JPS6171950A - Ultrasonic vibration type float polishing device - Google Patents
Ultrasonic vibration type float polishing deviceInfo
- Publication number
- JPS6171950A JPS6171950A JP59191739A JP19173984A JPS6171950A JP S6171950 A JPS6171950 A JP S6171950A JP 59191739 A JP59191739 A JP 59191739A JP 19173984 A JP19173984 A JP 19173984A JP S6171950 A JPS6171950 A JP S6171950A
- Authority
- JP
- Japan
- Prior art keywords
- float polishing
- work
- float
- polishing dish
- ultrasonic vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、フロート研摩装置、特に加工時間の短縮を図
った超音波振動フロート研摩装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to a float polishing device, and particularly to an ultrasonic vibration float polishing device that reduces processing time.
〈従来の技術〉
フロート研摩は被研摩物をフローティングさせて、超微
粒子の砥粒の被研摩面への衝突により表面を微小量ずつ
除去していく研摩方法で、研磨品の表面の加工変質層が
非常に少なく、表面粗さも良好なものに仕上げられる等
の特徴とするものであるが、従来のフロート研摩装置で
は遊離砥粒を流体の動圧効果で押しつけるという研摩方
式を採つていた。<Conventional technology> Float polishing is a polishing method in which the object to be polished is made to float, and ultrafine abrasive particles collide with the surface to be polished, removing minute amounts of the surface. However, conventional float polishing equipment uses a polishing method that presses loose abrasive grains using the dynamic pressure effect of a fluid.
〈発明が解決しようとする問題点〉
ところで、前述のような研摩方式では研摩量が少なく、
加工時間が長いという欠点があった。<Problems to be solved by the invention> By the way, with the polishing method described above, the amount of polishing is small;
The disadvantage was that the processing time was long.
本発明は前述従来技術の欠点を除去し、加工時間を大幅
に短縮できるフロート研摩装置を提供することを目的と
する。SUMMARY OF THE INVENTION An object of the present invention is to provide a float polishing device that eliminates the drawbacks of the prior art described above and can significantly shorten machining time.
〈問題点を解決するための手段〉 本発明を、図面に基づいて説明する。〈Means for solving problems〉 The present invention will be explained based on the drawings.
第1図は本発明に係る超音波振動フロート研摩装置の要
部断面図である。FIG. 1 is a sectional view of essential parts of an ultrasonic vibration float polishing apparatus according to the present invention.
図において、1は超音波の信号を発生する発振器、2は
該発振器1からの信号をブラシ3を介して受け、軸aに
対して円周方向に微小量の角変位で超音波振動する超音
波振動子、4は該超音波振動子2で発生した振動をフロ
ート研摩皿5に伝達するためのホーンで、節部を用いて
外部回転体6とねじ等で固定されている。該フロート研
摩皿5はその表面に円周方向に微細溝が形成され、動圧
効果を発生させる。また、超音波振動子2.ホ−ン4及
びフロート研摩皿5は該超音波振動子2の固有振動数と
同一の固有振動数をもった共振系とし、この共振系全体
は加工タンク8の底部に回転可能でかつ水密構造に支持
された外部回転体6と同軸的に固着され、かつ該フロー
ト研摩皿5は加工タンク8内に位置しており、モーフ7
により該外部回転体6を介して軸3回りに回転するよう
になっている。In the figure, 1 is an oscillator that generates an ultrasonic signal, 2 is an ultrasonic wave that receives the signal from the oscillator 1 via a brush 3, and vibrates ultrasonically with a minute angular displacement in the circumferential direction with respect to the axis a. The sonic vibrator 4 is a horn for transmitting vibrations generated by the ultrasonic vibrator 2 to the floating polishing plate 5, and is fixed to the external rotary body 6 by screws or the like using a joint. The float polishing plate 5 has fine grooves formed in the circumferential direction on its surface to generate a dynamic pressure effect. In addition, ultrasonic transducer 2. The horn 4 and the float polishing plate 5 are a resonant system having the same natural frequency as that of the ultrasonic vibrator 2, and the entire resonant system is rotatably installed at the bottom of the processing tank 8 and has a watertight structure. The floating polishing plate 5 is coaxially fixed to an external rotary body 6 supported by the morph 7.
It is configured to rotate around the shaft 3 via the external rotating body 6.
9は例えは被研摩レンズのようなワークで、前記研摩皿
5に相対してホルダ10に保持され、モーフ11により
該ホルダ10とともに軸す回りに回転するようになって
いる。また、前記加工タンク8内には研摩剤を含む加工
液12が満され、該加工液12に前記フロート研摩皿5
及びワーク9が浸されている。A workpiece 9, such as a lens to be polished, is held in a holder 10 facing the polishing plate 5, and is rotated around an axis together with the holder 10 by a morph 11. The machining tank 8 is filled with a machining fluid 12 containing an abrasive, and the machining fluid 12 is filled with the float polishing plate 5.
and the workpiece 9 is immersed.
