JP2014082426A - Method of manufacturing wound coil component - Google Patents

Method of manufacturing wound coil component Download PDF

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Publication number
JP2014082426A
JP2014082426A JP2012231171A JP2012231171A JP2014082426A JP 2014082426 A JP2014082426 A JP 2014082426A JP 2012231171 A JP2012231171 A JP 2012231171A JP 2012231171 A JP2012231171 A JP 2012231171A JP 2014082426 A JP2014082426 A JP 2014082426A
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conducting wire
covering material
core
terminal portion
soldering
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Nobuhiko Einaga
信彦 永長
Yukinori Miyoshi
幸徳 三好
Hideyuki Yashiro
英之 八代
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2012231171A priority Critical patent/JP2014082426A/en
Priority to TW102134491A priority patent/TW201428786A/en
Priority to CN201310484678.7A priority patent/CN103779071A/en
Publication of JP2014082426A publication Critical patent/JP2014082426A/en
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Abstract

PROBLEM TO BE SOLVED: To shorten the soldering time for forming an external electrode when a wound coil component is manufactured; to reduce thermal damage of a ferrite core; and to suppress short-circuit between conducting wires.SOLUTION: A part of a covering material 22 of an end part 25 is removed by laser before soldering the end part 25 of a conducting wire 20 to a core terminal part 16. As a result, when soldered, the covering material 22 becomes easy to be fused and the soldering time is shortened. Moreover, the soldering temperature can be set to be low, the thermal damage of a ferrite core 11 is reduced, and short-circuit between the conducting wires 20 wound around a winding drum 12 is suppressed.

Description

本発明は、フェライトコアを有する巻線型コイル部品の製造方法に関する。   The present invention relates to a method for manufacturing a wire-wound coil component having a ferrite core.

巻線型コイル部品は、導線と、導線が巻回されるフェライトコアと、導線の端部を固定するためフェライトコアに設けられるコア端子部と、を有する。フェライトコアは、導線が直接巻回される巻胴と、巻胴の両端に配置される上鍔および下鍔と、により構成される。導線の端部は、はんだ付けによりコア端子部に固定されるが、導線の外周には絶縁材料が元々被覆されているので、導線の端部における絶縁材料を除去した上で、導線と、はんだとを電気的に接続する必要がある。   The wire-wound coil component includes a conductive wire, a ferrite core around which the conductive wire is wound, and a core terminal portion provided on the ferrite core for fixing an end portion of the conductive wire. The ferrite core is composed of a winding drum around which a conducting wire is directly wound, and upper and lower rods disposed at both ends of the winding drum. The end of the conductor is fixed to the core terminal by soldering, but the outer periphery of the conductor is originally coated with an insulating material. Therefore, after removing the insulating material from the end of the conductor, the conductor and solder Need to be electrically connected.

図８は、特許文献１（特開２００６−１３２３９号公報）に記載された巻線型コイル部品１０１のはんだ付け方法を示した図である。特許文献１には、フェライトコア１１１の下鍔１１４および導線１２０の端部１２５を、はんだ槽１５２の溶融はんだ１５３に浸漬することにより、巻線型コイル部品１０１の外部電極を形成する方法が記載されている。この方法によれば、導線１２０の端部１２５の絶縁材料を溶融はんだ１５３内に融解させて絶縁材料を除去するとともに、導線１２０と、はんだとを電気的に接続している。   FIG. 8 is a diagram showing a soldering method of the wound coil component 101 described in Patent Document 1 (Japanese Patent Laid-Open No. 2006-13239). Patent Document 1 describes a method of forming the external electrode of the wound coil component 101 by immersing the lower arm 114 of the ferrite core 111 and the end portion 125 of the conducting wire 120 in the molten solder 153 of the solder bath 152. ing. According to this method, the insulating material at the end portion 125 of the conducting wire 120 is melted in the molten solder 153 to remove the insulating material, and the conducting wire 120 and the solder are electrically connected.

特開２００６−１３２３９号公報JP 2006-13239 A

しかし、特許文献１に記載された方法では、導線１２０に被覆された絶縁材料を溶融はんだ１５３内にて除去するために長い時間を要していた。特に、フェライトコア１１１への熱ダメージを低減するために、溶融はんだ１５３の温度を低く設定した場合は、絶縁材料を除去するための時間がさらに必要となり、生産効率の低下を招いていた。   However, in the method described in Patent Document 1, it takes a long time to remove the insulating material covered with the conductive wire 120 in the molten solder 153. In particular, when the temperature of the molten solder 153 is set low in order to reduce thermal damage to the ferrite core 111, more time is required for removing the insulating material, resulting in a decrease in production efficiency.

本発明の目的は、外部電極の形成におけるはんだ付け時間を短縮することができる巻線型コイル部品の製造方法を提供することである。   An object of the present invention is to provide a method for manufacturing a wire-wound coil component that can shorten the soldering time in forming an external electrode.

本発明は、外周に被覆材が被覆された導線と、導線が巻回されるフェライトコアと、導線の端部を固定するためフェライトコアに設けられるコア端子部と、を有する巻線型コイル部品の製造方法であって、導線を前記フェライトコアに巻回する巻線工程と、導線の端部をコア端子部に配置する導線配置工程と、導線の端部にレーザ光を照射することにより、導線の端部の被覆材の一部を除去する被覆材除去工程と、導線の端部をコア端子部に、はんだ付けするはんだ付け工程と、を備える。   The present invention relates to a wound-type coil component having a conducting wire whose outer periphery is coated with a coating material, a ferrite core around which the conducting wire is wound, and a core terminal portion provided on the ferrite core for fixing the end of the conducting wire. A winding method for winding a conducting wire around the ferrite core, a conducting wire arranging step for arranging an end portion of the conducting wire at the core terminal portion, and irradiating the end portion of the conducting wire with laser light, A covering material removing step for removing a part of the covering material at the end of the wire, and a soldering step for soldering the end portion of the conducting wire to the core terminal portion.

好ましくは、被覆材除去工程は、レーザ光を導線の軸方向に照射する工程を含む。   Preferably, the covering material removing step includes a step of irradiating laser light in the axial direction of the conducting wire.

また、被覆材除去工程は、レーザ光を照射した後の被覆材の形状を有底溝形状とする工程を含むのが好ましい。   Moreover, it is preferable that a coating material removal process includes the process of making the shape of the coating material after irradiating a laser beam into a bottomed groove shape.

また、被覆材除去工程におけるレーザ光は、ＣＯ2レーザ光であるのが好ましい。 The laser beam in the covering material removing step is preferably a CO 2 laser beam.

さらには、被覆材除去工程よりも前において、コア端子部に、Ａｇからなる下地電極を形成する工程をさらに備えるのが好ましい。   Furthermore, it is preferable to further include a step of forming a base electrode made of Ag in the core terminal portion before the covering material removing step.

本発明は、はんだ付け工程の前において、予め導線の端部の被覆材の一部を除去する被覆材除去工程を設けている。これにより、はんだ付け工程において、被覆材の一部除去された箇所を起点として、被覆材の融解が促進される。その結果、被覆材を短時間で除去することができ、外部電極の形成のためのはんだ付け時間を短縮できる。   The present invention is provided with a covering material removing step for removing a part of the covering material at the end of the conductor in advance before the soldering step. Thereby, in the soldering process, melting of the coating material is promoted starting from a portion where the coating material is partially removed. As a result, the covering material can be removed in a short time, and the soldering time for forming the external electrode can be shortened.

巻線型コイル部品１の下鍔１４を上向きにした状態の斜視図である。It is a perspective view in the state where lower arm 14 of winding type coil component 1 was turned up. 導線２０の始端部２５Ａを第１のコア端子部１６Ａに配置する第１の導線配置工程を示した図である。It is the figure which showed the 1st conducting wire arrangement | positioning process which arrange | positions the starting end part 25A of the conducting wire 20 in the 1st core terminal part 16A. 導線２０をフェライトコア１１に巻回する巻線工程を示した図である。5 is a diagram showing a winding process for winding a conducting wire 20 around a ferrite core 11. FIG. 導線２０の終端部２５Ｂを第２のコア端子部１６Ｂに配置する第２の導線配置工程を示した図である。It is the figure which showed the 2nd conducting wire arrangement | positioning process which arrange | positions the termination | terminus part 25B of the conducting wire 20 in the 2nd core terminal part 16B. 導線２０の端部２５の被覆材２２の一部を除去する被覆材除去工程を示した図である。FIG. 6 is a view showing a covering material removing step for removing a part of the covering material 22 at the end portion 25 of the conducting wire 20. 図５に示した被覆材除去工程で用いられるレーザ加工装置４０の概略図である。It is the schematic of the laser processing apparatus 40 used at the coating | covering material removal process shown in FIG. 導線２０の端部２５をコア端子部１６に、はんだ付けするはんだ付け工程を示した図である。FIG. 5 is a diagram illustrating a soldering process in which an end portion 25 of a conducting wire 20 is soldered to the core terminal portion 16. 特許文献１に記載された巻線型コイル部品１０１のはんだ付け方法を示した図である。It is the figure which showed the soldering method of the winding type coil components 101 described in patent document 1. FIG.

図１に示すとおり、巻線型コイル部品１は、導線２０と、導線２０が巻回されるフェライトコア１１と、導線２０の端部２５を固定するためフェライトコア１１に設けられるコア端子部１６と、を有する。   As shown in FIG. 1, the wire-wound coil component 1 includes a conducting wire 20, a ferrite core 11 around which the conducting wire 20 is wound, and a core terminal portion 16 provided on the ferrite core 11 for fixing an end portion 25 of the conducting wire 20. Have.

導線２０は、導線本体２１と、導線本体２１の外周に被覆された被覆材２２と、により構成される（図５（Ｂ）参照）。導線本体２１の材質は、たとえばＣｕである。被覆材２２は絶縁材料であり、被覆材２２の材質としては、たとえば、ポリウレタン、ポリエステルなどが挙げられる。好ましくは、被覆材２２の材質は、後述するＣＯ2レーザ光Ｌの吸収率の高い材質とするのがよい。導体本体２１の径は、たとえば０．１２ｍｍである。被覆材２２の厚みは、たとえば０．０１ｍｍである。被覆材２２のさらに外周には、たとえばブチラール樹脂を含む融着材がさらに被覆されていてもよい。 The conducting wire 20 includes a conducting wire main body 21 and a covering material 22 coated on the outer periphery of the conducting wire main body 21 (see FIG. 5B). The material of the conductor main body 21 is, for example, Cu. The covering material 22 is an insulating material, and examples of the material of the covering material 22 include polyurethane and polyester. Preferably, the material of the covering material 22 is a material having a high absorptance of CO 2 laser light L described later. The diameter of the conductor body 21 is, for example, 0.12 mm. The thickness of the covering material 22 is, for example, 0.01 mm. The outer periphery of the covering material 22 may be further covered with, for example, a fusion material containing butyral resin.

