JPS6181153U - - Google Patents

Info

Publication number

JPS6181153U

JPS6181153U JP16522084U JP16522084U JPS6181153U JP S6181153 U JPS6181153 U JP S6181153U JP 16522084 U JP16522084 U JP 16522084U JP 16522084 U JP16522084 U JP 16522084U JP S6181153 U JPS6181153 U JP S6181153U

Authority

JP

Japan

Prior art keywords

resin

utility

lead wire

model registration

semiconductor chip

Prior art date

1984-10-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 239000011347 resin Substances 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 4
• 238000007789 sealing Methods 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims description 2
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 3
• 239000002184 metal Substances 0.000 description 1