JPS6169661A - Transfer device in automatic press for severing ic lead frame - Google Patents

Abstract

PURPOSE:To aim at maintaining the timing between the feed motion and the elevating motion of an upper die, by providing such an arrangement that the front end part of a feed arm which is attached to a reciprocating member associated with an upper die elevating mechanism and which is provided with an engaging pawl is set to confront the upper surface of a guide rail for a lead frame. CONSTITUTION:In a transfer device C, when an upper die attaching bed lowers so that a guide rail 64 on a lower die attaching bed is pushed downward overcoming a spring, an IC lead frame I is pushed in so that an engaging hole 12 in the frame 1 comes off downward from an engaging pin on an engaging arm 79 to release the engagement between the arm 79 and the frame 1. At this time a reciprocating member 77 is reciprocated in association with the motion of a cam wheel 70, and therefore, is moved to its return side. Then, the rail 64 is returned to its original position under the action of the spring since the upper die attaching bed ascends together with the frame 1, and therefore, the engaging hole 12 is fitted onto the engaging pin on the arm 79 so that frame 1 is engaged with the arm 79. Then, the reciprocating member 77 is reciprocated so that the arm 79 is moved to the feed side to feed out the frame 1. With the repetition of such steps the timing is maintained to avoid breakages of the dies and the frame.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention involves cutting an IC from an IC lead frame.
The present invention relates to an improvement in a transfer device for transferring an IC lead frame supplied to a mold with a predetermined stroke in accordance with the operation of the mold in an automatic press device for cutting IC lead frames.

The IC is mounted on a lead frame 11 as shown in figure m1.
The IC lead frame 1 is formed by arranging them in multiple series (usually 7 series) in parallel. The automatic press device for cutting IC lead frames cuts the IC lead frames 1 that are arranged in parallel on the ICl0 cut frame 11, and cuts the IC lead frames 1 into single IC lead frames as shown in Fig. 3. 11
The IC lead frame is separated from the IC lead frame, and the separated ICl0 glue 10a is bent as shown in Fig. It is a device that moves with a predetermined stroke (usually two ICs).

This transfer device is adapted to be removably inserted into small-diameter engagement holes 12 formed in series with a predetermined pinch in the side frame 11a of the glue frame 11 of the IC lead frame 1. A feed arm equipped with a claw (B/) is inserted into the engaging hole 12 of the IC lead frame 1 of the engaging claw.
This is done by reciprocating along the transfer direction while repeating insertion and removal from...

By the way, in this transfer means, the engaging claw of the feed arm is
The timing of the operation of being inserted into the engagement hole 12 of the C lead frame 1 and the operation of moving the engagement arm forward in the transfer direction, and the timing of the engagement claw being removed from the engagement hole 12... With the timing of the movement and the movement of the feed arm reciprocating aligned, the reciprocating movement of the feed arm must be made to coincide with the lifting and lowering movement of the diamond.
It is very difficult to match these timings accurately and without mistakes, especially when the speed of each operation is increased to increase work efficiency. The movement to come out is incomplete.

There is a problem in that the feed arm performs a backward stroke while it is pulled into the engagement hole (ff 1), causing many damage to the IC lead frame 1 and the mold. .

The uninvented invention was made to solve this problem by ensuring that the timing of the feeding operation of the transfer device and the lifting and lowering operation of the upper mold mount are coincident, and also by providing a locking mechanism provided on the feed arm of the transfer device. Ensure that the timing of the insertion/removal of the mating claw into and out of the retaining hole provided in the IC lead frame matches the timing of the reciprocating motion of the feed arm, and the engagement claw of the feed arm It is an object of the present invention to provide a new transfer device that can be reliably removed from the engagement hole of the device.

In order to achieve this object, the transfer device in the automatic press device for cutting IC lead frames according to the present invention includes a lower mold mount fixedly mounted on the machine body, and a lower mold mount disposed above it to be moved up and down to the machine body. With an upper mounting base that can be freely mounted,
The lower and upper molds for cutting off the IC from the IC lead frame are assembled using an automatic press machine for cutting the IC lead frame 93, which has an elevating mechanism connected to the upper mold mount.
The lower mold mounting base is attached to the lower mold, and the lower mold is equipped with a force rail for attaching the IC lead frame to the lower mold so that it sinks a certain distance by colliding with the upper mold, and is raised by a spring. A reciprocating member is disposed on the side of the lower mold and reciprocates along the direction in which the IC lead frame is kited by the kite rail in conjunction with the elevating mechanism. IC on the bottom side of the tip of the double-acting member.
The feed arm is equipped with an engaging claw that fits into an engaging hole provided in the lead frame, and the tip thereof faces the upper surface of the guide rail assembled to the lower die. do.

Next, an example of implementation will be described in detail with reference to the drawings.

In FIG. 5, a is the body of an automatic press mounting device for cutting IC lead frames, 2 is a lower die mount that is fixedly mounted on the machine body a, and 3 is a lower die mount that is vertically opposed to the lower die mount 2. An upper mold mount 4 mounted on the machine body a so as to be arranged above the lower mold mount 2 and move up and down with respect to the lower mold mount 2.
1 shows a plurality of posts installed on the fuselage a to support the upper mold mount 3 and move it up and down. Also, in Figure 6, b
The loader 3C that loads the IC lead frame 1 is connected to the supply path that feeds the IC lead frame 1 into the mold that is assembled to the upper mold mount 3 and the lower mold mount 2 to perform the cutting process. IC loaded into the supply path by b
a transfer device that supplies the lead frame 1 to a mold that performs the cutting process, and sends out the lead frame 11, which is the leftover material after the ICl0 is cut by the mold, to the leftover discharge port d; e indicates an IC transport chute through which the ICl0 cut by the mold is carried out.

The upper die mount 3 has a through hole provided at its peripheral edge that is inserted into the upper end of a post 4 installed on the aircraft body a, and a retainer and a flange provided on the post 4 are inserted. 4a, and is fixed with a spacer 4b and a tightening screw 74C that tightens it, so that it can be integrally assembled and supported on the L end of the post 4 (Fig. 7). The mounting base 2 has through holes in three places, at both ends of the negative side and at the front and rear intermediate portions of the other side, into which the posts 4 for raising and lowering the upper die mounting base 3 are respectively inserted. It has just been opened. The posts 4 supporting the upper mold mount 3 fit into the through holes of the lower mold mount 2 so as to be slidable up and down, and protrude downward from the lower mold mount 2. The bottom edge of each

As shown in FIG. 8, it is connected to a lifting platform 40 disposed in the inner cavity of the aircraft body a, and the lifting platform 40 moves up and down in synchronization by being raised and lowered by the operation of the lifting mechanism W. It acts to move the upper mold mount 3 up and down. As shown in FIG. 8, the lifting mechanism W includes an assembly seat 41a.
41a, the bearing support members 41, 41 to be supported are installed in two rows in parallel with the axis lines of the bearing support parts 41b, 41b aligned, and these bearing support members 41, 41 are installed in parallel. The shaft 4 is attached to the bearing support portions 41b and 41b of
2 is supported across a rack via bearings, and a crank portion 42a is formed at the intermediate portion of the shaft 42, and the crank portion 4
The end of the reciprocating rod 43 whose base end is fitted to 2a is connected to the above-mentioned lifting platform 40 via the connecting shaft 44, and one end of the shaft 42 is connected to the transmission pulleys 45, 45 and the transmission belt 46. By conducting transmission with the output shaft of motor M through.

When the shaft 42 rotates due to the operation of the motor M, the reciprocating rod 43 reciprocates up and down, moves the lifting platform 40 upward, and lifts and lowers the three posts 4. However, by changing the crank portion 42a of the shaft 42 and the reciprocating rod 43 connected thereto to cam foils.

It may be designed as appropriate, such as when the lifting table 40 is raised and lowered by rotation of the cam wheel. 47
48 is a buffer spring provided between the above-mentioned bearing support member 41 and the lifting platform 40, and 48 is a guide cylinder of the boss 4 fixedly provided on the body a side.

Reference numeral 5 denotes an upper die of a mold for cutting an IC lead frame, which is assembled on the lower surface of the upper die mount 3;
As shown in FIG. 9, a fitting groove 3a having a dovetail cross section is inserted along the supply direction of the IC lead frame 1 (7), and the upper mold mounting base 3 is inserted in the front-rear direction (in the downward direction in FIG. 6). ), and is provided with a fitting part on the top side that is inserted into the fitting groove 3a and freely fitted, as shown in Fig. 1O and Fig. 12. As shown, IC lead frame 1
Punch 51 to drop resin 13 from = 51 and tie, <-
Punches 52 for cutting 14 and lead 10a
The punches 53, 53, etc. for cutting the paper are combined in pairs and are integrally connected in parallel in the above-mentioned transfer direction, and flat rail portions 54 are provided on both sides of each of the parallel punches. - 54 is assembled so as to move up and down by a certain distance with respect to the base 50, and is thereby formed into a cassette shape integrated with the base 50 that can be freely inserted and removed from the upper mold mounting base 3. It is.

The lower die 6 of the IC lead frame cutting die, which is assembled on the upper surface side of the lower die mount 2 so as to face the upper die 5 for IC lead frame cutting, is mounted on one side of the lower die mount 2. A fitting groove 2a having a channel-shaped cross section is formed on the surface side so as to pass through the lower die mounting base 2 in the front and rear directions (Fig. 9).
Then, a longitudinally long base 60 having a fitting part that can be inserted into and removed from the fitting 11112a is fitted, and the above-mentioned upper mold mounting 3 is attached to the second side of the base 60. Each punch 51, 51, 52-. Ties 61, 61 and tie bar 1 for cutting resin 13 corresponding to 52, 53, 53
4 cutting dies 62-62 and leads 10a cutting dies 63, 63 are integrally assembled in a state in which two sets of each are arranged in parallel in the supply direction (FIG. 13), and
At both ends of the base 60 in the front-rear direction (supply direction) and on both left and right sides.

The parallel dies 61..., 62..., 63...
A longitudinally long guide rail 64 formed so as to surround the base 60 and each of the parallel dies,
The bar 26 is assembled so as to move up and down a certain distance.
5 to push it upward, and as a result,
These constitute a cartridge-shaped lower mold 6 that is integrally connected to a base 60 that can be inserted into and removed from the lower mold mounting base 2. The dies 61..., 62..., 63... are formed with recesses 66, 66 which are lowered further in the areas facing the negative side (see Figure 14 and Figure 9). A tunnel-shaped guide is provided on the other side of the idle rail 64 facing the dies 63, 63 for transporting the ICl0 cut and separated from the IC lead frame 1 by the die 63@63 to the side by air. Roads 67 and 67 are formed.

The transfer device C horizontally supports a camshaft 71 provided with a cam foil 70 on the upper surface of the machine body a at a side position of the lower mold mount 2 mentioned above, and this camshaft 71 is mounted on the above-mentioned one-h type mounting. stand 3
The shaft 42 of the elevating mechanism W, and the hepelca 72.
72 and the transmission shaft 73, the transmission is transmitted to the cam wheel 70 through the transmission gears 74-74, and as shown in FIG. 15, as shown in FIG.
An arm 75 that rotates arbitrarily is linked, and the rotating end of the arm 75 is connected to a bearing support part 76/7 provided on the upper surface of the y1 body a.
The reciprocating member 77 is connected to the reciprocating member 77 that supports the IC lead frame 6 so as to slide back and forth, and the reciprocating member 77 is fitted into the engagement hole 12 provided in the side frame ILa of the IC lead frame 1 on the lower surface of the tip end. Engagement arm 79... provided with engagement pin 78...
The above-mentioned kite rail 6 is assembled into the lower mold 6 by attaching the engaging pin 78 of the engaging arm 79 to the tip of the engaging arm 79.
The guide rails 64 are placed on the upper surface of both the front and rear ends of 4.
In the state of being raised by the bias of the lever 65, the engagement hole 12 formed in the side frame 11a of the IC lead frame l placed on the upper surface of the guide rail 64 is inserted into the engagement hole 12... It is constructed by setting and facing the engagement pins 78 implanted on the lower surface of the distal end of the coupling arm 79 at a height position where they are fitted.

Then, the lifting operation mechanism W that raises and lowers the upper mold mount 3, the reciprocating operation of the reciprocating member 77 that reciprocates by the cam 70 that is rotated by transmission through the transmission shaft 73, and the lifting operation mechanism W. The operation of the upper die mounting base 3 that moves up and down is as follows.
During the process in which the upper die mount 3 is lowered and the upper die 5 attached to it is pushing down the kite rail 64 provided on the lower die 6 against the bias of the spring 65, the cam 70 is activated. The reciprocating member 77 is caused to perform a forward stroke, and the cam 70 is caused to perform a backward stroke of the reciprocating member 77 while the upper mold mount 3 is transitioning from the end of the upward stroke to the beginning of the downward stroke. Set the timing and make them work together.

Therefore, in this transfer device C, the upper die mounting base 3 is lowered,
The kite rail 64 of the lower mold 6 assembled on the lower mold mount 2 is pushed downward against the bias of the spring 65, and the IC lead frame 1 is attached to the guide rail 64 together with the guide rail 64.
By being pushed downward, the engaging hole 12 of the IC lead frame 1 or the engaging pin 7 of the engaging arm 79
8, the retaining arm 79 is disengaged from the IC lead frame l, and in this state, the reciprocating member 77 performs a backward stroke due to the operation of the cam wheel 70. Then, as the upper mold mounting base 3 rises, the guide rail 64 of the lower mold 6 rises to its old position by the spring 65, and the IC lead frame 1 on the guide rail 64 moves to the return side. The engaging holes 12 . . . provided in the side frame 11 a of the engaging arm 79 are inserted into the engaging pins 78 . Then, in this state, the reciprocating member 77 performs a forward stroke, causing the engagement arm 79 to move to the feeding side, thereby feeding out the IC lead frame 1, and attaching the upper mold to that state. As the upper die 5 descends together with the stand 3, the engagement pins 78... and the engagement holes 12... are disengaged again, and this process is repeated to feed the IC plate frame 1. It acts to do the following.

The retaining arm 7 is connected to the reciprocating member 77 at its base end.
9 and extends to the opposite side. The regulating arm 80 is configured such that the engaging member 79 is moved by the reciprocating motion of the reciprocating member 77.
When performing the feeding action of the C lead frame 1, the height position of the tip of the engagement arm 79 changes up and down due to the rotational movement of the reciprocating member 77, so that the IC lead of the engagement bin 78 is moved. This restriction arm is for restricting the movement of the reciprocating member 77 in the rotational direction in order to prevent malfunctions in engaging and disengaging the frame l with respect to the engaging holes 12. A ruler ring 81 is pivotally supported at the tip of the fuselage 80, and the ruler ring 81 moves together with the reciprocating member 77 in contact with the lower surface of a ruler plate 82 fixed to the machine body a, so that the t? It acts to restrict the rotational movement of the reciprocating member 77 and to maintain the height position of the distal end of the engagement arm 79 constant.

Note that f is provided on the side of the mold consisting of the upper mold 5 and the lower mold 6, at an intermediate position between the reciprocating member 77 that reciprocates in the left and right directions of the transfer device C, and is placed inside the mold. A clamp that grasps the side edge of the inserted IC lead frame 1 and sends it in the transport direction.
1 front and back as shown in Figure 15 (left and right in Figure 15)
A pair of brackets 90 and 90 are arranged and fixed to the F side of the fuselage a, and a vertical guide rod 9 is attached to each of them.
7-hi lower movement block 91 provided to move up and down by 1a
Between the vertically movable blocks 91 and 91, there are two wooden guide shafts 92-92 arranged in parallel under E, and a sliding member 93-92 slidably supported on the guide shaft 92. 9
3, a fixed clamp arm 94 fixed to the side wall of each of the opposing surfaces of the sliding members 93, 93, and a fixed clamp arm 94 facing one side of the fixed clamp arm 94 and rotating up and down about a fulcrum shaft 95a. Movable clamp arm 9 pivoted for movement
5 and the movable clamp arms 95-95, the connecting arm 96 which connects the proximal ends of the movable clamp arms 95-95 is integrally connected to the reciprocating member 77 in the front and back direction and moves, but the reciprocating member 77 is connected to the reciprocating member 77 below On the other hand, I want you to move freely! 1! a connecting block 97, and a vertically movable rod 101 that is in contact with one surface side of a roller lOO provided on the connecting arm 96 and that moves the connecting 7-m 96 downward by the downward movement of the vertically movable blocks 91, 91. , a movable clamp arm 95 and a fixed clamp arm 94 are connected by a linking bin 102 that links the vertically movable blocks 91, 91 and the guide rail 64 provided on the lower die 6.
When the upper mold mounting base 3 is raised, it is in an open state, and when the kite rail 64 of the lower mold 6 is lowered, it is in a closed state, and by repeating this operation and moving together with the reciprocating member 77, It acts to send out the IC lead frame 1.

As described above, the transfer device in the automatic press apparatus for cutting IC lead frames according to the present invention includes a holding arm 79 that moves the IC lead frame 1 relative to the mold consisting of the mold 5 and the lower mold 6. The reciprocating operation of the upper die 5
This is carried out by the reciprocating member 77 which is operated by being transmitted through the shaft 42 and transmission shaft 73 of the lifting mechanism W that lifts and lowers the lifting mechanism W. The tie-lock with the transport movement of the lead frame 1 can be precisely synchronized. Then, the engagement 6 arm 79 is kept from moving downward, and the kite rail 64 provided on the lower mold 6 moves toward the engagement arm 79 by pushing the upper mold 5D and releasing it. By renovating the IC lead frame 1. Since the l itself moves downward relative to the engagement arm 79 to engage and disengage from the engagement bin 78, the timing between this engagement and disengagement operation and the lifting and lowering operation of the upper mold 5 is also precise (this is maintained). Moreover, since the operation of removing the engagement pins 78 from the engagement holes 12 of the IC lead frame 1 is performed by forcibly pushing down the IC lead frame 1 with the upper die 5, this IC lead frame 1, the operation of removing the retaining bottle 78 from 1 can be reliably performed.

[Brief explanation of the drawing]

@Figure 1 is a plan view of the IC lead frame, Figure 2 is a plan view showing each cutting process of the above, Figure 3 is a plan view of the separated IC, and Figure 4 is a plan view of the same IC with a part of the glue molded. A side view, FIG. 5 is a front view of an IC lead frame cutting edge automatic removal device in which the present invention can be implemented, FIG. 6 is a plan view of the same device, and FIG. 7 is a support portion of the upper mold mount of the same device. FIG. 8 is a partially cutaway front view of the lifting mechanism of the same hill-shaped mount, and FIG. 9 is a longitudinal sectional front view of the mold part of the same device. The figure is a longitudinal sectional side view of the mold part of the above device, FIG. 11 is a bottom view of the same device assembled to the L-shaped mounting base of the dome mold, and FIG. 12 is a bottom view of the dome mold of the same device.
Fig. 13 is a plan view of the lower mold of the same device, Fig. 14 is a plan view of the lower mold of the same device assembled to the lower mold mounting base, and Fig. 15 is a plan view of the lower mold of the same device.
The figure is a F side view of the transfer device section of the same device, FIG. 16 is a partially cutaway side view of the transfer device section of the same device, and FIG. 17 is a partially cutaway side view of the transfer device section of the F-' device. front view, No. 18
The figure is a partially cutaway front view of the clamp section of the device, and FIG. 19 is a partially cutaway side view of the clamp section. Diagram im code explanation A: Automatic press mounting equipment for cutting IC lead frames.
...Airframe b...Loader C...Transfer device d...
・Exhaust port e...IC1f? Feed chute f...Clamp 1...IC lead frame 10...IC10
a...Lead 11...Lead frame lla...Side frame 12...
...Engagement hole 13...Resin 14...Tie bar 2.
...Lower mold mounting base 3...Upper mold mounting base 2a, 3a...
・Fitting groove 4...boss) 4a...locking collar 4b...
・Spacer 40...Tightening screw 40...Lifting platform
41... Bearing support member 41a... Assembly seat 4
1b... Bearing support part 42... Shaft 42a.
・・Crank part 43 ・・Reciprocating rod 44 ・・Connection shaft 45 ・・Transmission boot 9- 46 ・・・Transmission belt 47
...Buffer spring 48...Guide tube 5...Upper mold
51, 52, 53... Punch 54... Rail part 6... Lower mold 50, 60... Base 61, 62
・63...Gui 64...Guide rail 65...Spring 66...
Recessed portion 70...Cam wheel 71...Camshaft 72.
... Bevel gear 73 ... Transmission shaft 74 ... Transmission gear 75 ... Arm 75a ... Fulcrum shaft 7
6...Bearing support part 77...Reciprocating member 78...
・Engagement pin 79...Engagement arm 80...Restriction arm 81...Ruler wheel 82...Ruler plate 90・
... Bracket) 91 ... Vertical movement block 91a
... Guide rod 92 ... Guide shaft 93 ... Sliding member 94 ... Fixed clamp arm 95 ... Movable crib arm 95a ... Fulcrum shaft 96 Connection arm 97 ... Connection block 100 ...・Colo 101...-Lower moving rod 102 River connecting pin cam 70...Motor W...
- Lifting operation mechanism N3 Procedural amendment (voluntary) to Figure 4 and Figure 13 December 7, 1980 Patent Application No. 1932'37, Issue B1
-Relationship Applicant

Claims (1)

[Claims] The lower mold mount is fixedly mounted on the fuselage, and the upper mold mount is arranged above it and mounted on the fuselage so that it can be raised and lowered.
C. In an automatic press device for cutting IC lead frames, in which a lower die and an upper die are respectively assembled to cut the IC from the lead frame, and an elevating mechanism is connected to the upper die mount, a lower die to be assembled to the lower die mount is assembled. The guide rail for guiding the IC lead frame is assembled to the lower mold so that it will sink a certain distance by colliding with the upper mold, and is biased upward by a spring, and the guide rail is attached to the side of the lower mold. is provided with a reciprocating member that is connected to the elevating mechanism and reciprocates along the direction in which the IC lead frame is guided by the guide rail, and the reciprocating member has an IC lead frame attached to the lower surface side of the distal end of the reciprocating member. An automatic press for cutting IC lead frames, which is equipped with a feed arm equipped with an engagement claw that fits into an engagement hole provided in the die, and has its tip facing the upper surface of the guide rail assembled to the lower die. Transfer device in equipment.