JPS6183693A - Manufacture of metallized powder for ceramics - Google Patents

Manufacture of metallized powder for ceramics

Info

Publication number
JPS6183693A
JPS6183693A JP20109584A JP20109584A JPS6183693A JP S6183693 A JPS6183693 A JP S6183693A JP 20109584 A JP20109584 A JP 20109584A JP 20109584 A JP20109584 A JP 20109584A JP S6183693 A JPS6183693 A JP S6183693A
Authority
JP
Japan
Prior art keywords
powder
parts
weight
solvent
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20109584A
Other languages
Japanese (ja)
Inventor
堀部 芳幸
宮 好宏
上山 守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP20109584A priority Critical patent/JPS6183693A/en
Publication of JPS6183693A publication Critical patent/JPS6183693A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Compositions Of Oxide Ceramics (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は緻密でセラミックスとの接着強度が高く、かつ
表面平滑な金属化層を提供するセラミックス用メタライ
ズ粉体の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for producing metallized powder for ceramics that provides a metallized layer that is dense, has high adhesive strength to ceramics, and has a smooth surface.

半導体集積回路用基板、電子回路用基板等に用いられる
セラミック基板の表面に微細な配線を形成又は各種部品
をとりつけるためには、セラミックスとの接着強度が高
く、緻密で表面平滑な金属化層が必要である。
In order to form fine wiring or attach various parts to the surface of ceramic substrates used for semiconductor integrated circuit boards, electronic circuit boards, etc., a metallized layer with high adhesion strength to the ceramic and a dense and smooth surface is required. is necessary.

(従来技術とその問題点) このような金属化層の形成法としては、従来からMO+
 Mo −FJH金属化法、W金属化法、Ag。
(Prior art and its problems) As a method of forming such a metallized layer, MO+
Mo-FJH metallization method, W metallization method, Ag.

Pd 、 Au  等の貴金属粉末とガラス粉とを混合
した厚膜ペーストを用いる厚膜法などがある。これらの
方法では、 Mo 、 W 、 Ag 、 P d 、
 Au等の金属粉末にMn、ガラス粉等の無機結合剤粉
末、有機結合剤及び溶剤を添加し、らいかい機や三本ロ
ールミルでペースト化して用いるのが一般的である。
There is a thick film method using a thick film paste made by mixing noble metal powder such as Pd or Au with glass powder. In these methods, Mo, W, Ag, Pd,
It is common to add Mn, an inorganic binder powder such as glass powder, an organic binder, and a solvent to a metal powder such as Au, and use the mixture as a paste using a milling machine or a three-roll mill.

しかしペースト化は高粘度の条件下で行なわれるため、
凝集した粉末を十分に一次粒子化することが困難であり
、また、金属粉末と硬さや比重9粒径の異なる無機結合
剤粉末との均一な混合分散も得難い。このような混合分
散の不十分なペーストを用いて金属化層を形成した場合
、緻密で表面平滑な金属化層が得られず、また接着強度
も低く。
However, since pasting is done under high viscosity conditions,
It is difficult to sufficiently convert the aggregated powder into primary particles, and it is also difficult to obtain uniform mixing and dispersion of the metal powder and the inorganic binder powder having different hardness and specific gravity 9 particle size. If a metallized layer is formed using such a paste with insufficient mixing and dispersion, a metallized layer that is dense and has a smooth surface cannot be obtained, and the adhesive strength is also low.

ばらつきも大きくなるという欠点があった。There was a drawback that the variation also increased.

(発明の目的) 本発明の目的は上記した従来技術の欠点を解消し1金属
粉末及び無機結合剤粉末を有機結合剤溶液中で単一粒子
にまで十分に解粒し、これらの粉末を均一分散させたセ
ラミックス用メタライズ粉体の製造方法を提供するもの
である。
(Objective of the Invention) The object of the present invention is to solve the above-mentioned drawbacks of the prior art. 1) Metal powder and inorganic binder powder are thoroughly disintegrated into single particles in an organic binder solution, and these powders are uniformly disintegrated. The present invention provides a method for producing dispersed metallized powder for ceramics.

