JPS6184511A - Simultaneous measurement of component ratio and film thickness of two-component alloy film - Google Patents
Simultaneous measurement of component ratio and film thickness of two-component alloy filmInfo
- Publication number
- JPS6184511A JPS6184511A JP20757884A JP20757884A JPS6184511A JP S6184511 A JPS6184511 A JP S6184511A JP 20757884 A JP20757884 A JP 20757884A JP 20757884 A JP20757884 A JP 20757884A JP S6184511 A JPS6184511 A JP S6184511A
- Authority
- JP
- Japan
- Prior art keywords
- ray
- metal
- alloy
- film thickness
- component ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
Abstract
Description
【発明の詳細な説明】
ａ、産業上の利用分野
本発明はケイ光Ｘ線を用いた穫厚計に関し、特に二成分
合金の取分比と膜厚のｆｌｆｆＪ時測定法時間定法もの
である。[Detailed Description of the Invention] a. Field of Industrial Application The present invention relates to a thickness meter using fluorescent X-rays, and in particular, it is a time-fixed method for measuring the fractional ratio and film thickness of a binary alloy. .
ｂ、従来技術
従来、二成分合金膜の成分比と膜厚の同時測定は厚さの
各々異なる５個以上の純粋の金属Ａの厚さを有する標準
試料と厚さの各々異なる５個以上の純粋の金属Ｂの厚さ
を有する標準試料と、ケイ光ｘ綜が飽和するに十分な厚
さ金もった５個以上の成分比を有する標準試料（以後、
成分比試料と記す。）の計９個の標準試料から放射され
る金属Ａ及び金属Ｂの各々のケイ光Ｘ線強度を測定し、
合金から放射されるケイ元Ｘ線強度を表わす（１）式及
び（３１式に上記Ｘ線強度を代入し、連立方程式を解く
ことに二って、（１）式及び（３）式中の未知定ｅを決
定し、未知合金試料の取分比及び１ＩｊＳ厚の同時測定
を（１）式及び（３）式を連立させることに工って、成
分比及び合金膜厚を求めていた。（１）式から（４）式
を示す。b. Prior art Conventionally, the simultaneous measurement of the component ratio and film thickness of a binary alloy film was carried out using a standard sample having five or more pure metal A thicknesses, each having a different thickness, and a standard sample having five or more thicknesses, each having a different thickness. A standard sample having a thickness of pure metal B and a standard sample having a ratio of five or more components with a thickness of gold sufficient to saturate the fluorescence x helix (hereinafter referred to as
This is referred to as a component ratio sample. ) Measure the fluorescence X-ray intensity of each of metal A and metal B emitted from a total of nine standard samples,
By substituting the above X-ray intensity into Equation (1) and Equation (31) expressing the silica X-ray intensity emitted from the alloy and solving the simultaneous equations, The unknown constant e was determined, and the component ratio and alloy film thickness were determined by simultaneous measurement of the fractional ratio and 1IjS thickness of the unknown alloy sample by combining equations (1) and (3). Equations (1) to (4) are shown below.
工Ａｘ （工Ａａ！１（ＷＡ）−エムｂｉ（１−ｅｘｐ
−（Ｗム＋（１−ＷＡ）／ｂ）エム（λＡ）ρ（ＷＡ）
・ｔ）十エムｂ ・・・・・・・・・・
・・＋１１工Ａ齢（ＷＡ）ｘａｗＡ（ｂＷａ＋１）十よ
り（λム） ・・・・・・・・・・・・（２）
工３ｍ（より１ｌｌｌ（ＷＡ）−よりｂ ） （１−ｅ
ｘｐ−（ＷＡ／１）’＋（１−ＷＡ ） ）μＢ（λＢ
）ρ（ＷＡ）・ｔ〕十よりｌ） ・・・・・
・・・・・・・（３）より６６（ＷＡ ）−ａ’ （１
−ＷＡ ）／（１＋ｂ’（１−ＷＡ））十より（λＢ
） ・（４）工＝（エーエｏ ） （１−６ｃｐ−（μ
ρＫ））十工０ ・・・・・・・・・・・・（５）
（１）式及び（３）式中の合金の密度は（６）式を用い
ている。Engineering Ax (Engineering Aa! 1 (WA) - M bi (1 - exp
-(W+(1-WA)/b)M(λA)ρ(WA)
・t) 10Mb ・・・・・・・・・・・・
...+11 engineering age (WA) xawA (bWa+1) from 10 (λmu) ......