なお、導線２０には始端部２５Ａと終端部２５Ｂとがあるが、単に、導線２０の端部２５と呼んだときは、導線２０の始端部２５Ａおよび終端部２５Ｂのどちらか一方、あるいは両方を指すものとする。   The conducting wire 20 has a starting end portion 25A and a terminating end portion 25B. However, when the conducting wire 20 is simply called the end portion 25 of the conducting wire 20, either or both of the starting end portion 25A and the terminating end portion 25B of the conducting wire 20 are connected. Shall point.

フェライトコア１１は、導線２０が直接巻回される巻胴１２と、巻胴１２の両端に配置される上鍔１３および下鍔１４と、により構成される。巻回された導線２０に電流が流れると、フェライトコア１１に磁束が発生する。   The ferrite core 11 includes a winding drum 12 around which the conductive wire 20 is directly wound, and an upper rod 13 and a lower rod 14 disposed at both ends of the winding drum 12. When a current flows through the wound conductive wire 20, a magnetic flux is generated in the ferrite core 11.

コア端子部１６には、第１のコア端子部１６Ａと、第２のコア端子部１６Ｂとがある。第１のコア端子部１６Ａおよび第２のコア端子部１６Ｂは、フェライトコア１１の下鍔１４側に間隔をあけて、並んで設けられる。第１のコア端子部１６Ａには、導線２０の始端部２５Ａがはんだ１７により固定される。第２のコア端子部１６Ｂには、導線２０の終端部２５Ｂがはんだ１７により固定される。このはんだ１７により、コア端子部１６に外部電極１９が形成される。なお、理解を容易にするため、図１では第１のコア端子部１６Ａのはんだ１７を除いた状態のものを図示している。この図で示すとおり、コア端子部１６には、はんだ１７が付着しやすいＡｇなどの下地電極１８が、予め形成されている。   The core terminal portion 16 includes a first core terminal portion 16A and a second core terminal portion 16B. The first core terminal portion 16 </ b> A and the second core terminal portion 16 </ b> B are provided side by side with a space on the lower collar 14 side of the ferrite core 11. The first end portion 25A of the conducting wire 20 is fixed to the first core terminal portion 16A with solder 17. A terminal portion 25B of the conducting wire 20 is fixed to the second core terminal portion 16B with solder 17. The solder 17 forms an external electrode 19 on the core terminal portion 16. For ease of understanding, FIG. 1 shows the first core terminal portion 16 </ b> A with the solder 17 removed. As shown in this figure, a base electrode 18 such as Ag to which the solder 17 easily adheres is formed in advance on the core terminal portion 16.

巻線型コイル部品１は、導線２０がフェライトコア１１の巻胴１２に巻回されるとともに、導線２０の端部２５がコア端子部１６に、はんだ付けされることにより製造される。はんだ付けする際の温度は、たとえば４００℃である。導線２０の端部２５の被覆材２２は、この温度状況において融解させられることにより除去される。これにより、導線本体２１と、はんだ１７とが電気的に接続される。ただし、被覆材２２を除去するためには所定の時間が必要となる。本実施形態は、はんだ付けに必要とする時間を短縮するため、はんだ付け前に、導線２０に対し処理を施す点に特徴がある。   The wire-wound coil component 1 is manufactured by winding the conductive wire 20 around the winding drum 12 of the ferrite core 11 and soldering the end portion 25 of the conductive wire 20 to the core terminal portion 16. The temperature at the time of soldering is 400 degreeC, for example. The covering material 22 at the end 25 of the conductor 20 is removed by being melted in this temperature state. Thereby, the conducting wire main body 21 and the solder 17 are electrically connected. However, a predetermined time is required to remove the covering material 22. The present embodiment is characterized in that the conductor 20 is treated before soldering in order to shorten the time required for soldering.

なお、以下において、フェライトコア１１の巻胴１２の軸線方向をＺ方向と呼び、Ｚ方向に直交し、かつ、コア端子部１６が並んで配置されている方向をＸ方向と呼び、Ｚ方向とＸ方向に直交する方向をＹ方向と呼ぶ。また、Ｚ方向を中心軸として回転する方向をθ方向と呼ぶ。   In the following, the axial direction of the winding drum 12 of the ferrite core 11 is referred to as the Z direction, and the direction orthogonal to the Z direction and in which the core terminal portions 16 are arranged side by side is referred to as the X direction. The direction orthogonal to the X direction is referred to as the Y direction. A direction rotating around the Z direction as a central axis is called a θ direction.

図２〜図７は、本実施形態に係る巻線型コイル部品１の製造方法を説明するための図である。巻線型コイル部品１の製造方法は、巻線工程と、導線配置工程と、被覆材除去工程と、はんだ付け工程と、を備える。なお、導線配置工程には、後述する第１の導線配置工程と第２の導線配置工程とがあるが、単に、導線配置工程と呼んだときは、第１の導線配置工程および第２の導線配置工程のどちらか一方、あるいは両方を指すものとする。   2-7 is a figure for demonstrating the manufacturing method of the winding type coil component 1 which concerns on this embodiment. The manufacturing method of the coiled coil component 1 includes a winding process, a conductor arrangement process, a covering material removing process, and a soldering process. In addition, although there exist the 1st conducting wire arrangement | positioning process and 2nd conducting wire arrangement | positioning process which are mentioned later in a conducting wire arrangement | positioning process, when it only calls a conducting wire arrangement | positioning process, the 1st conducting wire arrangement process and the 2nd conducting wire It shall refer to either or both of the placement steps.