(発明の構成) 本発明は、金属粉末、無機結合剤粉末、有機結合剤及び
溶剤を混合するセラミックス用メタライズ粉体の製造方
法に1、金属粉木無機結合剤粉末、有機結合剤及び溶剤
を混合した混合物の粘度が、金属粉末及び無機結合剤粉
末の解粒を妨げない程度以下で、かつ解粒した粒子が直
接接触するのを妨げる量の有機結合剤を添加、混合して
金属粉末及び無機結合剤粉末が単一粒子になるまで解粒
し、その後溶剤を除去して金属粉末及び無機結合剤粉末
の表面を有機結合剤で被覆するセラミックス用メタライ
ズ粉体の製造方法に関する。
(Structure of the Invention) The present invention provides a method for producing metallized powder for ceramics, which involves mixing metal powder, inorganic binder powder, organic binder, and solvent. The viscosity of the mixed mixture is below the level that does not prevent disintegration of the metal powder and inorganic binder powder, and an amount of organic binder is added and mixed to prevent the disintegrated particles from coming into direct contact with each other. The present invention relates to a method for producing metallized powder for ceramics, which comprises disintegrating inorganic binder powder into single particles, removing the solvent, and coating the surfaces of the metal powder and inorganic binder powder with an organic binder.

本発明に1、金属粉末とし7ては+ Mo、 W等の高
融点金属粉、 Ag 、 Pd 、 Au等の貴金属粉
In the present invention, 1. The metal powder 7 is a high melting point metal powder such as Mo or W, or a noble metal powder such as Ag, Pd or Au.

Cu、 Ni等の卑金属粉などが用いられ特に制限はな
いが、Mo、W等の比較的硬く延性の小さい高融点金属
粉を用いるのが好ましい。また無機結合剤粉末としては
、 Mn粉末、アルミナ、シリカ、マグネシア、カルシ
ア等の酸化物やこれら酸化物の一種又は二種以上からな
るガラス粉末、はう硅酸系。
Powders of base metals such as Cu and Ni are used, and there are no particular restrictions, but it is preferable to use powders of relatively hard and low-ductility high-melting metals such as Mo and W. Inorganic binder powders include Mn powder, oxides such as alumina, silica, magnesia, and calcia, glass powders made of one or more of these oxides, and silicic acid-based powders.

亜鉛−鉛系ガラスであっても良く特に制限はなく。Zinc-lead glass may be used without any particular limitation.

用いる金属粉の種類及び金属化層全形成するセラミック
スの種類に応じて選定すれば良い。
The selection may be made depending on the type of metal powder used and the type of ceramic used to form the entire metallized layer.

本発明において有機結合剤としては、エチルセルロース
、ニトロセルロース、アクリル樹ML ”チラール樹脂
等が用いられ、さらに必要に応じてフタル酸エステル、
トリエチレングリコール等の可塑剤を加えても良い。溶
剤としては酢酸エチル。
In the present invention, as the organic binder, ethyl cellulose, nitrocellulose, acrylic resin ML "tyral resin, etc. are used, and if necessary, phthalate ester,
A plasticizer such as triethylene glycol may also be added. Ethyl acetate as the solvent.

酢酸ブチル、トリクロールエチレン、トルエン。Butyl acetate, trichlorethylene, toluene.

キシレン、メチルエチルケトン、エタノール、メタノー
ル等の一種又は二種以上の混合溶剤が用いられる。
One or more mixed solvents such as xylene, methyl ethyl ketone, ethanol, and methanol are used.

金属粉末、無機結合剤粉末、有機結合剤及び溶剤を混合
した混合物の粘度は、最大20P(ボイズ)であること
が好ましく、IP〜5Pの範囲であればさらに好ましい
。また有機結合剤の添加量は、金属粉末100重量部に
対し0.5〜6重量部でちることが好ましく、1.0〜
4.0重量部であればさら0・ζ好ましい。
The viscosity of the mixture of metal powder, inorganic binder powder, organic binder, and solvent is preferably 20P (voids) at maximum, and more preferably in the range of IP to 5P. The amount of organic binder added is preferably 0.5 to 6 parts by weight, and 1.0 to 6 parts by weight per 100 parts by weight of metal powder.
If it is 4.0 parts by weight, it is more preferable.

(実施例) 以下実施例により本発明を説明する。(Example) The present invention will be explained below with reference to Examples.

実施例1 金属粉末として平均粒径0,63μInのMo粉末10
0重量部に対し、無機結合剤粉末として平均粒径1.5
μmのMn粉末1.0重量部及びアルミナ。
Example 1 Mo powder 10 with an average particle size of 0.63μIn as metal powder
0 parts by weight, average particle size 1.5 as inorganic binder powder
1.0 parts by weight of μm Mn powder and alumina.

