JPH0167759U - - Google Patents
Info
- Publication number
- JPH0167759U JPH0167759U JP1987162993U JP16299387U JPH0167759U JP H0167759 U JPH0167759 U JP H0167759U JP 1987162993 U JP1987162993 U JP 1987162993U JP 16299387 U JP16299387 U JP 16299387U JP H0167759 U JPH0167759 U JP H0167759U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lid
- bonded
- metal
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162993U JPH0167759U (sl) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162993U JPH0167759U (sl) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167759U true JPH0167759U (sl) | 1989-05-01 |
Family
ID=31447319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162993U Pending JPH0167759U (sl) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167759U (sl) |
-
1987
- 1987-10-23 JP JP1987162993U patent/JPH0167759U/ja active Pending