図２に示す工程は、導線２０の始端部２５Ａを、第１のコア端子部１６Ａに配置する第１の導線配置工程である。まず、フェライトコア１１の上鍔１３をコアチャック３１により保持し、フェライトコア１１の巻胴１２の軸線方向（Ｚ方向）を水平に向ける。一方、導線２０を把持した導線チャック３４を、フェライトコア１１の下鍔１４より下方（図２において矢印Ｙ方向）へ移動させる。この移動により、導線２０が、導線ガイド３３を通って矢印Ｐ１の方向に引き出される。なお、導線２０は、図示しない線材供給装置から供給される。   The process shown in FIG. 2 is a first conductor arrangement process in which the starting end portion 25A of the conductor 20 is arranged on the first core terminal portion 16A. First, the upper collar 13 of the ferrite core 11 is held by the core chuck 31, and the axial direction (Z direction) of the winding drum 12 of the ferrite core 11 is oriented horizontally. On the other hand, the conducting wire chuck 34 holding the conducting wire 20 is moved downward (in the direction of arrow Y in FIG. 2) from the lower collar 14 of the ferrite core 11. By this movement, the conducting wire 20 is drawn through the conducting wire guide 33 in the direction of the arrow P1. The conducting wire 20 is supplied from a wire supply device (not shown).

次に、押圧棒３２を矢印Ｑの方向へ移動させる。これにより、導線２０を第１のコア端子部１６Ａに押し付けるとともに、フェライトコア１１をコアチャック３１と押圧棒３２との間に挟み込む。その後、導線チャック３４と第１のコア端子部１６Ａの間に延びている導線２０を、カット刃３５により切断する。この切断により、導線２０に始端部２５Ａが形成されるとともに、導線２０の始端部２５Ａが第１のコア端子部１６Ａに配置された状態となる。なお、導線２０の端部２５とは、巻胴１２に巻回されない部分であって、フェライトコア１１の下鍔１４に配置される部分のことであり、必ずしも導線２０の末端を含むという意味ではない。   Next, the pressing rod 32 is moved in the direction of arrow Q. Accordingly, the conductor 20 is pressed against the first core terminal portion 16 </ b> A, and the ferrite core 11 is sandwiched between the core chuck 31 and the pressing rod 32. Thereafter, the conductive wire 20 extending between the conductive wire chuck 34 and the first core terminal portion 16 </ b> A is cut by the cutting blade 35. By this cutting, the starting end portion 25A is formed in the conducting wire 20, and the starting end portion 25A of the conducting wire 20 is placed in the first core terminal portion 16A. The end portion 25 of the conducting wire 20 is a portion that is not wound around the winding drum 12 and is a portion that is disposed on the lower collar 14 of the ferrite core 11, and does not necessarily include the end of the conducting wire 20. Absent.

図３に示す工程は、導線２０をフェライトコア１１に巻回する巻線工程である。巻線工程では、コアチャック３１および押圧棒３２を、図示しない回転機構により矢印θの方向に回転させ、それに伴いフェライトコア１１も回転させる。一方、導線ガイド３３を、巻胴１２の下鍔１４側から上鍔１３側に向けて移動させる。これらの回転動作および移動動作により、導線２０が線材供給装置から矢印Ｐ２の方向に引き出されながら、整列された状態で巻胴１２に巻回される。   The process shown in FIG. 3 is a winding process in which the conducting wire 20 is wound around the ferrite core 11. In the winding process, the core chuck 31 and the pressing rod 32 are rotated in the direction of arrow θ by a rotation mechanism (not shown), and the ferrite core 11 is also rotated accordingly. On the other hand, the conducting wire guide 33 is moved from the lower collar 14 side to the upper collar 13 side of the winding drum 12. By these rotating operation and moving operation, the conducting wire 20 is wound around the winding drum 12 in an aligned state while being drawn out from the wire supply device in the direction of the arrow P2.

図４に示す工程は、導線２０の終端部２５Ｂを、第２のコア端子部１６Ｂに配置する第２の導線配置工程である。まず、押圧棒３２を下鍔１４と反対方向（矢印Ｑと反対方向）へ移動させることにより、押圧棒３２と下鍔１４との間に隙間を設ける。一方、導線ガイド３３と巻胴１２の間に延びている導線２０を、導線チャック３４により把持し、その後、導線チャック３４を下鍔１４より下方（図４において矢印Ｙ方向）へ移動させる。この移動により、導線２０が、導線ガイド３３を通って矢印Ｐ３の方向へ引き出される。   The process shown in FIG. 4 is a second conductor arrangement process in which the terminal portion 25B of the conductor 20 is arranged on the second core terminal portion 16B. First, a clearance is provided between the pressing rod 32 and the lower rod 14 by moving the pressing rod 32 in the direction opposite to the lower rod 14 (the direction opposite to the arrow Q). On the other hand, the conducting wire 20 extending between the conducting wire guide 33 and the winding drum 12 is gripped by the conducting wire chuck 34, and then the conducting wire chuck 34 is moved downward (in the arrow Y direction in FIG. 4) from the lower rod 14. By this movement, the conducting wire 20 is drawn out in the direction of the arrow P3 through the conducting wire guide 33.

