering method characterized in that a copper wire is forcibly covered with molten solder and the coating of the coated copper wire of the soldered portion is removed by the heat of the molten solder.
凸部を設けて半田付を行う特許請求の範囲第１項記載の
半田付方法。2. The soldering method according to claim 1, wherein the soldered portion of the terminal is provided with an uneven portion for accumulating solder and soldering is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62273713A JPH0794066B2 (en) | 1987-10-29 | 1987-10-29 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62273713A JPH0794066B2 (en) | 1987-10-29 | 1987-10-29 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01118367A JPH01118367A (en) | 1989-05-10 |
| JPH0794066B2 true JPH0794066B2 (en) | 1995-10-11 |
Family
ID=17531522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62273713A Expired - Fee Related JPH0794066B2 (en) | 1987-10-29 | 1987-10-29 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0794066B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831351B2 (en) * | 1990-01-12 | 1996-03-27 | 松下電器産業株式会社 | Covered wire soldering method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947875A (en) * | 1972-07-16 | 1974-05-09 | ||
| JPS61148464U (en) * | 1985-03-01 | 1986-09-12 |
-
1987
- 1987-10-29 JP JP62273713A patent/JPH0794066B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01118367A (en) | 1989-05-10 |
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