JPS6167987A - 半田デイツプ方法 - Google Patents

半田デイツプ方法

Info

Publication number
JPS6167987A
JPS6167987A JP18960584A JP18960584A JPS6167987A JP S6167987 A JPS6167987 A JP S6167987A JP 18960584 A JP18960584 A JP 18960584A JP 18960584 A JP18960584 A JP 18960584A JP S6167987 A JPS6167987 A JP S6167987A
Authority
JP
Japan
Prior art keywords
solder
dipping
semiconductor device
electronic component
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18960584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469430B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
古川　道明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP18960584A priority Critical patent/JPS6167987A/ja
Publication of JPS6167987A publication Critical patent/JPS6167987A/ja
Publication of JPH0469430B2 publication Critical patent/JPH0469430B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP18960584A 1984-09-12 1984-09-12 半田デイツプ方法 Granted JPS6167987A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18960584A JPS6167987A (ja) 1984-09-12 1984-09-12 半田デイツプ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18960584A JPS6167987A (ja) 1984-09-12 1984-09-12 半田デイツプ方法

Publications (2)

Publication Number Publication Date
JPS6167987A true JPS6167987A (ja) 1986-04-08
JPH0469430B2 JPH0469430B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-06

Family

ID=16244105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18960584A Granted JPS6167987A (ja) 1984-09-12 1984-09-12 半田デイツプ方法

Country Status (1)

Country Link
JP (1) JPS6167987A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112355A (ja) * 1981-12-26 1983-07-04 Fujitsu Ltd 電子部品における予備半田付け方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112355A (ja) * 1981-12-26 1983-07-04 Fujitsu Ltd 電子部品における予備半田付け方法

Also Published As

Publication number Publication date
JPH0469430B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-06

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