次に、押圧棒３２を矢印Ｑの方向へ移動させることにより、導線２０を第２のコア端子部１６Ｂに押し付ける。その後、第２のコア端子部１６Ｂと導線チャック３４の間に延びている導線２０を、カット刃３５により切断する。この切断により、導線２０に終端部２５Ｂが形成されるとともに、導線２０の終端部２５Ｂが第２のコア端子部１６Ｂに配置された状態となる。なお、導線２０を切断するときは、必ずしも押圧棒３２により導線２０を押さえ付ける必要はない。   Next, the conductor 20 is pressed against the second core terminal portion 16B by moving the pressing rod 32 in the direction of the arrow Q. Thereafter, the conductive wire 20 extending between the second core terminal portion 16 </ b> B and the conductive wire chuck 34 is cut by the cutting blade 35. By this cutting, the terminal portion 25B is formed in the conductive wire 20, and the terminal portion 25B of the conductive wire 20 is disposed in the second core terminal portion 16B. When cutting the conductor 20, it is not always necessary to press the conductor 20 with the pressing rod 32.

図５（Ａ）に示す工程は、導線２０の端部２５の被覆材２２の一部を除去する被覆材除去工程である。被覆材２２の除去は、導線２０の始端部１５Ａおよび終端部２５Ｂのそれぞれに、レーザ光Ｌを照射することにより実行される。端部２５の被覆材２２の一部を予め除去することにより、後述するはんだ付け工程において、端部２５の被覆材２２の全体が除去されやすくなる。   The process shown in FIG. 5A is a covering material removing process for removing a part of the covering material 22 at the end 25 of the conducting wire 20. The removal of the covering material 22 is performed by irradiating the start end portion 15A and the end end portion 25B of the conducting wire 20 with the laser light L, respectively. By removing a part of the covering material 22 of the end portion 25 in advance, the entire covering material 22 of the end portion 25 is easily removed in a soldering process described later.

レーザ光Ｌは、導線２０の端部２５の軸線方向（図５（Ａ）においてＹ方向）に走査されながら照射される。これにより、被覆材２２は、導線２０の端部２５の軸線に沿ってほぼ直線状に除去される。被覆材２２の除去される体積は、端部２５における被覆材２２のうちの１／１０〜１／３である。照射されるレーザ光Ｌのスポット径は、たとえば０．１ｍｍであり、レーザ光Ｌの走査速度は、たとえば１００ｍｍ／秒である。   The laser beam L is irradiated while being scanned in the axial direction of the end portion 25 of the conducting wire 20 (Y direction in FIG. 5A). Thereby, the covering material 22 is removed substantially linearly along the axis of the end portion 25 of the conducting wire 20. The volume of the covering material 22 removed is 1/10 to 1/3 of the covering material 22 at the end portion 25. The spot diameter of the irradiated laser beam L is, for example, 0.1 mm, and the scanning speed of the laser beam L is, for example, 100 mm / second.

図６は、レーザ加工装置４０の概略図である。レーザの種類は、波長が９．３μｍのＣＯ2レーザである。レーザのパワーはたとえば２０Ｗである。 FIG. 6 is a schematic diagram of the laser processing apparatus 40. The type of laser is a CO 2 laser having a wavelength of 9.3 μm. The power of the laser is 20 W, for example.

レーザ加工装置４０において、フェライトコア１１は下鍔１４が上向きとなるように、コアチャック４１により保持される。コアチャック４１は図示しない直動テーブルに取り付けられ、図６においてＸ方向およびＹ方向に移動可能となっている。一方、レーザ発振器４２からはレーザ光Ｌが出力される。出力されたレーザ光Ｌはミラー４３により反射された後、レンズ４４により集光され、その後、導線２０の端部２５に照射される。なお、レーザ光Ｌの照射箇所には、ガス供給ノズル４５を設け、アシストガスを噴射するようにしてもよい。レーザ光Ｌの照射により除去された飛散物が発生する場合は、集塵ダクト４６により回収される。   In the laser processing apparatus 40, the ferrite core 11 is held by the core chuck 41 so that the lower flange 14 faces upward. The core chuck 41 is attached to a linear motion table (not shown) and is movable in the X direction and the Y direction in FIG. On the other hand, laser light L is output from the laser oscillator 42. The output laser light L is reflected by the mirror 43, then collected by the lens 44, and then irradiated to the end portion 25 of the conducting wire 20. It should be noted that a gas supply nozzle 45 may be provided at the location where the laser light L is irradiated to inject assist gas. When scattered matter removed by irradiation with the laser beam L is generated, it is collected by the dust collection duct 46.

なお、レーザ光Ｌは、図示しないガルバノミラー機構を用いることによりＸ方向およびＹ方向に走査されてもよい。また、導線２０の始端部２５Ａおよび終端部２５Ｂへのレーザ光Ｌの照射は、図示しない分光レンズを用いることにより、同時に実行されてもよい。   The laser beam L may be scanned in the X direction and the Y direction by using a galvanometer mirror mechanism (not shown). Moreover, irradiation of the laser beam L to the starting end portion 25A and the terminal end portion 25B of the conducting wire 20 may be performed simultaneously by using a spectroscopic lens (not shown).

ここで実際に、導線２０にＣＯ2レーザ光を照射すると、導線本体２１に被覆材２２の薄皮２４が残ることが確認されている。図５（Ｂ）および図５（Ｃ）は、ＣＯ2レーザ光が照射された状態の導線２０を示した図であり、図５（Ｂ）は、図５（Ａ）で示した破線Ｂの領域の断面を拡大した斜視図である。また、図５（Ｃ）は、図５（Ａ）におけるＹ１−Ｙ１断面図である。これらの図に示すように、被覆材２２は底まで貫通除去されるのでなく、有底溝２３形状となるように加工される。ポリウレタンを被覆材２２とした場合、有底溝２３の寸法は、たとえば、幅０．０５ｍｍ、深さ０．００９ｍｍとなり、有底溝２３の下側に残る薄皮２４の厚みは、たとえば０．００１ｍｍとなる。有底溝２３の幅がレーザ光Ｌのスポット径より小さくなるのは、スポット径の外周付近ではレーザのエネルギーが低下しており、除去加工するまでに至らないからである。 Here, it has been confirmed that when the lead wire 20 is actually irradiated with CO 2 laser light, the thin skin 24 of the covering material 22 remains on the lead wire main body 21. 5 (B) and 5 (C) are diagrams showing the conductive wire 20 in the state irradiated with the CO 2 laser light, and FIG. 5 (B) is a broken line B shown in FIG. 5 (A). It is the perspective view which expanded the cross section of the area | region. FIG. 5C is a cross-sectional view along Y1-Y1 in FIG. As shown in these drawings, the covering material 22 is not removed through to the bottom, but is processed into a bottomed groove 23 shape. When polyurethane is used as the covering material 22, the dimensions of the bottomed groove 23 are, for example, a width of 0.05 mm and a depth of 0.009 mm, and the thickness of the thin skin 24 remaining below the bottomed groove 23 is, for example, 0.001 mm. It becomes. The reason why the width of the bottomed groove 23 is smaller than the spot diameter of the laser beam L is that the energy of the laser is reduced near the outer periphery of the spot diameter, and the removal process is not completed.

薄皮２４が残ることに関しては、興味深い内容が参考文献（特開２００８−２３４９１７号公報）に記載されている。この参考文献によれば、被膜の厚みが１μｍ以下になるとＣＯ2レーザ光の９０％程度は被膜を透過し、また、透過したレーザ光はＣｕなどの導線本体の表面により９８％程度が反射されるため、結局、被膜にはレーザによる熱が伝わらず、１μｍ程度の被膜が残ることが記載されている。すなわち、ＣＯ2レーザでは被膜を完全に除去できない旨が記載されている。 As for the thin skin 24 remaining, an interesting content is described in a reference document (Japanese Patent Laid-Open No. 2008-234917). According to this reference, when the thickness of the coating is 1 μm or less, about 90% of the CO 2 laser beam is transmitted through the coating, and the transmitted laser beam is reflected by about 98% by the surface of the conductor body such as Cu. Therefore, it is described that the heat of the laser is not transmitted to the film, and a film of about 1 μm remains. That is, it is described that the coating cannot be completely removed with a CO 2 laser.

本実施形態においては、導線２０の端部２５の被覆材２２は、後述するはんだ付け工程にて全て除去されるので、薄皮２４程度であれば、導線本体２１に被覆材２２が残っても問題とならない。むしろ、被覆材２２の薄皮２４を残すことにより、はんだ付け工程に至るまでの間、導線本体２１の酸化や腐食が抑制される。したがって、レーザ光Ｌを照射した後の被覆材２２の形状が有底溝２３形状となるように意図的に加工している。   In this embodiment, since the covering material 22 at the end 25 of the conducting wire 20 is all removed in a soldering process to be described later, even if the covering material 22 remains on the conducting wire main body 21 as long as it is about a thin skin 24. Not. Rather, by leaving the thin skin 24 of the covering material 22, oxidation and corrosion of the conductor body 21 are suppressed until the soldering process. Therefore, the coating material 22 after being irradiated with the laser light L is intentionally processed so as to have the shape of the bottomed groove 23.

図７（Ａ）および図７（Ｂ）に示す工程は、導線２０の端部２５をコア端子部１６に、はんだ付けするはんだ付け工程である。まず、図７（Ａ）で示すように、フェライトコア１１をコアチャック５１で保持しながら下降させることにより、下鍔１４を、はんだ槽５２に浸漬する。はんだ槽５２内の溶融はんだ５３の温度は、たとえば４００℃に設定されている。この浸漬により、導線２０の端部２５の被覆材２２が、一部除去された箇所を起点として、融解し除去される。それとともに、溶融はんだ５３が下地電極１８の形成されたコア端子部１６に付着する。   The process shown in FIGS. 7A and 7B is a soldering process in which the end portion 25 of the conductive wire 20 is soldered to the core terminal portion 16. First, as shown in FIG. 7A, the lower iron 14 is immersed in the solder bath 52 by lowering the ferrite core 11 while being held by the core chuck 51. The temperature of the molten solder 53 in the solder bath 52 is set to 400 ° C., for example. By this immersion, the covering material 22 at the end portion 25 of the conducting wire 20 is melted and removed starting from the part where it is partially removed. At the same time, the molten solder 53 adheres to the core terminal portion 16 in which the base electrode 18 is formed.

次に、図７（Ｂ）で示すように、フェライトコア１１を矢印Ｒの方向へ上昇させることにより、コア端子部１６に付着した余剰の溶融はんだ５３を取り除く。その後、コア端子部１６に付着した溶融はんだ５３を固化させる。これにより、コア端子部１６において、導線２０の端部２５が、はんだ１７により固定され、外部電極１９が形成される。   Next, as shown in FIG. 7B, the ferrite core 11 is raised in the direction of the arrow R to remove excess molten solder 53 attached to the core terminal portion 16. Thereafter, the molten solder 53 attached to the core terminal portion 16 is solidified. Thereby, in the core terminal part 16, the edge part 25 of the conducting wire 20 is fixed by the solder 17, and the external electrode 19 is formed.