3m (1lll(WA)-b) (1-e
xp-(WA/1)'+(1-WA))μB(λB
)ρ(WA)・t〕l from 10) ・・・・・・
・・・・・・・・・From (3), 66(WA )-a' (1
-WA )/(1+b'(1-WA)) from ten (λB
) ・(4) Engineering = (AE o ) (1-6cp-(μ
ρK)) Jukou 0 ・・・・・・・・・・・・(5)
For the density of the alloy in formulas (1) and (3), formula (6) is used.
ρ（ＷＡ）＝ρム・ＷＡ＋ρＢ（１−ＷＡ）
・・・・・・・・・・・・（６）ここで、（１）式及
び（２）式中の足叙ａ、ｂ、より（λム）は５個の成分
比試料の金属Ａのケイ元Ｘ線強度より求める定数である
。ＶＡは金属Ａの成分比、μＡ（λ＾）は金属Ａのケイ
光Ｘ線に対する金属Ａの吸収係数、エムｂはバックグラ
ウンドであ夛、ρ（ＷＡ）は合金の曽度で金属Ａの成分
比関数であり、ｔは合金膜の厚さく次元は（Ｌ’Ｍ’Ｔ
’））であり、エムは合金膜から放射される金属Ａのケ
イ元Ｘ線強度である。（３）弐及び（４）式中のｆｆ１
ｉ ａ’ 、 ｂ’ 、 より（λＢ）は３個の成分比
試料の金属Ｂのケイ光Ｘ線強度工す求める定数である。ρ(WA)=ρμ・WA+ρB(1−WA)
・・・・・・・・・・・・(6) Here, from the footnotes a and b in equations (1) and (2), (λum) is the metal A of the five component ratio samples. This is a constant determined from the x-ray intensity of ions. VA is the component ratio of metal A, μA (λ^) is the absorption coefficient of metal A for fluorescent X-rays, Mb is the background, and ρ (WA) is the strength of the alloy. It is a component ratio function, where t is the thickness of the alloy film and the dimension is (L'M'T
')), and Em is the intensity of silicon element X-rays of metal A emitted from the alloy film. (3) 2 and ff1 in formula (4)
From i a' , b' , (λB) is a constant that calculates the fluorescent X-ray intensity of metal B of the three component ratio samples.
μＢ（λＢ）は金属Ｂのケイ光Ｘ線に対する金属Ｂの吸
収係倣であＪ、Ｉｎｂはバックグラウンドであ）、より
は合金膜から放射される金属Ｂのケイ光Ｘ線強度であ
る。吸収係叙エム（λム）及びμ人（λＢ）は（５）式
を用いて、厚さの各々異なる６個以上の純粋の金属の厚
さを有する標準試料のＸ線強度を測定し、連立方程式を
解くことに工す算出できる。合金の密度は（６）式を用
いて計算を行っていた。μB (λB) is the absorption coefficient of metal B to the fluorescent X-rays of metal B (J, Inb is the background), and is the fluorescent X-ray intensity of metal B emitted from the alloy film. The absorption coefficients M (λ) and μ (λB) are measured by using equation (5) to measure the X-ray intensity of a standard sample having six or more pure metals with different thicknesses, You can use calculations to solve simultaneous equations. The density of the alloy was calculated using equation (6).
Ｃ１本発明が解決しょうとする問題点
従来の二成分合金膜の成分比と膜厚の同時測定法は取分
比と合金映厚（久冗（Ｌ’Ｍ’ Ｔ’ ））を同時に求
める際、合金の密度ρをρ＝ ｐ ＡＷＡ＋ρＢ （１
−ＷＡ）として求めてＧたが、この合金の密度を求める
（６）式では正しい合金の密度が求められない。そのデ
ータを表１に示す。C1 Problems to be solved by the present invention The conventional method for simultaneously measuring the component ratio and film thickness of a binary alloy film has problems when simultaneously determining the fractional ratio and alloy thickness (L'M'T'). , the density ρ of the alloy is ρ=p AWA+ρB (1
-WA), but the correct density of the alloy cannot be determined using equation (6) for determining the density of this alloy. The data are shown in Table 1.
