JPS617672A - 板状照明光源装置 - Google Patents

板状照明光源装置

Info

Publication number
JPS617672A
JPS617672A JP59127951A JP12795184A JPS617672A JP S617672 A JPS617672 A JP S617672A JP 59127951 A JP59127951 A JP 59127951A JP 12795184 A JP12795184 A JP 12795184A JP S617672 A JPS617672 A JP S617672A
Authority
JP
Japan
Prior art keywords
light
block
source device
light source
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59127951A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527279B2 (enrdf_load_stackoverflow
Inventor
Masahide Takenaka
竹中　正英
Toru Iida
徹 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59127951A priority Critical patent/JPS617672A/ja
Publication of JPS617672A publication Critical patent/JPS617672A/ja
Publication of JPH0527279B2 publication Critical patent/JPH0527279B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Optical Elements Other Than Lenses (AREA)
  • Led Device Packages (AREA)
JP59127951A 1984-06-21 1984-06-21 板状照明光源装置 Granted JPS617672A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59127951A JPS617672A (ja) 1984-06-21 1984-06-21 板状照明光源装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59127951A JPS617672A (ja) 1984-06-21 1984-06-21 板状照明光源装置

Publications (2)

Publication Number Publication Date
JPS617672A true JPS617672A (ja) 1986-01-14
JPH0527279B2 JPH0527279B2 (enrdf_load_stackoverflow) 1993-04-20

Family

ID=14972670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59127951A Granted JPS617672A (ja) 1984-06-21 1984-06-21 板状照明光源装置

Country Status (1)

Country Link
JP (1) JPS617672A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436302B1 (ko) * 2000-09-29 2004-07-02 오므론 가부시키가이샤 광소자용 광학 디바이스 및 해당 광소자용 광학디바이스를 이용한 기기
KR100704899B1 (ko) 2005-07-07 2007-04-09 광전자 주식회사 지향성 발광다이오드의 구조
US7222993B2 (en) 2003-03-31 2007-05-29 Citizen Electronics Co., Ltd. Light emitting diode device
US8550117B2 (en) 2004-11-10 2013-10-08 Michael W. McCarty Seal assembly for a fluid pressure control device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436302B1 (ko) * 2000-09-29 2004-07-02 오므론 가부시키가이샤 광소자용 광학 디바이스 및 해당 광소자용 광학디바이스를 이용한 기기
US7222993B2 (en) 2003-03-31 2007-05-29 Citizen Electronics Co., Ltd. Light emitting diode device
DE102004015903B4 (de) * 2003-03-31 2013-11-14 Citizen Electronics Co., Ltd. Lichtemissionsdiodeneinrichtung
US8550117B2 (en) 2004-11-10 2013-10-08 Michael W. McCarty Seal assembly for a fluid pressure control device
KR100704899B1 (ko) 2005-07-07 2007-04-09 광전자 주식회사 지향성 발광다이오드의 구조

Also Published As

Publication number Publication date
JPH0527279B2 (enrdf_load_stackoverflow) 1993-04-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term