JPS617672A - Tabular lighting light source device - Google Patents
Tabular lighting light source deviceInfo
- Publication number
- JPS617672A JPS617672A JP59127951A JP12795184A JPS617672A JP S617672 A JPS617672 A JP S617672A JP 59127951 A JP59127951 A JP 59127951A JP 12795184 A JP12795184 A JP 12795184A JP S617672 A JPS617672 A JP S617672A
- Authority
- JP
- Japan
- Prior art keywords
- light
- block
- source device
- light source
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 238000005286 illumination Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 abstract 4
- 239000000126 substance Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はパネル照明等に利用される板状照明光源装置に
関するもめである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a plate-shaped illumination light source device used for panel illumination and the like.
従来例の構成とその問題点
近年、発光ダイオードはその高輝度化、高信頼性、コン
パクト性によシ各種照明用光源として重要な位置を占め
てきつつある。2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, light emitting diodes have been occupying an important position as light sources for various types of illumination due to their high brightness, high reliability, and compactness.
以下、図面を参照しながら従来の板状照明光源装置につ
いて説明する。Hereinafter, a conventional plate-shaped illumination light source device will be described with reference to the drawings.
第１図は一般的な発光ダイオードの断面図である。第１
図において、１ａはアノード側端子、１ｂはカソード側
端子、２は発光ダイオードのチップ、３はポンディング
ワイヤ、４はこれらを封止する樹脂である。この構造に
おいてアノード側端子１ａとカソード側端子１ｂの間に
順方向電圧を加えるとチップ２から発光する。この光は
主と、して発光ダイオードの前面、すなわち第１図にお
いて破線で示す方向に集中する。FIG. 1 is a cross-sectional view of a typical light emitting diode. 1st
In the figure, 1a is an anode side terminal, 1b is a cathode side terminal, 2 is a light emitting diode chip, 3 is a bonding wire, and 4 is a resin for sealing these. In this structure, when a forward voltage is applied between the anode terminal 1a and the cathode terminal 1b, the chip 2 emits light. This light is mainly concentrated in front of the light emitting diode, ie in the direction indicated by the dashed line in FIG.
第２図は上記の発光ダイオードを利用して構成した従来
の板状照明光源装置の第１の例であシ、第２図ｄはその
斜視図、第２図すは断面図である。FIG. 2 shows a first example of a conventional plate-shaped illumination light source device constructed using the above-mentioned light emitting diodes, and FIG. 2d is a perspective view thereof, and FIG. 2A is a sectional view thereof.
この構成において、アノード側端子１＆とカソード側端
子１ｂの間に順方向電圧が加えられると発光ダイオード
のチップ２が発光し、この光は光透過性樹脂５の中を進
行した後、光反射性樹脂６の面で反射され、再び光透過
性樹脂６の中を進行したのち外部へ放射される。第３図
は従来の板状照明光源装置の第２の例である。この板状
照明光源装置は発光ダイオードのチップ２をプリント基
板７に直接ボンディングしたもので、第３図ａはその斜
視図、第３図すは断面図である。この構成において（ハ
、発光ダイオードのチップ２を発した光はその犬♀が前
部の光反射性樹脂６ａの面で先ず反射され、さらに後部
の光反射性樹脂６ｂの面で反射されて外部へ放射される
構造となっている。In this configuration, when a forward voltage is applied between the anode side terminal 1& and the cathode side terminal 1b, the light emitting diode chip 2 emits light, and after this light travels through the light-transmitting resin 5, it passes through the light-reflecting resin 5. The light is reflected by the surface of the resin 6, travels through the light-transmitting resin 6 again, and then is emitted to the outside. FIG. 3 shows a second example of a conventional plate-shaped illumination light source device. This plate-shaped illumination light source device has a light emitting diode chip 2 directly bonded to a printed circuit board 7, and FIG. 3a is a perspective view thereof, and FIG. 3 is a sectional view thereof. In this configuration (c), the light emitted from the light emitting diode chip 2 is first reflected by the surface of the light reflective resin 6a at the front, and then further reflected by the surface of the light reflective resin 6b at the rear, and then transmitted to the outside. The structure is such that it radiates to.
しかしながら、第２図および第３図の構成ではいずれも
ワイヤボンディングされた発光ダイオードのチップ２を
光反射性樹脂６（または６ａおよびｓｂ）で構成したケ
ースに装着した後、液体またはペースト状樹脂のケース
内への注入で光透過性樹脂５を形成する必要があるため
、その形成時に気泡あるいは異物類が混入しやすいこと
、周囲に漏洩しやすいこと、およびボンディングワイヤ
の断線を招きやすいことなど製造上の問題がある。However, in both the configurations shown in FIGS. 2 and 3, after the wire-bonded light emitting diode chip 2 is attached to a case made of light reflective resin 6 (or 6a and sb), a liquid or paste resin is applied. Since it is necessary to form the light-transmitting resin 5 by injecting it into the case, there are manufacturing problems such as air bubbles or foreign matter easily getting mixed in during formation, easily leaking into the surroundings, and easily causing the bonding wire to break. I have the above problem.
