JPS6182696A - Manufacture of slip ring - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an endless orbital and circumferential electrical Slip ring (1&
This invention relates to a method for manufacturing a slip ring that uses multiple channels to reduce the size and thickness of a rib contactor.

[Technical disadvantages of the invention and its problems] Conventionally, slip rings have been widely used for the purpose of electrical input/output of rotating devices and transmission/reception of separate image signals. For example, in order to supply voltage to a piezoelectric element on a rotating body, a brush provided on a fixed part is brought into contact with an annular pattern of slip rings provided on the rotating surface of the rotating body, and the voltage is supplied through this. be able to. In this case, as rotations and devices are becoming smaller and thinner, it is also necessary to make slip rings smaller and thinner.

+, The groove structure and shape of a typical flat plate type slip ring are as shown in the cross-sectional view in Fig. 4(a).
There are two types: @substrate type and double-sided 2@substrate type, the cross-sectional views of which are shown in FIGS. 4(b) and 4(C). Figure 5 (a
) is the surface shape of Fig. 4<a) to (C), and Fig. 5(b)
is shown in Figure 4 (b).

It is a top view which shows the back surface shape of the double-sided dual board|substrate type of (C). In other words, single-sided 1@board type is f! of glass epoxy @board etc. IM-resistant gold-based alloy foil glued to the edge substrate 1 or rhodium etc. on the steel foil! The sliding pattern 2 is formed by etching a conductive material plated with good abrasion resistance, and the external lead drawer is a lead wire 3 such as a vinyl wire from the surface of the M slope.
is inserted into the through hole 4 and soldered 6 to the land portion 5 protruding from the sliding pattern 2.

Similarly, for the double-sided two-layer board type, as shown in FIG.
Through the through-hole plating 7 the sliding pattern 2' of the document
1 or 5 via an external contact (not shown).
As shown in Figure (C), there are sliding patterns 2, 2 on both sides of the board.
', a metal plate 8 is inserted into the through hole 4, and both ends are soldered 6.

However, in any of the above conventional methods,
In addition to the sliding pattern 2.2' that contacts the brush (not shown), the through hole 4 and soldering land 5 are required, so the base 1
The opposite shape becomes larger. This influence increases as the number of activity patterns increases in multi-channels. Furthermore, one side
In the @board type, the lead wires 3 come out from the bottom surface of the board, so a pedestal (not shown) is required during use, and the height cannot be suppressed. Further, even when the metal terminals 8 are soldered to the double-sided two-board type, a similar drawback arises in that a pedestal is required.

In addition, in the case shown in Fig. 4 (a), the Riet wire 3 is connected to the back side of the board 1, which becomes an obstacle when the insulating board 1 rotates, and in the case shown in Fig. 4 (1) and (C). Since there is through-hole plating 7 and solder parts of metal terminals 8 on the back side of the board 1, the back side of the board 1 is not flat, and when the board 1 rotates, the surface of the board 1 is distorted, resulting in one behavior pattern. 2, the brushes that are active will fly off, causing noise and malfunctions.

1. Purpose of the Invention] The present invention has been made in view of the above points, and has two
By using an answer-type substrate, the slip ring can be made thin, the back surface of the substrate can be made flat, and the ES
By concentrating the land in the center of the ti, the lead wire can be soldered directly to this land to create a slip ring! The purpose is to provide a method for manufacturing Pl.

[Summary of the Invention] The present invention involves printing and forming an insulating sheath with a through hole (window) on one side of a metal foil having good wear resistance, and then printing a first conductive pattern using a conductive paste. A thin plate such as a laminate is adhered to this surface, and then the highly wear-resistant metal foil on the surface is etched into a second conductive pattern in the shape of the desired vibration pattern.Finally, the outer shape is pressed, etc. This is a method for manufacturing a single-sided, double-layer substrate type slip ring processed using the following method.

[Embodiment of Hikari] Hereinafter, an embodiment of the method for manufacturing the slip ring 7 of the present invention will be described in detail with reference to the drawings. That is, a plan view of a slip ring according to the present invention is shown in FIG. 1, and a three-tree annular lid i'+ pattern (1) of the slip ring is formed,
The connection of each sliding pattern (1) with the external lead-out terminal 12 is made by printing on the back side of the first working pattern (1) via an insulating layer.
The conductive patterns 13 formed on the conductive pattern 13 are formed into a single-sided double-sided substrate type groove reinforced by a thin plate 14 bonded to the back surface.

The manufacturing process is shown in FIG. As shown in FIG. 2 (a), the back side of the metal foil 15 made of a contact material with good wear resistance, such as gold alloy with a thickness of 50 to 20 cm, has a heat-resistant and Ni-resistant fPJ plate. (An insulating layer 17 having via holes (windows) 16 is formed by screen printing or the like using a moon oil base.

Next, as shown in FIG. 2(b), as the first conductive pattern 13 provided in the via hole 16 portion of the insulating layer 17, a thermosetting four-conductor base]-for example, a resin-based conductive silver paste is printed and formed. do. A plan view of the first conductive pattern 13 of this poem is shown in FIG.