シリカ、マグネンア、カルンアから成るガラス粉末3.
0重量部、有機結合剤として、エチルセルロース2重量
部及びニトロ七ルロース2重量部、溶剤として酢酸エチ
ルとトルエンの1:1の混合溶剤を200重址片部量し
、これらtボールミルにて200時間混して金属粉末及
び無(幾結合剤粉末を単一粒子にまで十分解粒し、均一
:・τ分散した粘度が2,5Pのスラリーを得t0次て
前記スラリーをらいかい機で、加熱混合しながら乾燥し
、溶剤を除去してセラミック用メタライズ粉体を得た。
Glass powder consisting of silica, magneua and karunua3.
0 parts by weight, 2 parts by weight of ethyl cellulose and 2 parts by weight of nitroheptylulose as an organic binder, and 200 parts of a 1:1 mixed solvent of ethyl acetate and toluene as a solvent, and these were heated in a T-ball mill for 20 hours. The metal powder and the binder powder are thoroughly disintegrated into single particles to obtain a uniformly dispersed slurry with a viscosity of 2.5 P. Next, the slurry is heated in a sieve machine. The mixture was dried while being mixed, and the solvent was removed to obtain a metallized powder for ceramics.

△ 次に上記で得たセラミック用メタライズ粉体△ 108重量部に対し、溶剤としてテルピネオールf 4
 0重量部添加し,らいかい機にて2時間混合後,三本
ロールミルにてペースト化した。得られたペーストをS
iC基板(日立製作新製,商品名SC−101)上にス
クリーン印刷し,ついで弱還元雰囲気中で1300℃で
焼成し, SiC基板上に金属化層を形成した。得られ
た金属化層の表面粗さは3.0μmRzで, 8iC基
板との接着強度は4、 0 kg f /nIDT2以
上であった。
△ Next, terpineol f 4 was added as a solvent to 108 parts by weight of the ceramic metallized powder △ obtained above.
After adding 0 parts by weight, the mixture was mixed for 2 hours using a mulch mill, and then made into a paste using a three-roll mill. The paste obtained is S
Screen printing was performed on an iC substrate (manufactured by Hitachi Seisakusho, trade name: SC-101), and then baked at 1300° C. in a weakly reducing atmosphere to form a metallized layer on the SiC substrate. The surface roughness of the obtained metallized layer was 3.0 μmRz, and the adhesive strength with the 8iC substrate was 4.0 kg f /nIDT2 or more.

これに対し比較例として前記実施例1で使用したMo粉
末100重量部すて対して,前記実施例1で使用したM
n粉末及びガラス粉末をそれぞれ1重量部,3重量部,
有機結合剤としてエチルセルロース2重量部及びニトロ
セルロース2重η・部,溶剤としてテルピネオール40
重量部を秤部し,こねらをらいかい機で5時間混合した
だけで金属粉末及び無機結合剤粉末を単一粒子に渣で解
粒しない状態で三本ロールミルにてペースト化した。得
られたペーストを用い前記実施例1と同様の工程を経て
SiC基板(日立製作新製、商品名5C−101>上に
金属化層を形成した。得られた金属化層の表面粗さは6
μmRzと粗<、SiC基板との接着強度はZOkgf
/−と前記実施例1に比べ低く、ばらつきも大きいもの
であった。
On the other hand, as a comparative example, 100 parts by weight of the Mo powder used in Example 1,
1 part by weight and 3 parts by weight of n powder and glass powder, respectively.
2 parts by weight of ethyl cellulose and 2 parts by weight of nitrocellulose as organic binders, 40 parts of terpineol as a solvent
Parts by weight were weighed, the dough was mixed for 5 hours using a sieve machine, and then the metal powder and the inorganic binder powder were made into a paste using a three-roll mill without being disintegrated into single particles. Using the obtained paste, a metallized layer was formed on a SiC substrate (manufactured by Hitachi Seisakusho, trade name 5C-101) through the same steps as in Example 1. The surface roughness of the obtained metallized layer was 6
The adhesive strength between μmRz and rough<, SiC substrate is ZOkgf
/-, which was lower than that of Example 1, and the variation was large.

実施例2 金属粉末として平均粒径1.2重m(DW粉末100重
量部に対し、無機結合剤粉末として実施例1で使用した
ガラス粉末1.0重量部、有機結合剤としてエチルセル
ロース13i量部及びニトロセルロース1重量部、溶剤
として酢酸エチルとトルエンのを 1:1の混合溶剤150X量部秤量し、これらを△ 実施例1と同様の方法で混合、解粒し、均一に分散した
粘度が4.0 Pのスラリーを得た。次に前記スラリー
を実施例1と同様の方法で乾燥しセラミ入 ツタ用メタライズ粉体を得た。
Example 2 Average particle size as metal powder: 1.2 parts by weight (100 parts by weight of DW powder, 1.0 parts by weight of the glass powder used in Example 1 as inorganic binder powder, 13 parts by weight of ethyl cellulose as organic binder) Weighed out 1 part by weight of nitrocellulose and 150x parts of a 1:1 mixed solvent of ethyl acetate and toluene as a solvent, and mixed and disintegrated them in the same manner as in Example 1 to obtain a uniformly dispersed viscosity. A slurry of 4.0 P was obtained. Next, the slurry was dried in the same manner as in Example 1 to obtain a ceramic-containing metallized powder for ivy.

八 及 さらに上記で得たセラミック用メメライズ粉体△ 102重量部に対し、溶剤としてテルピネオール3si
n部添加し実施例1と同様の方法でペースト化した。
Furthermore, to 102 parts by weight of the memerize powder for ceramics obtained above, 3si of terpineol was added as a solvent.
A paste was prepared in the same manner as in Example 1 by adding n parts.

一方、アルミナ96:を置部、焼結助剤としてマグネシ
ア粉末1.5重量部、シリカ2,5重*を部、有機結合
剤としてブチラール樹脂6型址部、可塑剤としてブチル
ベンジルフタレート3重量部及び溶剤としてエタノール
とトリクロルエチレ:、’とo共沸混合物40重量部を
加え、ボールミルにて24時間混合を行なった後、テー
プキャスティング法により、セラミックグリーンシート
を得た。
On the other hand, alumina 96: was placed, 1.5 parts by weight of magnesia powder as a sintering aid, 2.5 parts by weight of silica, 6 parts of butyral resin as an organic binder, and 3 parts by weight of butylbenzyl phthalate as a plasticizer. 40 parts by weight of an azeotrope of ethanol and trichlorethylene:,' and o were added as a solvent and mixed in a ball mill for 24 hours, followed by tape casting to obtain a ceramic green sheet.

得られたセラミックグリーンシート上に上記で得たペー
ストを印刷し1弱還元雰囲気中で1,540℃で焼成し
、アルミナセラミックス上に金属化層を形成した。得ら
れた金属化層の表面粗さは′2.5μmHzで、アルミ
ナセラミックスとの接着強度は7、0 kg f /m
m”以上であった。
The paste obtained above was printed on the obtained ceramic green sheet and fired at 1,540° C. in a slightly reducing atmosphere to form a metallized layer on the alumina ceramics. The surface roughness of the obtained metallized layer was 2.5 μmHz, and the adhesive strength with the alumina ceramic was 7.0 kg f /m.
m” or more.

これに対し比較例として前記実施例2で使用したW粉末
100重量部に対して、実施例1で使用したガラス粉末
1型督部、有機結合剤としてエチルセルロース1重量部
、ニトロセルロース11部及び溶剤としてテルピネオー
ル351且部を秤量し、これらをらいかい機で5時間混
合しただけで金属粉末及び無機結合剤粉末を単一粒子に
まで解粒しない状態で三本ロールにてペースト化した。
On the other hand, as a comparative example, for 100 parts by weight of the W powder used in Example 2, the glass powder type 1 part used in Example 1, 1 part by weight of ethyl cellulose as an organic binder, 11 parts of nitrocellulose and a solvent were added. 351 parts of terpineol was weighed out and mixed in a sieve machine for 5 hours, and the metal powder and inorganic binder powder were made into a paste with three rolls without being granulated into single particles.

得られたペーストを前記実施例2と同様の工程を経てア
ルミナセラミックス上に金属化層を形成した。得られた
金属化層の表面粗さは7μmRzと粗く、アルミナセラ
ミックスとの接着強度も2.5に9f/m[lI2と低
く、ばらつきも大きいものであった。
The obtained paste was subjected to the same steps as in Example 2 to form a metallized layer on alumina ceramics. The surface roughness of the obtained metallized layer was as rough as 7 μmRz, and the adhesive strength with the alumina ceramic was as low as 2.5 to 9 f/m[lI2, with large variations.