本実施形態では、はんだ付け工程の前において、予め導線２０の端部２５の被覆材２２の一部を除去する被覆材除去工程を設けている。これにより、はんだ付け工程において、被覆材２２の一部除去された箇所を起点として、被覆材２２の融解が促進される。その結果、被覆材２２を短時間で除去することができ、外部電極１９の形成におけるはんだ付け時間を短縮できる。   In the present embodiment, a covering material removing step for removing a part of the covering material 22 on the end portion 25 of the conducting wire 20 is provided in advance before the soldering step. Thereby, in the soldering process, melting of the covering material 22 is promoted starting from a portion where the covering material 22 is partially removed. As a result, the covering material 22 can be removed in a short time, and the soldering time in forming the external electrode 19 can be shortened.

また、導線２０の端部３５の被覆材２２が除去されやすくなれば、はんだ付け時の温度を低く設定することもできる。はんだ付け温度を低くすることにより、フェライトコア１１の熱ダメージを低減できる。さらに、巻胴１２に巻回された導線２０の被覆が、熱により溶け出すことを抑制できる。これにより、導線２０同士の短絡を抑制できる。   Further, if the covering material 22 on the end portion 35 of the conducting wire 20 is easily removed, the temperature during soldering can be set low. By reducing the soldering temperature, thermal damage to the ferrite core 11 can be reduced. Furthermore, it can suppress that the coating | cover of the conducting wire 20 wound by the winding drum 12 melt | dissolves with a heat | fever. Thereby, the short circuit of conducting wire 20 can be suppressed.

好ましくは、被覆材除去工程において、被覆材２２は、導線２０の軸方向に除去されるのがよい。これにより、はんだ付け工程において、被覆材２２がさらに剥がれやすくなる。その理由としては、溶融はんだ５３からの熱伝導により被覆材２２に熱収縮が起き、被覆材２２が軸方向に除去された箇所を起点として剥がれやすくなるからだと考えられる。   Preferably, in the covering material removing step, the covering material 22 is removed in the axial direction of the conducting wire 20. Thereby, in the soldering process, the covering material 22 is further easily peeled off. The reason is considered to be that the thermal contraction of the covering material 22 occurs due to the heat conduction from the molten solder 53, and the coating material 22 is easily peeled off starting from the place where the covering material 22 is removed in the axial direction.

また、被覆材除去工程において、レーザ光Ｌの照射により除去された後の被覆材２２の形状を、有底溝２３形状とするのが好ましい。有底溝２３形状とすることにより、導線本体２１に被覆材２２の薄皮２４が残るので、被覆材除去工程から、はんだ付け工程に至るまでの導線２０の酸化や腐食を抑制できる。   In the covering material removing step, it is preferable that the shape of the covering material 22 after being removed by the irradiation with the laser beam L is a bottomed groove 23 shape. By forming the bottomed groove 23 shape, the thin skin 24 of the coating material 22 remains in the conductive wire main body 21, so that oxidation and corrosion of the conductive wire 20 from the coating material removal process to the soldering process can be suppressed.

また、被覆材除去工程におけるレーザ光Ｌは、ＣＯ2レーザ光であるのが好ましい。ＣＯ2レーザ光を用いることにより、被覆材２２を容易に除去できるとともに、導線本体２１に被覆材２２の薄皮２４を残すことができる。これにより、効率的に有底溝２３形状を作製できる。 Moreover, it is preferable that the laser beam L in the covering material removing step is a CO 2 laser beam. By using the CO 2 laser beam, the covering material 22 can be easily removed, and the thin skin 24 of the covering material 22 can be left on the conductor main body 21. Thereby, the bottomed groove 23 shape can be produced efficiently.

さらには、被覆材除去工程よりも前において、コア端子部１６に、Ａｇからなる下地電極１８を形成する工程をさらに備えるのが好ましい。一般的に、導線２０の端部２５に当接している下地電極１８は、レーザ光Ｌが照射されることにより熱ダメージを受けやすい。しかし、下地電極１８がＡｇにより形成され、かつ、レーザ光ＬがＣＯ2レーザ光である場合は、下地電極１８へのレーザ光Ｌの吸収が抑制される。その結果、下地電極１８への熱ダメージも抑制される。 Furthermore, it is preferable to further include a step of forming the base electrode 18 made of Ag in the core terminal portion 16 before the covering material removing step. In general, the base electrode 18 that is in contact with the end portion 25 of the conductive wire 20 is easily damaged by being irradiated with the laser light L. However, when the base electrode 18 is formed of Ag and the laser light L is CO 2 laser light, absorption of the laser light L into the base electrode 18 is suppressed. As a result, thermal damage to the base electrode 18 is also suppressed.

本実施形態は、特許請求の範囲に記載された発明を限定するものでなく、技術的思想の同一性が認められる範囲で種々の変形が可能である。たとえば、導線２０の始端部２５Ａにおける被覆材２２の一部除去が、巻線工程の前に実行されてもよい。また、始端部２５Ａの被覆材２２の一部除去が先に行なわれていれば、導線２０の始端部２５Ａにおけるはんだ付けが、巻線工程の前に実行されてもよい。   The present embodiment is not intended to limit the invention described in the claims, and various modifications are possible within a range where the same technical idea is recognized. For example, partial removal of the covering material 22 at the starting end portion 25A of the conductive wire 20 may be performed before the winding process. If part of the covering material 22 of the starting end portion 25A is removed first, soldering at the starting end portion 25A of the conductive wire 20 may be performed before the winding process.

