JPS6177353A - 半導体整流装置 - Google Patents

半導体整流装置

Info

Publication number
JPS6177353A
JPS6177353A JP19870384A JP19870384A JPS6177353A JP S6177353 A JPS6177353 A JP S6177353A JP 19870384 A JP19870384 A JP 19870384A JP 19870384 A JP19870384 A JP 19870384A JP S6177353 A JPS6177353 A JP S6177353A
Authority
JP
Japan
Prior art keywords
terminal
case
resin
conductive pattern
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19870384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0568860B2 (enrdf_load_stackoverflow
Inventor
Naomasa Sugita
尚正 杉田
Tetsuro Suzuki
鈴木　鉄朗
Yoshiharu Yotsumoto
四元　義治
Hisanori Muramatsu
村松　久儀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP19870384A priority Critical patent/JPS6177353A/ja
Publication of JPS6177353A publication Critical patent/JPS6177353A/ja
Publication of JPH0568860B2 publication Critical patent/JPH0568860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP19870384A 1984-09-25 1984-09-25 半導体整流装置 Granted JPS6177353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19870384A JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19870384A JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Publications (2)

Publication Number Publication Date
JPS6177353A true JPS6177353A (ja) 1986-04-19
JPH0568860B2 JPH0568860B2 (enrdf_load_stackoverflow) 1993-09-29

Family

ID=16395615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19870384A Granted JPS6177353A (ja) 1984-09-25 1984-09-25 半導体整流装置

Country Status (1)

Country Link
JP (1) JPS6177353A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943842A (en) * 1987-03-11 1990-07-24 Kabushiki Kaisha Toshiba Semiconductor device with fuse function
EP1587140A3 (de) * 2004-03-12 2009-04-01 Robert Bosch Gmbh Elektronisches Bauteil mit einer Schaltung, die mit einer Gelschicht versehen ist und Verfahren zur Herstellung des Bauteils

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943842A (en) * 1987-03-11 1990-07-24 Kabushiki Kaisha Toshiba Semiconductor device with fuse function
EP1587140A3 (de) * 2004-03-12 2009-04-01 Robert Bosch Gmbh Elektronisches Bauteil mit einer Schaltung, die mit einer Gelschicht versehen ist und Verfahren zur Herstellung des Bauteils

Also Published As

Publication number Publication date
JPH0568860B2 (enrdf_load_stackoverflow) 1993-09-29

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