JPS6172679U - - Google Patents

Info

Publication number
JPS6172679U
JPS6172679U JP15722484U JP15722484U JPS6172679U JP S6172679 U JPS6172679 U JP S6172679U JP 15722484 U JP15722484 U JP 15722484U JP 15722484 U JP15722484 U JP 15722484U JP S6172679 U JPS6172679 U JP S6172679U
Authority
JP
Japan
Prior art keywords
movable beam
polysilicon film
acceleration sensor
semiconductor
semiconductor acceleration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15722484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15722484U priority Critical patent/JPS6172679U/ja
Publication of JPS6172679U publication Critical patent/JPS6172679U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の主要部断面図、第
2図は従来装置の主要部断面図、第3図は本考案
の製造工程を示す図である。 符号の説明、11…n型Si基板、12…上部
電極、13…下面絶縁膜、14…上面絶縁膜、1
5…重り、16…絶縁膜、17…下部電極、18
…MOSFET、19…金属配線、20…可動梁、21
…スペーサ、22…保護膜。
FIG. 1 is a sectional view of the main part of an embodiment of the present invention, FIG. 2 is a sectional view of the main part of a conventional device, and FIG. 3 is a diagram showing the manufacturing process of the present invention. Explanation of symbols, 11...n-type Si substrate, 12...upper electrode, 13...lower surface insulating film, 14...upper surface insulating film, 1
5... Weight, 16... Insulating film, 17... Lower electrode, 18
...MOSFET, 19...metal wiring, 20...movable beam, 21
...Spacer, 22...Protective film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板上に形成された可動梁の偏位を検出
することによつて加速度を検出する半導体加速度
センサにおいて、上記可動梁を、耐アルカリエツ
チング性のポリシリコン膜と、該ポリシリコン膜
の上面と下面にそれぞれ設けられたナイトライド
膜との三重構造にし、かつ上記可動梁上にワイヤ
ボンデイングで形成された金属ボールからなる重
りを装着したことを特徴とする半導体加速度セン
サ。
In a semiconductor acceleration sensor that detects acceleration by detecting the displacement of a movable beam formed on a semiconductor substrate, the movable beam is formed of a polysilicon film having alkali etching resistance and an upper surface of the polysilicon film. A semiconductor acceleration sensor characterized in that it has a triple structure with nitride films provided on the lower surface, and a weight made of a metal ball formed by wire bonding is mounted on the movable beam.
JP15722484U 1984-10-19 1984-10-19 Pending JPS6172679U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15722484U JPS6172679U (en) 1984-10-19 1984-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15722484U JPS6172679U (en) 1984-10-19 1984-10-19

Publications (1)

Publication Number Publication Date
JPS6172679U true JPS6172679U (en) 1986-05-17

Family

ID=30715222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15722484U Pending JPS6172679U (en) 1984-10-19 1984-10-19

Country Status (1)

Country Link
JP (1) JPS6172679U (en)

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