また、巻線型コイル部品１は、上鍔１３および下鍔１４の両方に、コア端子部１６が設けられたものであってもよい。   Further, the wire-wound coil component 1 may be one in which the core terminal portion 16 is provided on both the upper rod 13 and the lower rod 14.

１：巻線型コイル部品
１１：フェライトコア
１２：フェライトコア１１の巻胴
１３：フェライトコア１１の上鍔
１４：フェライトコア１１の下鍔
１６：コア端子部
１６Ａ：第１のコア端子部
１６Ｂ：第２のコア端子部
１７：はんだ
１８：下地電極
１９：外部電極
２０：導線
２１：導線本体
２２：被覆材
２３：被覆材２２の有底溝
２４：被覆材２２の薄皮
２５：導線２０の端部
２５Ａ：導線２０の始端部
２５Ｂ：導線２０の終端部
３１、４１、５１：コアチャック
３２：押圧棒
３３：導線ガイド
３４：導線チャック
３５：カット刃
４０：レーザ加工装置
４２：レーザ発振器
４３：ミラー
４４：レンズ
４５：ガス供給ノズル
４６：集塵ダクト
５２：はんだ槽
５３：溶融はんだ
Ｌ：レーザ光 1: Winding type coil component 11: Ferrite core 12: Winding body 13 of ferrite core 11: Upper collar 14 of ferrite core 11: Lower collar 16 of ferrite core 11: Core terminal portion 16A: First core terminal portion 16B: First 2 core terminal portion 17: solder 18: base electrode 19: external electrode 20: lead wire 21: lead wire main body 22: covering material 23: bottomed groove 24 of the covering material 22: thin skin 25 of the covering material 22: end of the lead wire 20 25A: Starting end portion 25B of the conducting wire 20: Terminating portions 31, 41, 51 of the conducting wire 20: Core chuck 32: Press rod 33: Conducting wire guide 34: Conducting wire chuck 35: Cutting blade 40: Laser processing device 42: Laser oscillator 43: Mirror 44: Lens 45: Gas supply nozzle 46: Dust collection duct 52: Solder tank 53: Molten solder L: Laser light

Claims (5)

外周に被覆材が被覆された導線と、前記導線が巻回されるフェライトコアと、前記導線の端部を固定するため前記フェライトコアに設けられるコア端子部と、を有する巻線型コイル部品の製造方法であって、
前記導線を前記フェライトコアに巻回する巻線工程と、
前記導線の端部を前記コア端子部に配置する導線配置工程と、
前記導線の端部にレーザ光を照射することにより、前記導線の端部の前記被覆材の一部を除去する被覆材除去工程と、
前記導線の端部を前記コア端子部に、はんだ付けするはんだ付け工程と、
を備えることを特徴とする巻線型コイル部品の製造方法。 Manufacture of a wound-type coil component having a conducting wire coated on the outer periphery, a ferrite core around which the conducting wire is wound, and a core terminal portion provided on the ferrite core for fixing an end portion of the conducting wire A method,
A winding step of winding the conductive wire around the ferrite core;
A conductor arrangement step of arranging an end of the conductor in the core terminal portion;
A covering material removing step of removing a part of the covering material at the end of the conducting wire by irradiating the end of the conducting wire with laser light;
A soldering step of soldering an end portion of the conducting wire to the core terminal portion;
A method for manufacturing a wire-wound coil component, comprising: 前記被覆材除去工程は、前記レーザ光を前記導線の軸方向に照射する工程を含むことを特徴とする請求項１に記載された巻線型コイル部品の製造方法。   The method for manufacturing a wound coil component according to claim 1, wherein the covering material removing step includes a step of irradiating the laser beam in an axial direction of the conducting wire. 前記被覆材除去工程は、前記レーザ光を照射した後の前記被覆材の形状を有底溝形状とする工程を含むことを特徴とする請求項１または２に記載された巻線型コイル部品の製造方法。   The said covering material removal process includes the process of making the shape of the said covering material after irradiating the said laser beam into the shape of a bottomed groove | channel, The manufacture of the winding type coil components described in Claim 1 or 2 characterized by the above-mentioned. Method. 前記被覆材除去工程における前記レーザ光は、ＣＯ2レーザ光であることを特徴とする請求項１ないし３のいずれか１項に記載された巻線型コイル部品の製造方法。 The method of manufacturing a wound coil component according to any one of claims 1 to 3, wherein the laser beam in the covering material removing step is a CO 2 laser beam. 前記被覆材除去工程よりも前において、前記コア端子部に、Ａｇからなる下地電極を形成する工程をさらに備えることを特徴とする請求項４に記載された巻線型コイル部品の製造方法。   5. The method for manufacturing a wound coil component according to claim 4, further comprising a step of forming a base electrode made of Ag on the core terminal portion before the covering material removing step.
JP2012231171A 2012-10-18 2012-10-18 Method of manufacturing wound coil component Pending JP2014082426A (en)

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CN201310484678.7A CN103779071A (en) 2012-10-18 2013-10-16 Manufacturing method for winding-type coil component

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