なお本発明の実施例ではボールミルにて混合したものに
ついて説明したが、らいかい機その他の混合法等によっ
ても同様の効果が得られる。
In the embodiments of the present invention, the mixture was explained using a ball mill, but the same effect can be obtained by using a miller or other mixing method.

(発明の効果) 本発明は金属粉末、無機結合剤粉末、有機結合剤及び溶
剤を混合した混合物の粘度が、金属粉末及び無機結合剤
粉末の解粒を妨げない程度以下で。
(Effects of the Invention) According to the present invention, the viscosity of the mixture of metal powder, inorganic binder powder, organic binder and solvent is below a level that does not hinder the disintegration of the metal powder and inorganic binder powder.

かつ解粒した粒子が直接接触するのを妨げる址の有機結
合剤を添加、混合して金属粉末及び無機結合剤粉末が単
一粒子になるまで解粒し、その後溶剤を除去して、金属
粉末及び無機結合剤粉末の表面を有機結合剤で被覆する
ので、緻密でセラミックスとの接着強度が高く、かつ表
面平滑な金属化層を提供するセラミックス用メタライズ
粉体を製造することができる。
Add and mix an organic binder that prevents the disintegrated particles from coming into direct contact, disintegrate the metal powder and inorganic binder powder until they become single particles, and then remove the solvent to form the metal powder. Since the surface of the inorganic binder powder is coated with an organic binder, it is possible to produce a metallized powder for ceramics that is dense, has high adhesive strength to ceramics, and provides a metalized layer with a smooth surface.

工9可j4> 代理人 弁理士 若 林 邦 彦s、−X−j9・・]
・−1;号1゛
Engineering 9 possible j4> Agent Patent attorney Kunihiko Wakabayashi, -X-j9...]
・-1; No. 1゛

Claims (1)

【特許請求の範囲】[Claims] 1、金属粉末、無機結合剤粉末、有機結合剤及び溶剤を
混合するセラミックス用メタライズ粉体の製造方法にお
いて、金属粉末、無機結合剤粉末、有機結合剤及び溶剤
を混合した混合物の粘度が、金属粉末及び無機結合剤粉
末の解粒を妨げない程度以下で、かつ解粒した粒子が直
接接触するのを妨げる量の有機結合剤を添加、混合して
金属粉末及び無機結合剤粉末が単一粒子になるまで解粒
し、その後溶剤を除去して、金属粉末及び無機結合剤粉
末の表面を有機結合剤で被覆することを特徴とするセラ
ミックス用メタライズ粉体の製造方法。
1. In a method for producing metallized powder for ceramics in which metal powder, inorganic binder powder, organic binder and solvent are mixed, the viscosity of the mixture of metal powder, inorganic binder powder, organic binder and solvent is The metal powder and inorganic binder powder are made into single particles by adding and mixing an amount of organic binder that does not interfere with the disintegration of the powder and the inorganic binder powder, and in an amount that prevents direct contact between the disintegrated particles. 1. A method for producing metallized powder for ceramics, which comprises disintegrating the powder until it becomes granulated, then removing the solvent, and coating the surfaces of the metal powder and inorganic binder powder with an organic binder.
JP20109584A 1984-09-26 1984-09-26 Manufacture of metallized powder for ceramics Pending JPS6183693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20109584A JPS6183693A (en) 1984-09-26 1984-09-26 Manufacture of metallized powder for ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20109584A JPS6183693A (en) 1984-09-26 1984-09-26 Manufacture of metallized powder for ceramics

Publications (1)

Publication Number Publication Date
JPS6183693A true JPS6183693A (en) 1986-04-28

Family

ID=16435311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20109584A Pending JPS6183693A (en) 1984-09-26 1984-09-26 Manufacture of metallized powder for ceramics

Country Status (1)

Country Link
JP (1) JPS6183693A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206377A (en) * 1987-02-19 1988-08-25 株式会社東芝 Aluminum nitride sintered body and manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63206377A (en) * 1987-02-19 1988-08-25 株式会社東芝 Aluminum nitride sintered body and manufacture

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