表１． 密度計算の誤差（半田）
表１にある工うに（６）式から計算される合金の密度は
０〜５％の誤差をもつため、検量線の方程式（１）式（
３）式は誤差を含む。又、合金膜厚を求める場せ、合金
の成分比を正しく求めても、合金膜厚を求める際に（６
）式による合金密度を用いて計算するため計算１直に誤
差が含まれてしまう問題点があった。Table 1. Error in density calculation (solder) Since the alloy density calculated from equation (6) in Table 1 has an error of 0 to 5%, the calibration curve equation (1) equation (
3) Formula includes error. Also, when calculating the alloy film thickness, even if the alloy component ratio is calculated correctly, when calculating the alloy film thickness (6
) There was a problem in that an error was included in the first calculation because it was calculated using the alloy density according to the formula.
ｄ０問題点を解決するための手段
以上の問題点を解決するために合金膜の成分比と膜厚と
ケイ光Ｘ線強度の関係を示す（１）弐及び（３）式を各
々（７）式及び（８）式に改良する。又、合金の密度を
求める式（６）式を（９）式に改良する。Means for solving the d0 problem In order to solve the above problems, equations (1) and (3) showing the relationship between the component ratio, film thickness, and fluorescence X-ray intensity of the alloy film are respectively converted into (7). and (8). Also, the equation (6) for determining the density of the alloy is improved to the equation (9).
工Ａ＝ （ｘ ＡｐＯ（ＷＡ）−工Ａｂ） （１−ａｒ
ｐ−（ＷＡ＋（１−ＷＡ ）７ｂ）μＡ（λＡ）ｔ’）
十王Ａｔ） ・・・・・・・・・・・
・（７）より＝（工３ａ＋＋（ＷＡ）−よりｂ） （１
−ｅＸｐ−（ＷＡ／ｂ’＋（１−ＷＡ ） ）μＢ（λ
Ｂ）ｔ’）十よりｂ ・・・・・・・
・・・・・（８）ρ−ρ人ρＢ／（ＷムρＢ＋（１−Ｗ
Ａ）エム） ・・・・・・・・・・・
・＋９１ここで、ｔ′は合金膜厚（次元はＣＭ”Ｍ”
Ｔ’ ） ）である。Engineering A = (x ApO (WA) - Engineering Ab) (1-ar
p-(WA+(1-WA)7b)μA(λA)t')
Juoh At) ・・・・・・・・・・・・
・From (7)=(Eng.3a++(WA)−b) (1
-eXp-(WA/b'+(1-WA))μB(λ
B) t') b from ten...
...(8) ρ-ρperson ρB/(WmuρB+(1-W
A) M) ・・・・・・・・・・・・
・+91Here, t' is the alloy film thickness (the dimension is CM"M"
T')).
０６作用
＋１１式及び（３）式を各々（７）式及び（８）式に改
良することにニジ合金膜の成分比と合金膜厚とケイ光Ｘ
線強度の関係式中から密度計算式に起因する誤差を除去
することができ、工り精度の高い合金膜の成分比と合金
膜厚（次元はＣＬ−”Ｍ’ Ｔｏ） ）の同時測定がで
きる。又、密度計算式（９）式を用いることに工す、工
す正確な合金の密度を求めることができる。06 action + 11 formula and formula (3) are improved to formulas (7) and (8), respectively, and the component ratio of the rainbow alloy film, the alloy film thickness, and the fluorescence
Errors caused by the density calculation formula can be removed from the linear strength relational expression, and the component ratio and alloy film thickness (dimension is CL-"M'To) of the alloy film can be simultaneously measured with high processing accuracy. In addition, by using the density calculation formula (9), the accurate density of the alloy can be determined.
そのデータを表２に示す。The data are shown in Table 2.