〈f牛用〉 次に、その作用を説明する。<For cattle> Next, its effect will be explained.
まず、加工液12に浸ったフロート研摩皿5をモーフ7
により外部回転体6を介して軸3回りに回転さぜると、
該フロ−1〜研摩皿5の溝面には動圧効果により重力方
向と反対向きに圧力を生じる。First, the float polishing plate 5 immersed in the machining fluid 12 is placed on the morph 7
When rotated around the axis 3 via the external rotating body 6,
Pressure is generated in the groove surfaces of the flow plates 1 to 5 in the direction opposite to the direction of gravity due to the dynamic pressure effect.
ここで、ワーク9をモーフ11によりホルダ10ととも
回転させながら、該ホルダ10で動圧以下の圧力をかけ
、フロート研摩皿5に押しつける。Here, the workpiece 9 is rotated together with the holder 10 by the morph 11 and is pressed against the float polishing plate 5 by applying a pressure equal to or lower than the dynamic pressure with the holder 10 .
そうすると、フロート研摩皿5とワーク9は非接触の状
態にありながらもワーク9は研摩剤の衝突により研摩さ
れる。Then, although the float polishing plate 5 and the workpiece 9 are in a non-contact state, the workpiece 9 is polished by the collision of the abrasive.
次に、発振器1の電源を入れると、発生した超音波の信
号がブラシ3を経て超音波振動子2に伝わり、ここで発
生した円周方向の超音波振動がホーン4、フロー!・研
摩皿5を経て最終的にはフロート研摩皿5とワーク9と
の間に介在する遊離砥粒へと伝達される。Next, when the oscillator 1 is turned on, the generated ultrasonic signal is transmitted to the ultrasonic vibrator 2 via the brush 3, and the circumferential ultrasonic vibration generated here causes the horn 4 to flow! - The abrasive grains are finally transmitted through the polishing plate 5 to the free abrasive grains interposed between the float polishing plate 5 and the workpiece 9.
このようにして、遊離砥粒に超音波振動が伝達されると
、遊離砥粒は微小振幅をもった振動をするため、単位時
間当りの運動軌跡が長く、また運動方向の規則性がなく
なり、砥粒の破砕が活発に行われるので、ワーク加工量
の増大され、短時間に加工できる。When ultrasonic vibrations are transmitted to free abrasive grains in this way, the free abrasive grains vibrate with minute amplitudes, resulting in long motion trajectories per unit time and lack of regularity in the direction of motion. Since the abrasive grains are actively crushed, the amount of workpiece processing can be increased and the workpiece can be processed in a short time.
〈実施例〉
第2図ないし第4図は、それぞれ本発明の種々の実施例
の要部を示すもので、第1図に示すものと同一44p分
は同一符号を付している。<Embodiments> FIGS. 2 to 4 show essential parts of various embodiments of the present invention, and the same 44 pages as shown in FIG. 1 are given the same reference numerals.
第2図はフロート研摩皿5の超音波振動方向がその回転
軸aの軸方向にしたものであり、第3図はフロート研摩
皿5を超音波振動させるのに代えてワ−り9側を発振器
21、超音波振動子22及びポーン24等により超音波
振動させたものであり、第4図はフロート研摩皿5を発
振器1、超音波振動−F2及びホーン4等により、ワー
ク9を発振器21、超音波振動子22及びホーン24等
により、それぞれ超音波振動が与えられるようにしたも
のである。In Fig. 2, the direction of ultrasonic vibration of the float polishing plate 5 is in the direction of its rotation axis a, and in Fig. 3, the direction of ultrasonic vibration of the float polishing plate 5 is set to the axial direction of its rotation axis a, and in Fig. 3, instead of vibrating the float polishing plate 5 ultrasonically, the workpiece 9 side is The float polishing plate 5 is vibrated ultrasonically by an oscillator 21, an ultrasonic vibrator 22, a pawn 24, etc., and in FIG. , ultrasonic vibrations are applied by an ultrasonic vibrator 22, a horn 24, etc., respectively.
〈発明の効果〉
本発明は、以上説明したようにフロート研摩皿又はワー
クに超音波振動させる装置を取付けた簡単な構造で、フ
ロート研摩時間を大幅に削減できる効果がある。<Effects of the Invention> As explained above, the present invention has a simple structure in which an ultrasonic vibration device is attached to a float polishing plate or a workpiece, and has the effect of significantly reducing float polishing time.
第1図は本発明に係るフロート研摩装置の構成を示す断
面図、第2図ないし第4図は本発明の種種の実施例で、
第2図は研摩皿を軸方向に超音波振動させたフロート研
摩装置の要部断面図、第3図はワークを超音波振動させ
たフロート研摩装置の要部断面図、第4図は研摩皿とワ
ークとを超音波振動させたフロート研摩装置の要部断面
図である。
1.21・・・発振器、2.22・・・超音波振動子、
4.24・・・ポーン、5・・・研摩皿、8・・・加工
タンク、9・・・ワーク、10・・・ホルダ、12・・
・加工液〇第1図
b
第2図
り
特開昭61.−71950(3)
第3図
(し
第4図FIG. 1 is a sectional view showing the structure of a float polishing device according to the present invention, and FIGS. 2 to 4 show various embodiments of the present invention.
Figure 2 is a sectional view of the main part of a float polishing device that vibrates the polishing plate ultrasonically in the axial direction, Figure 3 is a sectional view of the main part of the float polishing device that vibrates the workpiece ultrasonically, and Figure 4 is the polishing plate. FIG. 2 is a sectional view of a main part of a float polishing device in which a workpiece and a workpiece are vibrated ultrasonically. 1.21... Oscillator, 2.22... Ultrasonic transducer,
4.24... Pawn, 5... Polishing plate, 8... Processing tank, 9... Workpiece, 10... Holder, 12...
・Working fluid〇Figure 1b Figure 2 JP-A-61. -71950(3) Figure 3 (and Figure 4)
Claims (1)
波振動発生装置を取付けたことを特徴とする超音波振動
フロート研摩装置。1. An ultrasonic vibrating float polishing device, characterized in that it is equipped with an ultrasonic vibration generator for ultrasonic vibration of a float polishing plate or a workpiece.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59191739A JPS6171950A (en) | 1984-09-14 | 1984-09-14 | Ultrasonic vibration type float polishing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59191739A JPS6171950A (en) | 1984-09-14 | 1984-09-14 | Ultrasonic vibration type float polishing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6171950A true JPS6171950A (en) | 1986-04-12 |
JPH0369659B2 JPH0369659B2 (en) | 1991-11-01 |
Family
ID=16279691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59191739A Granted JPS6171950A (en) | 1984-09-14 | 1984-09-14 | Ultrasonic vibration type float polishing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6171950A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399234A (en) * | 1993-09-29 | 1995-03-21 | Motorola Inc. | Acoustically regulated polishing process |
EP0749805A1 (en) * | 1995-06-20 | 1996-12-27 | Valentinas Snitka | A diamond polishing method and apparatus |
WO1997000756A3 (en) * | 1995-06-20 | 1997-01-30 | Valentinas Snitka | A diamond polishing method and apparatus |
CN104723175A (en) * | 2015-03-11 | 2015-06-24 | 浙江工业大学 | Ultrasonic grinding micro female die machining device |
CN109605168A (en) * | 2018-11-30 | 2019-04-12 | 中国兵器科学研究院宁波分院 | A kind of system of processing of major diameter optical element |
CN113305653A (en) * | 2021-07-07 | 2021-08-27 | 胡靖烯 | Optical lens milling and grinding method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5544787A (en) * | 1978-09-27 | 1980-03-29 | Matsushita Electric Ind Co Ltd | Grinding method |
-
1984
- 1984-09-14 JP JP59191739A patent/JPS6171950A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5544787A (en) * | 1978-09-27 | 1980-03-29 | Matsushita Electric Ind Co Ltd | Grinding method |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399234A (en) * | 1993-09-29 | 1995-03-21 | Motorola Inc. | Acoustically regulated polishing process |
EP0749805A1 (en) * | 1995-06-20 | 1996-12-27 | Valentinas Snitka | A diamond polishing method and apparatus |
WO1997000756A3 (en) * | 1995-06-20 | 1997-01-30 | Valentinas Snitka | A diamond polishing method and apparatus |
CN104723175A (en) * | 2015-03-11 | 2015-06-24 | 浙江工业大学 | Ultrasonic grinding micro female die machining device |
CN104723175B (en) * | 2015-03-11 | 2016-12-07 | 浙江工业大学 | Ultrasonic grinding small die process equipment |
CN109605168A (en) * | 2018-11-30 | 2019-04-12 | 中国兵器科学研究院宁波分院 | A kind of system of processing of major diameter optical element |
CN109605168B (en) * | 2018-11-30 | 2021-09-14 | 中国兵器科学研究院宁波分院 | Processing system of large-diameter optical element |
CN113305653A (en) * | 2021-07-07 | 2021-08-27 | 胡靖烯 | Optical lens milling and grinding method |
Also Published As
Publication number | Publication date |
---|---|
JPH0369659B2 (en) | 1991-11-01 |
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