また、形成された板状照明光源装置光透過性樹脂６と光
反射性樹脂６（または６ａおよびｅｂ）では熱膨張係数
が異なり、このため、使用中に反りが生じ、信頼性の低
下をきたすこと、外観上の問題が生じることなどの欠点
もあった。Furthermore, the light-transmitting resin 6 and the light-reflecting resin 6 (or 6a and eb) of the formed plate-shaped illumination light source device have different coefficients of thermal expansion, which causes warping during use and reduces reliability. However, there were also disadvantages such as problems with appearance.
発明の目的
本発明は上記の不都合をことごとく排除できる新規な構
造を採用することにより板状照明光源装置の高信頼化お
よび製造の容易化を提供するものである。OBJECTS OF THE INVENTION The present invention provides a plate-shaped illumination light source device with higher reliability and easier manufacturing by employing a novel structure that can completely eliminate the above-mentioned disadvantages.
発明の構成
本発明の板状照明光源装置は、透光性樹脂で成形封止さ
れた発光ダイオードを、裏面に光反射物質層が被着され
た透光性樹脂ブロックの底部に埋設した構造となってい
る。この構造によれば板状照明光源装置の構成が簡略化
され、高い信頼性をもつ板状照明光源装置が実現される
。Structure of the Invention The plate-shaped illumination light source device of the present invention has a structure in which a light-emitting diode molded and sealed with a translucent resin is embedded in the bottom of a translucent resin block whose back surface is coated with a light-reflecting material layer. It has become. According to this structure, the configuration of the plate-shaped illumination light source device is simplified, and a highly reliable plate-shaped illumination light source device is realized.
実施例の説明
第４図は、本発明にかかる板状照明光源装置の一実施例
を示す図であシ、同図ａは斜視図、同図すは断面図であ
る。図示するところから明らかなように、本発明では、
板状照明光源装置を、一方の主面側が平坦面とされ、他
方の主面側が円弧状を呈し、しかもこの面に光反射物質
層９が被着されて光反射面とされた透光性樹脂ブロック
８と、透光性樹脂４で成形封止された発光ダイオード１
゜の２要素で構成し、この発光ダイオード１ｏを透光性
樹脂ブロック８の底部に埋設した構造としている。なお
、上記の光反射物質層９は、アルミニウムなどの金属を
スパッタリングによシ被着すること、あるいは、光反射
性の良好な物質を塗布することなどの方法で形成する。DESCRIPTION OF EMBODIMENTS FIG. 4 is a diagram showing an embodiment of a plate-shaped illumination light source device according to the present invention, in which FIG. 4A is a perspective view and FIG. 4A is a sectional view. As is clear from the drawings, in the present invention,
A light-transmitting plate-shaped illumination light source device in which one principal surface side is a flat surface and the other principal surface side exhibits an arc shape, and a light-reflecting material layer 9 is applied to this surface to serve as a light-reflecting surface. A resin block 8 and a light emitting diode 1 molded and sealed with a translucent resin 4
The light emitting diode 1o is embedded in the bottom of the transparent resin block 8. The light-reflecting material layer 9 is formed by depositing a metal such as aluminum by sputtering, or by coating a material with good light-reflectivity.
このような構造とされた本発明の板状照明光源装置では
、発光ダイオードチップ２に順方向電圧を印加してこれ
を発光させると、この光は透光性樹脂４の面から透光
ｌ性樹脂ブロック８の内部に放射され、先ず光反射面
へ到達し、ここで反射される。この反射光は、再び透光
性樹脂ブロック８を進行し、その平坦面から外部へ放射
され′る。すなわち、第２図すの破線で示すように進行
して外部へ放出される。なお光反射面の形状の選定に際
しては、発光ダイオードの埋設位置を考慮する必要があ
ること勿論である。In the plate illumination light source device of the present invention having such a structure, when a forward voltage is applied to the light emitting diode chip 2 to cause it to emit light, this light is transmitted through the surface of the transparent resin 4.
The light is emitted into the interior of the l-type resin block 8, first reaches the light reflecting surface, and is reflected there. This reflected light travels through the translucent resin block 8 again and is radiated to the outside from its flat surface. That is, it progresses as shown by the broken line in Figure 2 and is emitted to the outside. It goes without saying that when selecting the shape of the light-reflecting surface, it is necessary to consider the buried position of the light-emitting diode.
