JPS6171950A - Ultrasonic vibration type float polishing device - Google Patents

Ultrasonic vibration type float polishing device

Info

Publication number
JPS6171950A
JPS6171950A JP59191739A JP19173984A JPS6171950A JP S6171950 A JPS6171950 A JP S6171950A JP 59191739 A JP59191739 A JP 59191739A JP 19173984 A JP19173984 A JP 19173984A JP S6171950 A JPS6171950 A JP S6171950A
Authority
JP
Japan
Prior art keywords
float polishing
work
float
polishing dish
ultrasonic vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59191739A
Other languages
Japanese (ja)
Other versions
JPH0369659B2 (en
Inventor
Toru Imanari
徹 今成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP59191739A priority Critical patent/JPS6171950A/en
Publication of JPS6171950A publication Critical patent/JPS6171950A/en
Publication of JPH0369659B2 publication Critical patent/JPH0369659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To actively crush abrasive grains and sharply reduce a float polishing hour by mounting a device to cause a float polishing dish or a work to ultrasonically vibrate. CONSTITUTION:When a float polishing dish 5 immersed in processing liquid 12 is rotated round a shaft 9 through an external rotating body 6 by a motor 7, pressure opposite to the direction of gravity is caused by dynamic pressure effect on the groove of the float polishing dish 5. At this time, pressure lower than dynamic pressure is applied to a work 9 by means of a holder 10 to press the work 9 against the float polishing dish 5 as the work 9 is rotated with a ho older 10 by a motor 11. Thus the work 9 is polished owing to its collision with polishing material though getting out of contact with the float polishing dish 5. When the power source of a generator 1 is turned on, an ultrasonic signal is transmitted through a brush 3 to a piezoelectric transducer 2, and an ultrasonic vibration produced by the transducer 2 in circumferential direction is transmitted to free abrasive grains between the float polishing dish 5 and the work 9.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、フロート研摩装置、特に加工時間の短縮を図
った超音波振動フロート研摩装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to a float polishing device, and particularly to an ultrasonic vibration float polishing device that reduces processing time.

〈従来の技術〉 フロート研摩は被研摩物をフローティングさせて、超微
粒子の砥粒の被研摩面への衝突により表面を微小量ずつ
除去していく研摩方法で、研磨品の表面の加工変質層が
非常に少なく、表面粗さも良好なものに仕上げられる等
の特徴とするものであるが、従来のフロート研摩装置で
は遊離砥粒を流体の動圧効果で押しつけるという研摩方
式を採つていた。
<Conventional technology> Float polishing is a polishing method in which the object to be polished is made to float, and ultrafine abrasive particles collide with the surface to be polished, removing minute amounts of the surface. However, conventional float polishing equipment uses a polishing method that presses loose abrasive grains using the dynamic pressure effect of a fluid.

〈発明が解決しようとする問題点〉 ところで、前述のような研摩方式では研摩量が少なく、
加工時間が長いという欠点があった。
<Problems to be solved by the invention> By the way, with the polishing method described above, the amount of polishing is small;
The disadvantage was that the processing time was long.

本発明は前述従来技術の欠点を除去し、加工時間を大幅
に短縮できるフロート研摩装置を提供することを目的と
する。
SUMMARY OF THE INVENTION An object of the present invention is to provide a float polishing device that eliminates the drawbacks of the prior art described above and can significantly shorten machining time.

〈問題点を解決するための手段〉 本発明を、図面に基づいて説明する。〈Means for solving problems〉 The present invention will be explained based on the drawings.

第1図は本発明に係る超音波振動フロート研摩装置の要
部断面図である。
FIG. 1 is a sectional view of essential parts of an ultrasonic vibration float polishing apparatus according to the present invention.

図において、1は超音波の信号を発生する発振器、2は
該発振器1からの信号をブラシ3を介して受け、軸aに
対して円周方向に微小量の角変位で超音波振動する超音
波振動子、4は該超音波振動子2で発生した振動をフロ
ート研摩皿5に伝達するためのホーンで、節部を用いて
外部回転体6とねじ等で固定されている。該フロート研
摩皿5はその表面に円周方向に微細溝が形成され、動圧
効果を発生させる。また、超音波振動子2.ホ−ン4及
びフロート研摩皿5は該超音波振動子2の固有振動数と
同一の固有振動数をもった共振系とし、この共振系全体
は加工タンク8の底部に回転可能でかつ水密構造に支持
された外部回転体6と同軸的に固着され、かつ該フロー
ト研摩皿5は加工タンク8内に位置しており、モーフ7
により該外部回転体6を介して軸3回りに回転するよう
になっている。
In the figure, 1 is an oscillator that generates an ultrasonic signal, 2 is an ultrasonic wave that receives the signal from the oscillator 1 via a brush 3, and vibrates ultrasonically with a minute angular displacement in the circumferential direction with respect to the axis a. The sonic vibrator 4 is a horn for transmitting vibrations generated by the ultrasonic vibrator 2 to the floating polishing plate 5, and is fixed to the external rotary body 6 by screws or the like using a joint. The float polishing plate 5 has fine grooves formed in the circumferential direction on its surface to generate a dynamic pressure effect. In addition, ultrasonic transducer 2. The horn 4 and the float polishing plate 5 are a resonant system having the same natural frequency as that of the ultrasonic vibrator 2, and the entire resonant system is rotatably installed at the bottom of the processing tank 8 and has a watertight structure. The floating polishing plate 5 is coaxially fixed to an external rotary body 6 supported by the morph 7.
It is configured to rotate around the shaft 3 via the external rotating body 6.

9は例えは被研摩レンズのようなワークで、前記研摩皿
5に相対してホルダ10に保持され、モーフ11により
該ホルダ10とともに軸す回りに回転するようになって
いる。また、前記加工タンク8内には研摩剤を含む加工
液12が満され、該加工液12に前記フロート研摩皿5
及びワーク9が浸されている。
A workpiece 9, such as a lens to be polished, is held in a holder 10 facing the polishing plate 5, and is rotated around an axis together with the holder 10 by a morph 11. The machining tank 8 is filled with a machining fluid 12 containing an abrasive, and the machining fluid 12 is filled with the float polishing plate 5.
and the workpiece 9 is immersed.

〈f牛用〉 次に、その作用を説明する。<For cattle> Next, its effect will be explained.

まず、加工液12に浸ったフロート研摩皿5をモーフ7
により外部回転体6を介して軸3回りに回転さぜると、
該フロ−1〜研摩皿5の溝面には動圧効果により重力方
向と反対向きに圧力を生じる。
First, the float polishing plate 5 immersed in the machining fluid 12 is placed on the morph 7
When rotated around the axis 3 via the external rotating body 6,
Pressure is generated in the groove surfaces of the flow plates 1 to 5 in the direction opposite to the direction of gravity due to the dynamic pressure effect.

ここで、ワーク9をモーフ11によりホルダ10ととも
回転させながら、該ホルダ10で動圧以下の圧力をかけ
、フロート研摩皿5に押しつける。
Here, the workpiece 9 is rotated together with the holder 10 by the morph 11 and is pressed against the float polishing plate 5 by applying a pressure equal to or lower than the dynamic pressure with the holder 10 .

そうすると、フロート研摩皿5とワーク9は非接触の状
態にありながらもワーク9は研摩剤の衝突により研摩さ
れる。
Then, although the float polishing plate 5 and the workpiece 9 are in a non-contact state, the workpiece 9 is polished by the collision of the abrasive.

次に、発振器1の電源を入れると、発生した超音波の信
号がブラシ3を経て超音波振動子2に伝わり、ここで発
生した円周方向の超音波振動がホーン4、フロー!・研
摩皿5を経て最終的にはフロート研摩皿5とワーク9と
の間に介在する遊離砥粒へと伝達される。
Next, when the oscillator 1 is turned on, the generated ultrasonic signal is transmitted to the ultrasonic vibrator 2 via the brush 3, and the circumferential ultrasonic vibration generated here causes the horn 4 to flow! - The abrasive grains are finally transmitted through the polishing plate 5 to the free abrasive grains interposed between the float polishing plate 5 and the workpiece 9.

このようにして、遊離砥粒に超音波振動が伝達されると
、遊離砥粒は微小振幅をもった振動をするため、単位時
間当りの運動軌跡が長く、また運動方向の規則性がなく
なり、砥粒の破砕が活発に行われるので、ワーク加工量
の増大され、短時間に加工できる。
When ultrasonic vibrations are transmitted to free abrasive grains in this way, the free abrasive grains vibrate with minute amplitudes, resulting in long motion trajectories per unit time and lack of regularity in the direction of motion. Since the abrasive grains are actively crushed, the amount of workpiece processing can be increased and the workpiece can be processed in a short time.

〈実施例〉 第2図ないし第4図は、それぞれ本発明の種々の実施例
の要部を示すもので、第1図に示すものと同一44p分
は同一符号を付している。
<Embodiments> FIGS. 2 to 4 show essential parts of various embodiments of the present invention, and the same 44 pages as shown in FIG. 1 are given the same reference numerals.

第2図はフロート研摩皿5の超音波振動方向がその回転
軸aの軸方向にしたものであり、第3図はフロート研摩
皿5を超音波振動させるのに代えてワ−り9側を発振器
21、超音波振動子22及びポーン24等により超音波
振動させたものであり、第4図はフロート研摩皿5を発
振器1、超音波振動−F2及びホーン4等により、ワー
ク9を発振器21、超音波振動子22及びホーン24等
により、それぞれ超音波振動が与えられるようにしたも
のである。
In Fig. 2, the direction of ultrasonic vibration of the float polishing plate 5 is in the direction of its rotation axis a, and in Fig. 3, the direction of ultrasonic vibration of the float polishing plate 5 is set to the axial direction of its rotation axis a, and in Fig. 3, instead of vibrating the float polishing plate 5 ultrasonically, the workpiece 9 side is The float polishing plate 5 is vibrated ultrasonically by an oscillator 21, an ultrasonic vibrator 22, a pawn 24, etc., and in FIG. , ultrasonic vibrations are applied by an ultrasonic vibrator 22, a horn 24, etc., respectively.

〈発明の効果〉 本発明は、以上説明したようにフロート研摩皿又はワー
クに超音波振動させる装置を取付けた簡単な構造で、フ
ロート研摩時間を大幅に削減できる効果がある。
<Effects of the Invention> As explained above, the present invention has a simple structure in which an ultrasonic vibration device is attached to a float polishing plate or a workpiece, and has the effect of significantly reducing float polishing time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係るフロート研摩装置の構成を示す断
面図、第2図ないし第4図は本発明の種種の実施例で、
第2図は研摩皿を軸方向に超音波振動させたフロート研
摩装置の要部断面図、第3図はワークを超音波振動させ
たフロート研摩装置の要部断面図、第4図は研摩皿とワ
ークとを超音波振動させたフロート研摩装置の要部断面
図である。 1.21・・・発振器、2.22・・・超音波振動子、
4.24・・・ポーン、5・・・研摩皿、8・・・加工
タンク、9・・・ワーク、10・・・ホルダ、12・・
・加工液〇第1図 b 第2図 り 特開昭61.−71950(3) 第3図 (し 第4図
FIG. 1 is a sectional view showing the structure of a float polishing device according to the present invention, and FIGS. 2 to 4 show various embodiments of the present invention.
Figure 2 is a sectional view of the main part of a float polishing device that vibrates the polishing plate ultrasonically in the axial direction, Figure 3 is a sectional view of the main part of the float polishing device that vibrates the workpiece ultrasonically, and Figure 4 is the polishing plate. FIG. 2 is a sectional view of a main part of a float polishing device in which a workpiece and a workpiece are vibrated ultrasonically. 1.21... Oscillator, 2.22... Ultrasonic transducer,
4.24... Pawn, 5... Polishing plate, 8... Processing tank, 9... Workpiece, 10... Holder, 12...
・Working fluid〇Figure 1b Figure 2 JP-A-61. -71950(3) Figure 3 (and Figure 4)

Claims (1)

【特許請求の範囲】[Claims] 1 フロート研摩皿又はワークを超音波振動させる超音
波振動発生装置を取付けたことを特徴とする超音波振動
フロート研摩装置。
1. An ultrasonic vibrating float polishing device, characterized in that it is equipped with an ultrasonic vibration generator for ultrasonic vibration of a float polishing plate or a workpiece.
JP59191739A 1984-09-14 1984-09-14 Ultrasonic vibration type float polishing device Granted JPS6171950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59191739A JPS6171950A (en) 1984-09-14 1984-09-14 Ultrasonic vibration type float polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59191739A JPS6171950A (en) 1984-09-14 1984-09-14 Ultrasonic vibration type float polishing device

Publications (2)

Publication Number Publication Date
JPS6171950A true JPS6171950A (en) 1986-04-12
JPH0369659B2 JPH0369659B2 (en) 1991-11-01

Family

ID=16279691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59191739A Granted JPS6171950A (en) 1984-09-14 1984-09-14 Ultrasonic vibration type float polishing device

Country Status (1)

Country Link
JP (1) JPS6171950A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399234A (en) * 1993-09-29 1995-03-21 Motorola Inc. Acoustically regulated polishing process
EP0749805A1 (en) * 1995-06-20 1996-12-27 Valentinas Snitka A diamond polishing method and apparatus
WO1997000756A3 (en) * 1995-06-20 1997-01-30 Valentinas Snitka A diamond polishing method and apparatus
CN104723175A (en) * 2015-03-11 2015-06-24 浙江工业大学 Ultrasonic grinding micro female die machining device
CN109605168A (en) * 2018-11-30 2019-04-12 中国兵器科学研究院宁波分院 A kind of system of processing of major diameter optical element
CN113305653A (en) * 2021-07-07 2021-08-27 胡靖烯 Optical lens milling and grinding method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544787A (en) * 1978-09-27 1980-03-29 Matsushita Electric Ind Co Ltd Grinding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544787A (en) * 1978-09-27 1980-03-29 Matsushita Electric Ind Co Ltd Grinding method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399234A (en) * 1993-09-29 1995-03-21 Motorola Inc. Acoustically regulated polishing process
EP0749805A1 (en) * 1995-06-20 1996-12-27 Valentinas Snitka A diamond polishing method and apparatus
WO1997000756A3 (en) * 1995-06-20 1997-01-30 Valentinas Snitka A diamond polishing method and apparatus
CN104723175A (en) * 2015-03-11 2015-06-24 浙江工业大学 Ultrasonic grinding micro female die machining device
CN104723175B (en) * 2015-03-11 2016-12-07 浙江工业大学 Ultrasonic grinding small die process equipment
CN109605168A (en) * 2018-11-30 2019-04-12 中国兵器科学研究院宁波分院 A kind of system of processing of major diameter optical element
CN109605168B (en) * 2018-11-30 2021-09-14 中国兵器科学研究院宁波分院 Processing system of large-diameter optical element
CN113305653A (en) * 2021-07-07 2021-08-27 胡靖烯 Optical lens milling and grinding method

Also Published As

Publication number Publication date
JPH0369659B2 (en) 1991-11-01

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