JPS6185162U - - Google Patents
Info
- Publication number
- JPS6185162U JPS6185162U JP17031984U JP17031984U JPS6185162U JP S6185162 U JPS6185162 U JP S6185162U JP 17031984 U JP17031984 U JP 17031984U JP 17031984 U JP17031984 U JP 17031984U JP S6185162 U JPS6185162 U JP S6185162U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- package body
- metal plate
- polymerized
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031984U JPS6185162U (sl) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17031984U JPS6185162U (sl) | 1984-11-12 | 1984-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185162U true JPS6185162U (sl) | 1986-06-04 |
Family
ID=30728025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17031984U Pending JPS6185162U (sl) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185162U (sl) |
-
1984
- 1984-11-12 JP JP17031984U patent/JPS6185162U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6185162U (sl) | ||
| JP2788011B2 (ja) | 半導体集積回路装置 | |
| JPH0373444U (sl) | ||
| JPS59164241U (ja) | セラミツクパツケ−ジ | |
| JPH0356144U (sl) | ||
| JPS6334275Y2 (sl) | ||
| JPH0279047U (sl) | ||
| JPH0343738U (sl) | ||
| JPH02131353U (sl) | ||
| JPH0267649U (sl) | ||
| JPS6138940U (ja) | マイクロ波半導体素子用パツケ−ジ | |
| JPH0178034U (sl) | ||
| JPS587345U (ja) | 半導体装置 | |
| JPS5822749U (ja) | 半導体素子用パツケ−ジ | |
| JPH0179843U (sl) | ||
| JPH0279046U (sl) | ||
| JPH03101524U (sl) | ||
| JPH0167759U (sl) | ||
| JPS60137439U (ja) | 気密封止パツケ−ジ | |
| JPS587342U (ja) | 電子機器素子のパツケ−ジ | |
| JPS61188360U (sl) | ||
| JPH01171036U (sl) | ||
| JPS5895050U (ja) | セラミツクパツケ−ジ形半導体装置 | |
| JPS594640U (ja) | 樹脂封止型半導体装置 | |
| JPH024261U (sl) |