In other words, (ζ1, for example, in the case of three sliding patterns, in order to connect the outermost conductive pattern 13a and the intermediate conductive pattern 13b to the external lead extraction terminals 12a and 12b, respectively, the innermost conductive pattern Although a jumper wire is required to cut the pattern 13C, in the present invention, lead lead-out portions 18a and 18b are provided respectively, and the innermost pattern 13c is directly connected to the external lead-out terminal 12c.For this reason, Although the patterns 13b and '13c are partially cut by the lead extraction parts 18a and 18b,
The pattern spacing between the lead pull-out portions 18a and 18(1) and the cut portion is as narrow as possible within the printable range, for example, O, OS.
It is desirable to set it to ~0.21M.

Next, as shown in FIG. 2(C), an acid-resistant adhesive such as a thermosetting adhesive is screen printed on the entire back side of the metal foil 15 including the insulating layer 17 and the first single-voltage pattern 13. Then, as shown in FIG. 2(d), an insulating layer of 41 to 14, for example 0.2 to 0.5
The metal foil 15 and the thin plate 14 are securely bonded by stacking the glass epoxy resin laminated plates of 1 mm thick and applying pressure to the whole.

Next, as shown in FIG. 2(e), if a gold alloy is used as the metal foil 15, it is etched into a predetermined shape using aqua regia or the like using a general etching technique to form a second conductive pattern. A vibration pattern (1) is formed to form a slip ring.

The first behavior pattern (1) of the second conductive pattern and the first conductive pattern 13 have substantially the same shape except for the lead extraction portions 18a and 18b. Finally, the adhesive and the insulating thin plate 14 are shaped into sheet shapes using a press or the like to complete the process.

Through the above steps, a slip ring of metal foil having a desired shape on the surface is formed, and a slip ring with a smooth surface is obtained which is internally connected to the external lead extraction terminal via a via hole.

The shape of the first conductive pattern 13 shown in FIG. 3 is a lead extraction portion 18a of a jumper wire portion for connecting the external lead extraction terminals 12a, 12b and the outermost and middle patterns to the external lead extraction terminal. Although 18b alone is functionally good, there is a risk that the smoothness of the surface of the sliding pattern may be slightly lost. Further, the number of annular conductive patterns on the slip ring is increased according to the number of destinations to which voltage and the like are supplied. In this case, one of the annular 54-electrode patterns
The book becomes common (earth).

[Effects of the Invention] As described above, according to the present invention, there is no convex part in the thickness direction compared to the conventional double-sided double-layer substrate type slip ring, and compared to the single-sided single-layer substrate type, the external Even in the case of a multi-channel system, all leads can be pulled out from the terminals on the inner periphery of the slip ring and from the surface side that is in contact with the brush, so it is possible to make the slip ring extremely thin.

Furthermore, compared to any of the conventional methods, external lead soldering does not require lands to be provided within the vibrating pattern portion except for the innermost circumferential portion, so the external size of the board becomes smaller. That is,
This method allows one small, thin slip ring to be used.

In addition, compared to the double-sided 2@board type through-hole plating method, the metal material for the 1-part pattern has the advantage that any wear-resistant material that is available in the form of metal foil can be selected, which is an important point for slip rings. It also greatly contributes to improving a certain lifespan. Furthermore, since the back side of the thin plate 14 in Fig. 2 is not the same (?), there are soldered parts such as metal terminals and a convex part is formed on the back side of the thin plate 14, so it is difficult to maintain the flatness of the slip ring. Moreover, there is no need for a pedestal, which was required in the past. In other words, since the back surface of the thin plate 14 is flat, a conventional pedestal is not necessary, and the pattern forming surface can also be accurately horizontal (if the batten formation is flat),
Since the brush slides on a horizontal surface, the brush does not fly away, which can cause noise or malfunction.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an example of a slip ring according to the present invention, FIG. 2 is a process diagram showing an embodiment of the slip ring, and FIG. 3 is an example of a first conductive pattern according to the present invention. The plan view shown in Fig. 4 is a sectional view of the original slip ring.
Figure 5 shows 1. FIG. 3 is a plan view of the slip ring. (1)...Metal φ cover turn, 12...External lead extraction terminal, 13...First conductive pattern, 14...
Anti-insulating thin, 15...Kinnai foil, 16...Hereho~
17...Insulating bottom, 18a, 18t+...Lead extraction part. Applicant's Representative Patent Attorney Takehiko Suzue Figure 4 Figure 5 Figure 2 Figure 1 Figure 3

Claims (3)

[Claims] (1) A process of printing and forming an insulating layer having via holes on one side of a metal foil with good wear resistance, and then using a conductive paste to form a first conductive pattern including at least a lead extraction part. A step of printing and forming a via hole portion of an insulating layer, and then applying an adhesive to the entire surface of the one side of the metal foil including the first conductive pattern and the insulating layer, and then stacking an insulating thin plate to form the whole. A step of bonding by applying pressure, a step of etching the metal foil into a second conductive pattern having a predetermined sliding pattern shape, and a step of processing the outer shape of the adhesive and the insulating thin plate into a predetermined shape. A method for manufacturing a slip ring, comprising the steps of: (2) The method for manufacturing a slip ring according to claim 1, characterized in that a laminated plate is used as the insulating thin plate. (3) The method for manufacturing a slip ring according to claim 1, wherein the first conductive pattern has substantially the same shape as the sliding pattern of the second conductive pattern except for the lead extraction portion.