JPS6183684A - Method of bonding ceramic and metal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for joining different types of ceramics, and more particularly, to a method for joining different types of ceramics suitable for mechanical structural parts of electronic equipment 2 and the like.

[Background of the invention]

The same methods used for joining ceramics and metals are used to join ceramics together: (1) forming a thin film of Nt, Au, etc. on the ceramic surface and then soldering; (2) organic adhesion. (3) A method in which an oxidizing metal is interposed on the ceramic surface, and the like are known. However, (1) not only has low heat resistance, but also has low reliability because the bonding strength is controlled by the adhesion of the thin film to the ceramic. (2) is the cheapest joining method, but has the disadvantage of significantly lower reliability. (3
) requires strict atmosphere control and high-temperature heating for metallization, and has drawbacks such as reduced bonding strength due to thermal stress when bonded to ceramics with different expansion coefficients.

[Purpose of the invention]

An object of the present invention is to provide a method for joining dissimilar ceramics that eliminates the problems of the prior art, does not require metallization treatment, and can obtain a highly reliable joined body by keeping the joining temperature low. There is a particular thing.

[Summary of the invention]

In the method for joining dissimilar ceramics according to the present invention, the fused portion of the Al-Si alloy is formed of Sin2. Zr, 02°S i
C, Si, N4 + Al, 0. , BaTi
Focusing on the fact that it reacts with almost all ceramics such as 0, and that the molten part absorbs the thermal stress generated during the cooling process from the joining temperature, An
It is characterized by heating and pressurizing with a -8i alloy sheet or a sheet clad with an Al-Si alloy interposed therebetween.

[Embodiments of the invention]

Examples of the present invention will be described below.

[Example 1] Joining of Si, N4 and SiC As shown in Fig. 1, Si, N, round bar 1 and SiC round bar 2
An insert material 3 made of An-81-Mg alloy is interposed between the core material and the surface layer, and a vacuum atmosphere (10
-'torr), bonding temperature 600℃, pressure 1.0kg
/mm”, and the heating time was 15 minutes. In this case, 5
At around 80°C, the surface layer of the insert material 3 A Q −
The Si-Mg alloy becomes molten and Si, N41
and bonded with SiC2. S joined in this way
i3N41 and Sic2 have low junction temperature and
The core material of insert material 3 served as a stress buffer material, and no cracks were observed. When this bonded product was subjected to a 4-point bending test, a bending strength of 14kg/mm'' was obtained.
It became clear that the bonding was sufficient.

[Example 2] BaTi0j and Al, 0. As shown in Figure 2, plate-shaped BaTi0i 4 and plate-shaped A
n, 0, and 5, with the same insert material 3 as in Example 1 interposed, in vacuum (io-'7 orr), at a bonding temperature of 600°C, and at a pressure of 0.05 to 0.1 kg/mm. This result shows that BaTi0.4.An,
No deformation was observed in 0.5, and at the same time, visual inspection
No defects such as cracks were found by X-ray inspection.

[Example 3] Glass and Al2,0. As shown in FIG. 3, the reprinted glass 6 and 1.0. The same insert material 3 as in Example 1 was interposed at the interface with the ring 7, and the bonding was carried out in vacuum (10-'t, orr) at a bonding temperature of 600°C and a pressure of 0.05 kg/+on+''. When a He leak test was conducted on Glass 6 and Al, 0.7 bonded together, it was confirmed that the airtightness was less than 10-'t, orr-ρ/see. [Effects of the Invention] As explained above. According to the present invention, the bonding temperature is low, and the molten Al2-Si-Mg alloy layer also serves as a thermal stress buffer, improving reliability even in bonding ceramics with different coefficients of thermal expansion. Since the temperature is low and the surface layer is molten, it is possible to reduce the pressing force, making it possible to create a joined body with less deformation.

In addition, compared to the conventional methods of soldering and brazing, metallization is not required, and the strength is also improved.

[Brief explanation of drawings]

1 to 3 are explanatory diagrams of the joining method of the present invention, and FIG.
A diagram showing the bonding of i, N, and SiC, Figure 2 is B
A diagram showing the bonding between aTiO3 and tQ203, and Figure @3 is a diagram showing the bonding between glass, Al, and Oz. 1...Si, N, 2...SiC13...insert material, 4-BaTiO, 5=.Al 20. ．．
6-Glass, 7...1st mouthpiece 2 haze

Claims (1)

[Claims] In a method for joining dissimilar ceramics, a sheet made of Al-Si alloy or Al-S is used as an insert material.
The core material is a metal with a solidus temperature higher than that of the i-based alloy, and Al-
Using a sheet with Si-based alloy as both skin materials, Al-Si
A method for joining dissimilar ceramics, which is characterized by heating to a temperature above the solidus line of the alloy and applying pressure.