JPS6175594A - プリント回路を製造するための２層プリント基板 - Google Patents

プリント回路を製造するための２層プリント基板

Info

Publication number
JPS6175594A
JPS6175594A JP60156192A JP15619285A JPS6175594A JP S6175594 A JPS6175594 A JP S6175594A JP 60156192 A JP60156192 A JP 60156192A JP 15619285 A JP15619285 A JP 15619285A JP S6175594 A JPS6175594 A JP S6175594A
Authority
JP
Japan
Prior art keywords
layer
conductor
hole
insulating layer
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60156192A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0544837B2 (OSRAM
Inventor
ヴオルフラム・ブライトリング
ヴエルナー・ゾナベント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schroff GmbH
Original Assignee
Schroff GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schroff GmbH filed Critical Schroff GmbH
Publication of JPS6175594A publication Critical patent/JPS6175594A/ja
Publication of JPH0544837B2 publication Critical patent/JPH0544837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP60156192A 1984-07-17 1985-07-17 プリント回路を製造するための２層プリント基板 Granted JPS6175594A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3426278.4 1984-07-17
DE3426278A DE3426278C2 (de) 1984-07-17 1984-07-17 Leiterplatte

Publications (2)

Publication Number Publication Date
JPS6175594A true JPS6175594A (ja) 1986-04-17
JPH0544837B2 JPH0544837B2 (OSRAM) 1993-07-07

Family

ID=6240827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60156192A Granted JPS6175594A (ja) 1984-07-17 1985-07-17 プリント回路を製造するための２層プリント基板

Country Status (6)

Country Link
US (1) US4675788A (OSRAM)
JP (1) JPS6175594A (OSRAM)
CA (1) CA1232081A (OSRAM)
DE (1) DE3426278C2 (OSRAM)
FR (1) FR2568085B1 (OSRAM)
GB (1) GB2161988B (OSRAM)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743710A (en) * 1985-10-18 1988-05-10 Kollmorgen Technologies Corporation Coaxial interconnection boards
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
CA1271819C (en) * 1986-08-05 1990-07-17 ELECTRICAL SHIELDING
DE3823469A1 (de) * 1988-07-11 1990-01-18 Bodenseewerk Geraetetech Filteranordnung
JPH0268571A (ja) * 1988-09-02 1990-03-08 Konica Corp 画像形成装置に於けるプリント基板
US5130882A (en) * 1991-04-12 1992-07-14 The United States Of America As Represented By The Secretary Of The Air Force Multilayer circuit board transient protection device
US5211567A (en) * 1991-07-02 1993-05-18 Cray Research, Inc. Metallized connector block
USH1471H (en) * 1993-04-26 1995-08-01 Braun David J Metal substrate double sided circuit board
US5421083A (en) * 1994-04-01 1995-06-06 Motorola, Inc. Method of manufacturing a circuit carrying substrate having coaxial via holes
DE69413679T2 (de) 1994-07-15 1999-04-29 Berg Electronics Manufacturing B.V., S'-Hertogenbosch Zusammenbau eines abgeschirmten Verbinders und einer Leiterplatte mit kontaktierten Löchern
US6197450B1 (en) 1998-10-22 2001-03-06 Ramot University Authority For Applied Research & Industrial Development Ltd. Micro electrochemical energy storage cells
US6538538B2 (en) * 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
WO2001048819A2 (en) * 1999-12-28 2001-07-05 Intel Corporation Interconnect structure and method of fabrication therefor
US6565730B2 (en) 1999-12-29 2003-05-20 Intel Corporation Self-aligned coaxial via capacitors
TW525417B (en) * 2000-08-11 2003-03-21 Ind Tech Res Inst Composite through hole structure
US6617526B2 (en) * 2001-04-23 2003-09-09 Lockheed Martin Corporation UHF ground interconnects
DE10150715A1 (de) * 2001-10-13 2003-04-30 Bosch Gmbh Robert Grüner keramischer Einsatzkörper, keramischer Einsatzkörper, keramischer Grünkörper oder Grünkörperverbund und damit hergestellter keramischer Schichtverbund
US6894220B1 (en) * 2003-05-12 2005-05-17 Cisco Technology, Inc. Methods and apparatus for grounding a circuit board
US7404250B2 (en) * 2005-12-02 2008-07-29 Cisco Technology, Inc. Method for fabricating a printed circuit board having a coaxial via
US7459202B2 (en) * 2006-07-03 2008-12-02 Motorola, Inc. Printed circuit board
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
US9123954B2 (en) 2010-06-06 2015-09-01 Ramot At Tel-Aviv University Ltd. Three-dimensional microbattery having a porous silicon anode
TWI505413B (zh) * 2011-07-20 2015-10-21 精材科技股份有限公司 晶片封裝體及其製造方法
WO2017055984A1 (en) 2015-09-30 2017-04-06 Ramot At Tel Aviv University Ltd. 3d micro-battery on 3d-printed substrate
CN114900947B (zh) * 2022-04-15 2025-04-25 深南电路股份有限公司 印制电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52107362U (OSRAM) * 1976-02-12 1977-08-16
JPS5619755A (en) * 1979-07-27 1981-02-24 Sumitomo Chemical Co Coating polycarbonate group resin molding* whose wear resisting property is improved

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3351816A (en) * 1965-02-04 1967-11-07 Bunker Ramo Planar coaxial circuitry
US3499219A (en) * 1967-11-06 1970-03-10 Bunker Ramo Interconnection means and method of fabrication thereof
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
US4173745A (en) * 1977-12-02 1979-11-06 Rockwell International Corporation Filtering configuration using feed-through capacitor
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52107362U (OSRAM) * 1976-02-12 1977-08-16
JPS5619755A (en) * 1979-07-27 1981-02-24 Sumitomo Chemical Co Coating polycarbonate group resin molding* whose wear resisting property is improved

Also Published As

Publication number Publication date
FR2568085A1 (fr) 1986-01-24
DE3426278A1 (de) 1986-01-30
US4675788A (en) 1987-06-23
CA1232081A (en) 1988-01-26
GB2161988A (en) 1986-01-22
GB8517514D0 (en) 1985-08-14
GB2161988B (en) 1987-11-18
JPH0544837B2 (OSRAM) 1993-07-07
FR2568085B1 (fr) 1988-10-28
DE3426278C2 (de) 1987-02-26

Similar Documents

Publication Publication Date Title
JPH0544837B2 (OSRAM)
US2907925A (en) Printed circuit techniques
US4054939A (en) Multi-layer backpanel including metal plate ground and voltage planes
US6661638B2 (en) Capacitor employing both fringe and plate capacitance and method of manufacture thereof
US6563688B2 (en) Isolating energy conditioning shield assembly
JP3087495B2 (ja) コンデンサおよびシールドケース
EP0086961A2 (en) Multilayer board for the interconnection of high-speed circuits
US20030231456A1 (en) Energy conditioning structure
US5519583A (en) Integrated common mode current decoupler for I/O cables
US20070090894A1 (en) Printed circuit boards for high-speed communication
JPH03183106A (ja) プリント配線板
US5384433A (en) Printed circuit structure including power, decoupling and signal termination
JPS6134808A (ja) 表面装着されたブス装置
JPH0754874B2 (ja) 多層プリント配線板
US7342804B2 (en) Ball grid array resistor capacitor network
JPS6342199A (ja) 電気的シ−ルド及び製造方法
JPS60257191A (ja) プリント配線板
US3396459A (en) Method of fabricating electrical connectors
JPH04148591A (ja) 多目的ビア
JPH01119096A (ja) シールド板内蔵の回路基板
JPS58143598A (ja) 電子回路部品
JPS5812464Y2 (ja) 多層印刷配線板
JPH04116995A (ja) 部品実装基板およびそのシールド方法
JPS6010799A (ja) 電子回路装置
JPS62200788A (ja) 多層プリント板