JPS6184346A - ボンデイングワイヤ− - Google Patents

ボンデイングワイヤ−

Info

Publication number
JPS6184346A
JPS6184346A JP59204345A JP20434584A JPS6184346A JP S6184346 A JPS6184346 A JP S6184346A JP 59204345 A JP59204345 A JP 59204345A JP 20434584 A JP20434584 A JP 20434584A JP S6184346 A JPS6184346 A JP S6184346A
Authority
JP
Japan
Prior art keywords
wire
weight
bonding
ball
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59204345A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0425337B2 (enrdf_load_stackoverflow
Inventor
Hideto Yoshida
秀人 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP59204345A priority Critical patent/JPS6184346A/ja
Publication of JPS6184346A publication Critical patent/JPS6184346A/ja
Publication of JPH0425337B2 publication Critical patent/JPH0425337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59204345A 1984-09-28 1984-09-28 ボンデイングワイヤ− Granted JPS6184346A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204345A JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204345A JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Publications (2)

Publication Number Publication Date
JPS6184346A true JPS6184346A (ja) 1986-04-28
JPH0425337B2 JPH0425337B2 (enrdf_load_stackoverflow) 1992-04-30

Family

ID=16488964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204345A Granted JPS6184346A (ja) 1984-09-28 1984-09-28 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6184346A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284787A (ja) * 2006-03-24 2007-11-01 Nippon Steel Materials Co Ltd 半導体素子接続用金線

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284787A (ja) * 2006-03-24 2007-11-01 Nippon Steel Materials Co Ltd 半導体素子接続用金線
US8415797B2 (en) 2006-03-24 2013-04-09 Nippon Steel & Sumikin Materials Co., Ltd. Gold wire for semiconductor element connection

Also Published As

Publication number Publication date
JPH0425337B2 (enrdf_load_stackoverflow) 1992-04-30

Similar Documents

Publication Publication Date Title
JPS62278241A (ja) ボンデイングワイヤ
US5989364A (en) Gold-alloy bonding wire
JPS6179741A (ja) ボンデイングワイヤ−
JP3579493B2 (ja) 半導体素子用金合金細線
JPH10275820A (ja) 半導体素子ボンディング用金合金線
JPS6184346A (ja) ボンデイングワイヤ−
JPS6223455B2 (enrdf_load_stackoverflow)
JPS6222451B2 (enrdf_load_stackoverflow)
JPS63238232A (ja) 銅細線とその製造法
JPH07335686A (ja) ボンディング用金合金細線
JPS6223454B2 (enrdf_load_stackoverflow)
US5491034A (en) Bonding wire for semiconductor element
JP2621288B2 (ja) 半導体素子ボンディング用Ａｕ合金極細線
JPS62290836A (ja) 半導体素子のボンデイング用金線
JPH02250934A (ja) 半導体素子ボンディング用Ａｕ合金極細線
JPS61110735A (ja) 耐熱性に優れた金合金
JP3426473B2 (ja) 半導体素子用金合金細線
JP2766706B2 (ja) ボンデイングワイヤー
JP3059314B2 (ja) ボンディング用金合金細線
JPH04146630A (ja) ボンデイングワイヤー
JP3639662B2 (ja) 半導体素子用金合金細線
JPH0131691B2 (enrdf_load_stackoverflow)
JPH059624A (ja) ボンデイングワイヤー
JP3615901B2 (ja) 半導体素子ボンディング用金合金線
JP3346871B2 (ja) 半導体素子用金合金

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees