JPS6182697A - Manufacture of slip ring - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an endless orbital and circumferentially rotating electric motor, which is used, for example, to supply voltage or current to a piezoelectric element that drives a rotating head of a video tape recorder. The present invention relates to a method of manufacturing a slip ring (sliding contact), which is a rotating device that transmits and receives input/output and control signals, to be made smaller and thinner using multiple channels.

[Technical Background of the Invention and its Problems] Conventionally, slip rings have been widely used for the purpose of transmitting and receiving electrical input/output and control signals of rotating devices. For example, in order to supply voltage to a piezoelectric element on a rotating body, a brush provided on a fixed part is brought into contact with an annular pattern of slip rings provided on the rotating surface of the rotating body, and the voltage is supplied through this. be able to. In this case, it is also necessary to make the rotating device smaller and thinner.

Typical structures and shapes of conventional flat plate slip rings are the single-sided, single-layer board type, the cross-sectional view of which is shown in Figure 7 (a), and the two types shown in Figures 7 (b) and 7 (C). As shown in the cross-sectional view, there are two types: double-sided 2@substrate type. Figure 8(a) shows
7(a) to (C), and FIG. 8(b) is a plan view showing the back surface shape of the double-sided double-layer substrate type shown in FIG. 7(b) and FIG. 7(C). . In other words, the single-sided, single-layer board type uses a full alloy foil bonded to the insulating substrate 1 such as a glass epoxy laminate, or a copper foil plated with rhodium or the like, which has high wear resistance, corrosion resistance, and low contact resistance. The applied conductive material is etched to form the interlocking pattern 2, and the external lead drawer is formed by inserting a lead wire 3 such as a vinyl wire into the through hole 4 from the back side of the board, and forming a land portion 5 protruding from the sliding pattern 2.
Soldering 6 is performed on the

Similarly, for the double-sided two-layer board type, as shown in Figure 8 (b>), a sliding pattern 2.2' is formed on both sides of the insulating board 1 using through-hole plating technology, and external lead drawers are provided through-hole. Sliding pattern 2' on the back side through hole plating 7
This can be done through external contacts (not shown), or as shown in FIG.
．． 2' is formed, metal terminals 8 are inserted into the through holes 4, and both ends are soldered 6.

However, in any of the above conventional methods,
In addition to the sliding pattern 2.2' in contact with a brush (not shown), a through hole 4 and a land 5 are required for soldering, which increases the external size of the board. This influence increases as the number of sliding patterns increases in multi-channels. Furthermore, in the single-sided, single-layer substrate type, since the lead wires 3 protrude from the bottom surface of the substrate, a pedestal (not shown) is required during use, and the height direction cannot be suppressed. Further, even when the metal terminals 8 are soldered to a double-sided, two-layer board type, a similar drawback arises in that a pedestal is required.

In addition, in the case shown in FIG. 7(a), the lead l is
113 is inserted into the through hole 4 and soldered to the land portion 5, a convexity is created with the diameter of the lead wire 3 plus the solder 6 with respect to the sliding pattern 2, and the brush comes into contact with it. In some cases, it is necessary to avoid this protrusion when installing. That is,
It is necessary to have a large contact angle between the sliding pattern 2 and the brush, which is a disadvantageous factor in suppressing the height direction. Furthermore,
In Figures 7(a) to (C), since the sliding pattern 2 and the soldering land portion 5 are present as the same pattern on the same surface, the solder may splatter onto the sliding pattern 2 during soldering. If there is even a small amount of solder attached to the sliding pattern 2, the brush will jump at the beginning of the purchase, causing malfunctions due to noise and signal loss. etc., etc.

[Object of the Invention] The present invention has been made in view of the above points, and it is possible to make a single-sided, two-layer type slip ring thinner and thinner by using conventional printed circuit board technology, and to flatten the front and back surfaces of the board. Another object of the present invention is to provide a method for manufacturing a slip ring in which the land portions are concentrated in the center of the substrate, so that lead wires can be soldered directly to the land portions, and there are no protrusions that may interfere with brushes. shall be.

[Summary of the Invention] The present invention provides a first substrate including at least a lead extraction pattern on the insulating surface of a substrate having at least one surface insulated.
After printing and forming a first insulating pattern covering at least the lead extraction pattern on this substrate, a first insulating pattern is printed and formed on the first conductive pattern.
electroplating a second conductive metal with the same thickness as the insulating pattern layer, and then electroless plating a third conductive metal over the entire surface of the substrate so as to correspond to the first conductive pattern. After printing and forming a Menki resist with a pattern opposite to the desired sliding pattern shape, a fourth conductive pattern is formed on the third conductive pattern.
electroplating conductive metal.

A conductive metal with high wear resistance, corrosion resistance, and low contact resistance is electroplated onto the fourth conductive pattern as a sliding material, and then the plating resist is removed using an organic solvent. This is a method for manufacturing a single-sided, two-layer substrate type slip ring characterized in that the conductive metal of No. 3 is removed by etching.

[Embodiments of the invention] An embodiment of the present invention will be described in detail below with reference to the drawings.

That is, the top view of the slip ring according to the present invention is
As shown in the figure. After forming the insulation pattern 11 on the substrate 9, three sliding patterns 10a and 1' of the slip ring are formed.
Ob, 10c are formed, and each sliding pattern 10a to IOc
and an external lead-out terminal 12a.

Connections with 12b and 12c are made by making the pattern a single-sided, two-layer board type and providing a lead lead-out portion. Furthermore, brushes (not shown) are brought into contact with each of the sliding patterns 10a to 10C, respectively. One end of each brush is fixed to the outside of the cylinder of the video tape recorder, and its contact portion is inserted through the opening of the cylinder. Note that the inner diameter and notch of the substrate 9 are used for positioning. In addition, a cross-sectional view of the lead extraction part is shown in Figure 2(a).
-(C), FIG. 2(a) is a sectional view taken along the two-dot dashed line of FIG. 2(1)), and FIG. 2<b> shows the outermost vibration pattern 10a and the external It is a sectional view of a lead extraction pattern 19a connecting with the extraction terminal 12a,
In the same manner, FIG. 2(C) shows a cross-sectional view of a lead extraction pattern 19b connecting the intermediate sliding pattern 10b and the external extraction terminal 12b. The manufacturing process of the above slip ring is shown in FIGS. 3 and 4.

As shown in FIG. 3(a), for example, the electrical resistance is 20 to 10
An acid-resistant insulating paste such as epoxy-based insulating resin is printed as a first insulating pattern 11 on the top surface of the ferrite substrate 9, which is a corrugated magnetic core material as small as 00ρ/Ω·cm, to a thickness of 20 to 40 uI. , for example 200'
Dry at below C for 1 hour. A plan view at this time is shown in FIG. 5, and the insulating pattern 11 is
The area is wider than the sliding patterns 10a to 10c including c.

Next, as shown in FIG. 3(b), on the M plate 9 with the insulation pattern 11, a first conductive pattern 13 is made of an acid-resistant material such as a resin-based steel paste made of thermosetting epoxy resin and copper powder. The conductive paste is dried to a thickness of 10 to 20 μm, for example, at a temperature below 200° C. for 1 hour. The plan view of the first conductive pattern 13 at this time is shown in the sixth figure.
As shown in the figure, for example, in the case of three sliding patterns, the outermost conductive pattern 13a and the middle conductive pattern 131)
In order to connect the lead-out terminals 12a and 12b in correspondence with each other, a jumper wire that cuts the innermost conductive pattern 13c is required, but in the present invention, lead-out patterns 19a and 19b are provided, respectively. , the innermost conductive pattern 13c is directly connected to the external lead extraction terminal 1.
2c is connected. Therefore, although the patterns 13b and 13c are partially cut by the lead extraction patterns 19a and 19b, the lead extraction patterns 19a and
The distance between patterns 13b and 13c between 19b and the cut portion is preferably as narrow as possible within the printable range, for example, 0405 to 0.2#.

Next, as shown in FIG. 3(C), an acid-resistant insulating paste such as an epoxy-based insulating resin is formed on the substrate 9 as a first insulating pattern 14 covering at least the lead extraction patterns 19a and 19b. 20~40μm
The film is printed to a thickness of 200° C. and dried at, for example, 200° C. or less for 1 hour. Next, as shown in FIG. 3(d), the conductive pattern 13 other than the insulating pattern 14 is plated with acid-resistant conductive gold such as copper, so as to have the same thickness as the insulating pattern 14. A second conductive pattern 15 is formed by electroplating
The conductive pattern 15 and the insulating pattern 14 are made to have the same height. Next, as shown in FIG. 3(e), the substrate 9
As a third conductive pattern 16 on the entire surface of the substrate, for example, electroless plating of acid-resistant conductive metal such as copper is applied to the entire surface of the substrate.
It is performed to a thickness of ~lC1 m. Next, as shown in FIG. 3(f), a resist 17 having a pattern opposite to a predetermined pattern 10.12 positioned on the substrate 9 so that the sliding pattern 10 and the external lead-out terminal 12 correspond to each other, for example. Mark 1ii+1 with acid-resistant plating resist and dry. After this, as shown in FIG. 3 (l), on the exposed conductive pattern 16, for example, silver plating or white gold plating is used as a base plating when electroplating rhodium as the sliding material of the sliding pattern 1o. Fourth S-electrode pattern 1 by electroplating acid-resistant conductive metal
Apply 8.

Further, on the conductive pattern 18, a conductive metal such as rhodium is coated with a thickness of 2 to 3 μm as a sliding material of the sliding pattern 10, which has high acid resistance, wear resistance, corrosion resistance, and low contact resistance.
electroplating to a thickness of . At this time, external drawer terminal 1
2 is similarly plated.

Next, as shown in FIG. 3(h), the acid-resistant plating resist 17 is stripped and removed using a paid solvent whose main component is acetone, triethane, trichlene, or the like. Finally, Figure 3 (
As shown in i), the portions of the conductive pattern 16 that are not covered by the sliding pattern 10 and the external lead-out terminals 12 are removed by etching using ferric chloride or cupric chloride in the case of copper, to form a slip ring. be completed. (2) The initial pattern 10 and the first conductive pattern 13 have substantially the same shape except for the lead extraction patterns 19a and 19b.

Through the above steps, a conductive metal slip ring with a desired shape, high wear resistance, corrosion resistance, and low contact resistance is formed on the surface, and the external lead terminal is made of conductive metal stacked by plating. A slip ring with a smooth surface is obtained, which is internally connected through.

Further, the number of annular patterns on the slip ring is increased according to the number of supply destinations of voltage, etc. in this case,
One of the annular patterns becomes a common (earth).

In the above explanation, the process for using an oxide magnetic core material with low electrical resistance as a substrate is shown, but in general, it is possible to use a laminated insulating substrate such as phenol or glass epoxy, an insulating ceramic substrate such as alumina or zirconia, or a 5×10 In the case of an oxide magnetic core material having a large value of ~10"ρ/Ω・cm, the formation of the insulating pattern shown in FIG. 3(a) becomes unnecessary, and the first conductive pattern 1 shown in FIG. 3(b)
3 is performed.

In addition, FIGS. 4(a) to (1) are shown in FIGS. 3(a) to (i>
FIG. 4 is a cross-sectional view of a step in the lead extraction pattern 19b corresponding to the step of FIG.

[Effects of the Invention] As described above, according to the present invention, there is no white part in the thickness direction compared to the conventional double-sided double-layer substrate type slip ring, and there is no white part in the thickness direction compared to the single-sided single-strip substrate type slip ring. Since there is no lead extraction, even in the case of multi-channels, all terminals can be used on the inner circumference of the slip ring and on the surface side that the brush contacts, making it possible to make the slip ring extremely thin. In addition, compared to any of the conventional methods, external lead soldering does not require the provision of land parts within the active pattern part other than the innermost circumferential part.
The outline of the board becomes smaller. That is, this is a method in which 1q of small and thin slip rings are produced.

