JPS6185158U - - Google Patents
Info
- Publication number
- JPS6185158U JPS6185158U JP1984170889U JP17088984U JPS6185158U JP S6185158 U JPS6185158 U JP S6185158U JP 1984170889 U JP1984170889 U JP 1984170889U JP 17088984 U JP17088984 U JP 17088984U JP S6185158 U JPS6185158 U JP S6185158U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- flat heat
- melting point
- low melting
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170889U JPS6185158U (US20080293856A1-20081127-C00150.png) | 1984-11-09 | 1984-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170889U JPS6185158U (US20080293856A1-20081127-C00150.png) | 1984-11-09 | 1984-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185158U true JPS6185158U (US20080293856A1-20081127-C00150.png) | 1986-06-04 |
Family
ID=30728598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984170889U Pending JPS6185158U (US20080293856A1-20081127-C00150.png) | 1984-11-09 | 1984-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185158U (US20080293856A1-20081127-C00150.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE43341E1 (en) | 1995-06-07 | 2012-05-01 | Danisco A/S | Method of improving the properties of a flour dough, a flour dough improving composition and improved food products |
-
1984
- 1984-11-09 JP JP1984170889U patent/JPS6185158U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE43341E1 (en) | 1995-06-07 | 2012-05-01 | Danisco A/S | Method of improving the properties of a flour dough, a flour dough improving composition and improved food products |