表２． ぞ度計算結果
（７）式及び（８）式ｔ一連立させて求めた合金膜厚（
次元はＣＩ、−”Ｍ’Ｔ’） ） ’ｒｔ９１式で求め
た合金の正確な密度で割ることに工９直観性の良い正確
な合金膜厚（次元は（Ｌ’ Ｍ’ Ｔ’ ）に変換でき
る作用をもつ。Table 2. The alloy film thickness (
Dimensions are CI, -"M'T')) 'rt91 Dividing by the exact density of the alloy determines the intuitive and accurate alloy film thickness (dimensions are (L'M'T') It has the ability to convert.
ｆ、実施例
以下図面とともに本発明の好適な実死例について説明す
ると、第１歯は本発明のブロックダイヤグラムである。f. Example Hereinafter, a preferred example of the present invention will be described with reference to the drawings.The first tooth is a block diagram of the present invention.
図中、符号１で示されるものはＸ線管であり、ここニジ
放射される一次Ｘ線３がコリメータ２に工って収束され
試料台５上の合金模試利４に照射される。合金膜試料４
から発生する二次Ｘ線６（ケイ元Ｘ線）はＸ線検出器７
に工つてＸ線エネルギー及びＸ線強厩が検出され、その
電機信号がプリアンプ８及びリニアアップ８に二って増
幅され、増幅された電機信号が波高弁別器１０に工って
波胃弁別され、合金−から発生する金属Ａ及び金属Ｂの
各々のケイ光Ｘ！強度をＣＰＴＪｌｌに入力される。（
１！ＰＵ１１内では、（７）式、（８）式、（９）式１
９合金膜の成分比と膜厚の演′Ｓをし、その結果を表示
９１２に出力する。第２図は本発明のフローチャートで
ある。In the figure, the reference numeral 1 indicates an X-ray tube, and primary X-rays 3 emitted from the tube are focused by a collimator 2 and irradiated onto an alloy sample sample 4 on a sample stage 5. Alloy film sample 4
Secondary X-rays 6 (Si elemental X-rays) generated from the X-ray detector 7
X-ray energy and X-ray intensity are detected, the electrical signals thereof are amplified by a preamplifier 8 and a linear up 8, and the amplified electrical signals are sent to a pulse height discriminator 10 for wave-discrimination. , the fluorescence X of each of metal A and metal B generated from alloy -! The intensity is input to CPTJll. (
1! Within PU11, equations (7), (8), and (9) 1
The component ratio and film thickness of the 9 alloy film are calculated and the results are output on the display 912. FIG. 2 is a flow chart of the present invention.
ｇ０本発明の効果
本発明は合金膜の取分比と膜厚と該金属のケイ光Ｘ線強
度の関係を表わす演算式中工９誤差を含む項を削除し、
演算式の精度を向上させるとともに合金の密度を求める
正確な密度計算式を用いる事にＬυ合金映膜厚／（次元
（Ｌ−２ＭＩ Ｔ’ ） ）からせ全膜厚ｔ（次元（１
，Ｉ ＭＯＴＯ：ｌ ）への正確な変換ができるため、
工＃）精度の商い合金膜の成分比と膜厚の同時測定がで
きる効果がある。g0 Effects of the Present Invention The present invention eliminates the term containing the error in the calculation formula representing the relationship between the fractional ratio of the alloy film, the film thickness, and the fluorescence X-ray intensity of the metal, and
By improving the accuracy of the calculation formula and using an accurate density calculation formula for determining the density of the alloy, the total film thickness t (dimension (1
, I MOTO:l ),
TECHNOLOGY: It has the effect of being able to simultaneously measure the component ratio and film thickness of the alloy film due to its accuracy.
第１図は本発明の一実施例である。第２図は本発明を実
施するためのフローチャートである。。
（１）・・・Ｘ 線Ｍ ＋２＋−・・コリ
メータ（３）・・・−仄Ｘ線 （４）・・・合
金嗅試料（５）・・・試料台 （６）・・・
二次Ｘ線（７）・・・１球検出器 （８）・・・
プリアンプ（９）・・・リニアアップ αＦ・・波
高弁別器συ・・・ＣＰ Ｕ ｔ１２・・
・表示部巣二仄は本発明のフローチャートである。
以 上FIG. 1 shows an embodiment of the present invention. FIG. 2 is a flowchart for implementing the present invention. . (1)...X-ray M +2+-...collimator (3)...-dim X-ray (4)...alloy odor sample (5)...sample stand (6)...