In addition, since there is nothing on the back side of the board 9 in Figures 3 and 4 (conventionally, soldering of metal terminals, etc. had a convex part), the flatness of the slip ring was checked. In addition, there is no need for Taito, which was required in the past. In other words, since the back surface of the substrate 9 is flat, there is no need for a conventional pedestal, and the pattern formation surface can also be made accurately horizontal (if the pattern formation is flat), and the brush can be applied to the horizontal surface. This prevents the brush from jumping, which can cause noise or malfunction. Furthermore, since it is a process that can be easily performed using conventional printed circuit board technology, the metal material for the sliding pattern can be arbitrarily selected from wear-resistant, corrosion-resistant, and conductive metal with low contact resistance as long as it can be plated. There is.

In addition, as an application example of the present invention, when an insulating ceramic substrate such as alumina or zirconia is used as the insulating substrate, processing at high temperatures is possible, so for example, a crystalline glass paste is imprinted as the insulating paste. For example 850~
It is also possible to use a step of firing at 900° C. for about 1 hour and a step of printing, for example, a silver-palladium-based conductive thick film paste as the conductive paste and firing at 850 to 900° C. for about 1 hour. .

[Brief explanation of the drawing]

FIG. 1 is a surface view showing an example of a slip ring according to the present invention, FIG. 2 is a partially cutaway sectional view showing an example of a slip ring according to the present invention, and FIGS. 1 for each process! FIG. 5 is a plan view showing an example of the insulating pattern of the slip ring according to the present invention, and FIG. 6 is a partially cutaway sectional view showing the slip ring according to the present invention. FIG. 7 is a partially cutaway sectional view of a conventional slip ring, and FIG. 8 is a front view and a back view of the conventional slip ring. 9... Substrate, 10... Sliding pattern, 11... Insulating pattern, 12... External lead terminal, 13... First conductive pattern, 14... First insulating pattern, 1
5... Second conductive pattern, 16... Third conductive pattern, 17... Plating resist, 18... Conductive pattern, 19a, 19b... Lead extraction pattern. Applicant's agent Patent attorney Takehiko Suzue No. 1 Figure 3 Figure 4 Figure 5 Figure 6 Figure 9b

Claims (4)

[Claims] (1) Printing a first conductive pattern including at least a lead extraction pattern on the insulating surface of a substrate whose at least one surface is insulated using an acid-resistant conductive paste;
A first insulating pattern covering at least the lead extraction pattern is printed and formed on the substrate using an acid-resistant insulating paste, and then a first insulating pattern is printed and formed on the first conductive pattern using an acid-resistant insulating paste. An acid-resistant conductive metal is electroplated as a second conductive pattern with the same thickness as the insulating pattern, and then an acid-resistant conductive metal is electrolessly plated on the entire surface of the substrate as a third conductive pattern. After that, an acid-resistant plating resist with a pattern opposite to the predetermined sliding pattern shape is printed and formed on the substrate, and then a third
A conductive metal with acid resistance is electroplated as a fourth conductive pattern on the conductive pattern, and then an acid-resistant, wear-resistant, and corrosion-resistant metal is applied as an external lead terminal and a sliding pattern on the fourth conductive pattern. It is characterized by electroplating a conductive metal that is rich and has low contact resistance, then removing the plating resist with an organic solvent, and then etching away the exposed third conductive pattern. How to manufacture slip rings. (2) The method for manufacturing a slip ring according to claim 1, wherein an insulating ceramic substrate such as alumina or zirconia or an oxide magnetic core material substrate is used as the substrate. (3) The method for manufacturing a slip ring according to claim 1, wherein the first conductive pattern has substantially the same shape as the predetermined sliding pattern except for the lead extraction pattern. (4) After carrying out a step of printing a first insulating pattern on one surface of the substrate using an acid-resistant insulating paste over a wider area than at least a predetermined sliding pattern shape, a first conductive pattern is formed on one surface of the substrate. 2. A method for manufacturing a slip ring according to claim 1, wherein the slip ring is formed by forming a slip ring.