発明の効果
以上のように本発明によれば、一般品として実辛する単
体あるいは複数の発光ダイオードを裏面に光反射性物質
層を形成した透光性樹脂ブロックに装着するだけで板状
照明光源装置が実現できる。Effects of the Invention As described above, according to the present invention, a plate-shaped illumination light source can be obtained by simply attaching a single or plural light emitting diodes, which are commercially available as general products, to a translucent resin block with a light-reflecting material layer formed on the back surface. The device can be realized.
また熱膨張係数が異る異種の樹脂の貼り合わせ状態がな
いため、従来の板状照明光源装置のように反りの発生が
なく高い信頼性が得られる。かかる本発明の板状照明光
源装置は、スクリーン印刷したパネルや液晶パネル等の
後方からの照明など広い分野への応用が可能である。Furthermore, since there is no bonding of different types of resins with different coefficients of thermal expansion, there is no warpage unlike in conventional plate illumination light source devices, and high reliability can be achieved. The plate-shaped illumination light source device of the present invention can be applied to a wide range of fields such as illumination from the rear of screen-printed panels, liquid crystal panels, and the like.
第１図は一般的な発光ダイオードの断面図、第２図ａ、
第３図ａおよび第２図す、第３図すは従来の板状照明光
源装置の斜視図ならびに断面図、第４図ａ、ｂは本発明
の板状照明光源装置の構成例を示す斜視図および断面図
である。
１ａ、１ｂ・・・・・・外部リード、２・・・・・・発
光ダイオードチップ、４・・・・・・透光性樹脂、８・
・・・・・透光性樹脂ブロック、９・・・・・・光反射
物質層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
（ｃ２７） Ｃｂ）
第３図
（Ｑ、） （ｂ）
第４図
（α）（ｂ）Figure 1 is a cross-sectional view of a general light emitting diode, Figure 2 a,
3a, 2, and 3 are perspective views and sectional views of a conventional plate-shaped illumination light source device, and FIGS. 4a and 4b are perspective views showing a configuration example of the plate-shaped illumination light source device of the present invention. FIG. 2 is a diagram and a cross-sectional view. 1a, 1b...External lead, 2...Light emitting diode chip, 4...Transparent resin, 8.
...Translucent resin block, 9... Light reflective material layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 (c27) Cb) Figure 3 (Q,) (b)
Figure 4 (α) (b)
Claims (1)
光反射物質層を被着した透光性樹脂ブロックの底部に埋
設したことを特徴とする板状照明光源装置。A plate-shaped illumination light source device characterized in that a light-emitting diode molded and sealed with a translucent resin is embedded in the bottom of a translucent resin block whose back surface is coated with a light-reflecting material layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127951A JPS617672A (en) | 1984-06-21 | 1984-06-21 | Tabular lighting light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59127951A JPS617672A (en) | 1984-06-21 | 1984-06-21 | Tabular lighting light source device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617672A true JPS617672A (en) | 1986-01-14 |
| JPH0527279B2 JPH0527279B2 (en) | 1993-04-20 |
Family
ID=14972670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59127951A Granted JPS617672A (en) | 1984-06-21 | 1984-06-21 | Tabular lighting light source device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617672A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436302B1 (en) * | 2000-09-29 | 2004-07-02 | 오므론 가부시키가이샤 | Optical Device for an Optical Element and Apparatus Employing the Device |
| KR100704899B1 (en) | 2005-07-07 | 2007-04-09 | 광전자 주식회사 | Structure of directional led |
| US7222993B2 (en) | 2003-03-31 | 2007-05-29 | Citizen Electronics Co., Ltd. | Light emitting diode device |
| US8550117B2 (en) | 2004-11-10 | 2013-10-08 | Michael W. McCarty | Seal assembly for a fluid pressure control device |
-
1984
- 1984-06-21 JP JP59127951A patent/JPS617672A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436302B1 (en) * | 2000-09-29 | 2004-07-02 | 오므론 가부시키가이샤 | Optical Device for an Optical Element and Apparatus Employing the Device |
| US7222993B2 (en) | 2003-03-31 | 2007-05-29 | Citizen Electronics Co., Ltd. | Light emitting diode device |
| DE102004015903B4 (en) * | 2003-03-31 | 2013-11-14 | Citizen Electronics Co., Ltd. | Light-emitting diode device |
| US8550117B2 (en) | 2004-11-10 | 2013-10-08 | Michael W. McCarty | Seal assembly for a fluid pressure control device |
| KR100704899B1 (en) | 2005-07-07 | 2007-04-09 | 광전자 주식회사 | Structure of directional led |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527279B2 (en) | 1993-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |