JPS6181162U - - Google Patents
Info
- Publication number
- JPS6181162U JPS6181162U JP1984103801U JP10380184U JPS6181162U JP S6181162 U JPS6181162 U JP S6181162U JP 1984103801 U JP1984103801 U JP 1984103801U JP 10380184 U JP10380184 U JP 10380184U JP S6181162 U JPS6181162 U JP S6181162U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat dissipation
- utility
- model registration
- electrode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984103801U JPS6181162U (cg-RX-API-DMAC7.html) | 1984-07-11 | 1984-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984103801U JPS6181162U (cg-RX-API-DMAC7.html) | 1984-07-11 | 1984-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181162U true JPS6181162U (cg-RX-API-DMAC7.html) | 1986-05-29 |
Family
ID=30663174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984103801U Pending JPS6181162U (cg-RX-API-DMAC7.html) | 1984-07-11 | 1984-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181162U (cg-RX-API-DMAC7.html) |
-
1984
- 1984-07-11 JP JP1984103801U patent/JPS6181162U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5548954A (en) | Manufacturing of film carrier | |
| JPS6181162U (cg-RX-API-DMAC7.html) | ||
| JPS5831416Y2 (ja) | 半導体スタック用冷却体 | |
| JPH0258393U (cg-RX-API-DMAC7.html) | ||
| JPS58147050A (ja) | 半導体素子用アルミニウム製冷却片 | |
| JPS62160538U (cg-RX-API-DMAC7.html) | ||
| JPS62184798U (cg-RX-API-DMAC7.html) | ||
| JPS5318957A (en) | Electrode structure of semiconductor device | |
| JPS6292644U (cg-RX-API-DMAC7.html) | ||
| JPS55158291A (en) | Edge part structure of anode lead plate | |
| JPH02148569U (cg-RX-API-DMAC7.html) | ||
| JPS56101752A (en) | Semiconductor device | |
| JPS60190048U (ja) | 電気機器のヒ−トシンク | |
| JPH0319115U (cg-RX-API-DMAC7.html) | ||
| JPS5736846A (en) | Metallic package for semiconductor element | |
| JPS5839050U (ja) | 積層形半導体冷却体 | |
| JPS63105331U (cg-RX-API-DMAC7.html) | ||
| JPS5552227A (en) | Semiconductor electrode structure | |
| JPS6298231U (cg-RX-API-DMAC7.html) | ||
| JPH053093B2 (cg-RX-API-DMAC7.html) | ||
| JPS59193867U (ja) | 白金電極 | |
| JPS57192057A (en) | Semiconductor device | |
| JPH0420202U (cg-RX-API-DMAC7.html) | ||
| JPS6192066U (cg-RX-API-DMAC7.html) | ||
| JPS59160861U (ja) | 点火配電器 |