JPH0527279B2 - - Google Patents
Info
- Publication number
- JPH0527279B2 JPH0527279B2 JP59127951A JP12795184A JPH0527279B2 JP H0527279 B2 JPH0527279 B2 JP H0527279B2 JP 59127951 A JP59127951 A JP 59127951A JP 12795184 A JP12795184 A JP 12795184A JP H0527279 B2 JPH0527279 B2 JP H0527279B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- source device
- plate
- emitting diode
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Optical Elements Other Than Lenses (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59127951A JPS617672A (ja) | 1984-06-21 | 1984-06-21 | 板状照明光源装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59127951A JPS617672A (ja) | 1984-06-21 | 1984-06-21 | 板状照明光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS617672A JPS617672A (ja) | 1986-01-14 |
JPH0527279B2 true JPH0527279B2 (enrdf_load_stackoverflow) | 1993-04-20 |
Family
ID=14972670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59127951A Granted JPS617672A (ja) | 1984-06-21 | 1984-06-21 | 板状照明光源装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS617672A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100436302B1 (ko) * | 2000-09-29 | 2004-07-02 | 오므론 가부시키가이샤 | 광소자용 광학 디바이스 및 해당 광소자용 광학디바이스를 이용한 기기 |
JP2004304041A (ja) | 2003-03-31 | 2004-10-28 | Citizen Electronics Co Ltd | 発光ダイオード |
US20060096643A1 (en) | 2004-11-10 | 2006-05-11 | Mccarty Michael W | Seal assembly for a fluid pressure control device |
KR100704899B1 (ko) | 2005-07-07 | 2007-04-09 | 광전자 주식회사 | 지향성 발광다이오드의 구조 |
-
1984
- 1984-06-21 JP JP59127951A patent/JPS617672A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS617672A (ja) | 1986-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |