JPS6169156A - 半導体用放熱装置 - Google Patents

半導体用放熱装置

Info

Publication number
JPS6169156A
JPS6169156A JP19100484A JP19100484A JPS6169156A JP S6169156 A JPS6169156 A JP S6169156A JP 19100484 A JP19100484 A JP 19100484A JP 19100484 A JP19100484 A JP 19100484A JP S6169156 A JPS6169156 A JP S6169156A
Authority
JP
Japan
Prior art keywords
semiconductor
radiator
hold
fitting
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19100484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312779B2 (enrdf_load_html_response
Inventor
Yasuhiro Nishiyama
泰弘 西山
Eiji Oosako
大佐古　英治
Susumu Adachi
進 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP19100484A priority Critical patent/JPS6169156A/ja
Publication of JPS6169156A publication Critical patent/JPS6169156A/ja
Publication of JPH0312779B2 publication Critical patent/JPH0312779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP19100484A 1984-09-12 1984-09-12 半導体用放熱装置 Granted JPS6169156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19100484A JPS6169156A (ja) 1984-09-12 1984-09-12 半導体用放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19100484A JPS6169156A (ja) 1984-09-12 1984-09-12 半導体用放熱装置

Publications (2)

Publication Number Publication Date
JPS6169156A true JPS6169156A (ja) 1986-04-09
JPH0312779B2 JPH0312779B2 (enrdf_load_html_response) 1991-02-21

Family

ID=16267267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19100484A Granted JPS6169156A (ja) 1984-09-12 1984-09-12 半導体用放熱装置

Country Status (1)

Country Link
JP (1) JPS6169156A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380853U (enrdf_load_html_response) * 1986-11-14 1988-05-27

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110059U (enrdf_load_html_response) * 1974-07-08 1976-01-24
JPS574238U (enrdf_load_html_response) * 1980-06-06 1982-01-09
JPS5886752A (ja) * 1981-11-18 1983-05-24 Matsushita Electric Ind Co Ltd 発熱部品取付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110059U (enrdf_load_html_response) * 1974-07-08 1976-01-24
JPS574238U (enrdf_load_html_response) * 1980-06-06 1982-01-09
JPS5886752A (ja) * 1981-11-18 1983-05-24 Matsushita Electric Ind Co Ltd 発熱部品取付装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6380853U (enrdf_load_html_response) * 1986-11-14 1988-05-27

Also Published As

Publication number Publication date
JPH0312779B2 (enrdf_load_html_response) 1991-02-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term