Secondary X-ray (7)...One-ball detector (8)...
Preamplifier (9)...Linear up αF...Height discriminator συ...CP U t12...
- The second part of the display is a flowchart of the present invention. that's all
Claims (1)
れた試料から発生するケイ光Ｘ線を検出することによつ
て第１金属及び第２金属からなる二成分合金の成分比及
び膜厚を測定する方法において、第１金属及び第２金属
のケイ光Ｘ線強度をＸ線検出器で検出する工程と、厚さ
の各々異なる３個以上の純粋の第１金属の厚さを有する
標準試料のＸ線強度を測定する行程と厚さの各々異なる
３個以上の純粋の第２金属の厚さを有する標準試料のＸ
線強度を測定する工程と、ケイ光Ｘ線が飽和するに十分
な厚さをもつた３個の成分比（０％及び１００％の試料
を含む。）を有する標準試料のケイ光Ｘ線強度を測定し
検量線の方程式を決定する工程と、未知試料中の各金属
から放射されるケイ光Ｘ線強度を測定することにより二
成分合金の成分比と単位面積当りの重量を求める工程と
、合金の密度を第１金属及び第２金属の各密度より正し
く求める工程と、求めた合金密度より単位面積当りの重
量を通常の厚み単位へ変換する工程とによつて演算測定
することを特徴とする二成分合金膜の成分比と膜厚の同
時測定法。By detecting the fluorescent X-rays generated from the sample excited by the primary X-rays from the X-ray source installed in the main body, the composition ratio of the binary alloy consisting of the first metal and the second metal can be determined. The method for measuring film thickness includes the steps of: detecting the fluorescent X-ray intensities of the first metal and the second metal with an X-ray detector; and measuring the thickness of three or more pure first metals, each having a different thickness. The process of measuring the X-ray intensity of a standard sample having three or more pure second metals each having a different thickness
The process of measuring the ray intensity and the fluorescence X-ray intensity of a standard sample having three component ratios (including 0% and 100% samples) with a thickness sufficient to saturate the fluorescence X-rays. and determining the equation of the calibration curve; and determining the component ratio and weight per unit area of the binary alloy by measuring the fluorescent X-ray intensity emitted from each metal in the unknown sample. The density of the alloy is calculated and measured by a step of correctly determining the density of the first metal and a second metal, and a step of converting the weight per unit area from the determined alloy density into a normal thickness unit. A method for simultaneously measuring the component ratio and film thickness of a binary alloy film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20757884A JPS6184511A (en) | 1984-10-03 | 1984-10-03 | Simultaneous measurement of component ratio and film thickness of two-component alloy film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20757884A JPS6184511A (en) | 1984-10-03 | 1984-10-03 | Simultaneous measurement of component ratio and film thickness of two-component alloy film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6184511A true JPS6184511A (en) | 1986-04-30 |
Family
ID=16542073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20757884A Pending JPS6184511A (en) | 1984-10-03 | 1984-10-03 | Simultaneous measurement of component ratio and film thickness of two-component alloy film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6184511A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01219495A (en) * | 1988-02-29 | 1989-09-01 | Ishikawajima Harima Heavy Ind Co Ltd | Furnace bottom discharge method for melting furnace and device thereof |
| JPH0335149A (en) * | 1989-06-30 | 1991-02-15 | Nkk Corp | Method and instrument for measuring plating deposition and plating film composition of plated steel sheet |
| CN100409002C (en) * | 2001-08-07 | 2008-08-06 | 精工电子纳米科技术有限公司 | X-ray coating thickness device |
-
1984
- 1984-10-03 JP JP20757884A patent/JPS6184511A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01219495A (en) * | 1988-02-29 | 1989-09-01 | Ishikawajima Harima Heavy Ind Co Ltd | Furnace bottom discharge method for melting furnace and device thereof |
| JPH0335149A (en) * | 1989-06-30 | 1991-02-15 | Nkk Corp | Method and instrument for measuring plating deposition and plating film composition of plated steel sheet |
| CN100409002C (en) * | 2001-08-07 | 2008-08-06 | 精工电子纳米科技术有限公司 | X-ray coating thickness device |
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