JPS6167983A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS6167983A JPS6167983A JP19000684A JP19000684A JPS6167983A JP S6167983 A JPS6167983 A JP S6167983A JP 19000684 A JP19000684 A JP 19000684A JP 19000684 A JP19000684 A JP 19000684A JP S6167983 A JPS6167983 A JP S6167983A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- printed wiring
- wiring board
- sheet
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、放熱効果及び電磁遮蔽効果を有した印刷配線
板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a printed wiring board having a heat radiation effect and an electromagnetic shielding effect.
周知の如く、第１図（ａ） 、 （ｂ）に示す如く印刷
配線基板！上にＤＩＰ型ＩＣ２や抵抗３等の電子部品を
実装した印刷配線板においては、電子部品からの放熱や
外部からの電磁遮蔽効果を持たせることが重要である。As is well known, printed wiring boards as shown in FIGS. 1(a) and 1(b)! In a printed wiring board on which electronic components such as a DIP type IC 2 and a resistor 3 are mounted, it is important to provide heat dissipation from the electronic components and electromagnetic shielding effects from the outside.
従来、放熱手段としては、Ａｄ８７ＪＯ工した放熱器や
放熱板を放熱部品に接触させることが知られている。し
かしながら、この場合、印刷配線基板上に占有する面積
が大きいため、部品の実装密度が低（なる。また、電磁
遮蔽効果を持たせる手段としては、■接地した箱形金属
により実装した電子部品を遮蔽する方法、■多層印刷配
線基板を用い、内層基材に接地層を設ける方法、あるい
は■両面印刷配線基板を用い、片面の電子部品ピンが挿
入される部分を除（所に銅箔等を形成しこれを接地する
方法などが考えられている。しかしながら、■の場合は
箱形金属の゛加工や取り付けるスペースの確保が困難で
ある。また、■、■の場合、印刷配線板の設計、製造の
納期、価格の点で問題が多く、部品コストの上昇を招く
。Conventionally, as a heat dissipation means, it is known that a heat dissipation device or a heat dissipation plate manufactured by Ad87JO is brought into contact with a heat dissipation component. However, in this case, since the area occupied on the printed wiring board is large, the mounting density of the components is low.In addition, as a means to provide an electromagnetic shielding effect, Shielding methods include: - Using a multilayer printed wiring board and providing a ground layer on the inner layer base material, or - Using a double-sided printed wiring board, excluding the part where electronic component pins are inserted on one side (with copper foil etc. However, in the case of (2), it is difficult to process the box-shaped metal and secure space for installation.In the case of (2) and (2), it is difficult to design the printed wiring board, There are many problems in terms of manufacturing delivery time and price, leading to an increase in parts costs.
本発明は上記事情に鑑みてなされたもので、放熱効果及
び電磁遮蔽効果の両方の性質を容易に得ることのできる
印刷配線板を提供することを目ｅ勺とする。The present invention has been made in view of the above circumstances, and its aim is to provide a printed wiring board that can easily obtain both heat dissipation effect and electromagnetic shielding effect.
本発明は、印刷配線基板上の少なくとも電子部品が実装
される部分にシートを設け、このシートを接着剤層と絶
縁層と金属層とから楊成することによって、放熱効果、
’１ｉｌｉＢＲ蔽効果の両方の性質を容易に得ようとし
たものである。The present invention provides a sheet on at least a portion of a printed wiring board where electronic components are mounted, and this sheet is made up of an adhesive layer, an insulating layer, and a metal layer, thereby improving the heat dissipation effect.
This is an attempt to easily obtain both properties of the '1iliBR shielding effect.
以下、本発明の一実施例を第２９及び第３図（ａｌ 、
（ｂｌを参照して説明する。なお、第１図（ａ）。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 29 and 3 (al,
(This will be explained with reference to bl. In addition, FIG. 1(a).
（ｂ）と同部材のものは同符号を付して説明する。Components that are the same as those in (b) will be described with the same reference numerals.
１中の１１は、印刷配線基板ｌ上の大部分に設けられた
自由に切断可能なシートである。このシート１１は、例
えば第３図（ａ） 、 （ｂｌに示す如く、下層側から
順に接着剤層１２と第１の絶縁層１３とｋｌｆｍｔ４と
第２の絶縁層１５の４層構造からなり、前記ｈｌ１層１
４は接地されている。11 is a freely cuttable sheet provided on most of the printed wiring board l. This sheet 11 has a four-layer structure consisting of an adhesive layer 12, a first insulating layer 13, a klfmt4, and a second insulating layer 15 in order from the bottom layer, as shown in FIGS. 3(a) and (bl), for example. Said hl1 layer 1
4 is grounded.
こうした４層構造のシートｌｌには、格子状に円又は多
角形の複数の穴Ｚ６・・・が開口されている。これらの
穴Ｉ６・・・には、既述したＤＩＰ型ＩＣ２や抵抗３の
ピン２Ｊ・・・が挿入される。なお、前記シートＩｌの
表面には１、電子部品を基板ｌに実装するためにコンポ
ーネントマーク（図示せず）が表示されている。A plurality of circular or polygonal holes Z6 are opened in the four-layered sheet 11 in a grid pattern. The pins 2J of the DIP type IC 2 and the resistor 3 described above are inserted into these holes I6. Note that a component mark (not shown) is displayed on the surface of the sheet Il for mounting electronic components on the board l.
しかして、本発明によれば、ＤＩＰ型Ｉ（，２や抵抗３
の電子部品が実装される印刷配線基板！上に接着剤１＠
１２、第１の絶縁層１３、ｈｌ１層１４及び第２の絶縁
層１５からなるシート１１が設けられた構造となりて２
す、かつｈｌＪ＠ｔ４が放熱効果やｌｉｔ磁遮蔽効果に
優れるため、簡単な手段で放熱効果、電磁遮蔽効果の両
特性を有した印刷配線板を得ることができる。According to the present invention, DIP type I (,2 and resistor 3
A printed wiring board on which electronic components are mounted! Adhesive 1 on top
12, a structure in which a sheet 11 consisting of a first insulating layer 13, a HL1 layer 14, and a second insulating layer 15 is provided;
In addition, since hlJ@t4 has excellent heat dissipation effect and lit magnetic shielding effect, a printed wiring board having both properties of heat dissipation effect and electromagnetic shielding effect can be obtained by simple means.
また、Ａ１層Ｉ４が接地されているため、印刷配線板の
中を走る多種の信号をＡ＃４７４より外部等の雑音等か
ら防ぐことができる。Further, since the A1 layer I4 is grounded, various signals running inside the printed wiring board can be prevented from external noises etc. from the A#474.
更に、シートｌｌの上層は第２の絶縁層Ｉ５となってい
るため、ＤＩＰ型ＩＣ２や抵抗３の電子部品の真下及び
その周辺に８ける絶縁状態を良好に保持できる。Furthermore, since the upper layer of the sheet 11 is the second insulating layer I5, a good insulation state can be maintained directly under and around the electronic components such as the DIP type IC 2 and the resistor 3.
更には、シートＩｌ上にコンポーネントマークが表示さ
れているため、電子部品を容易に基板に実装できる。Furthermore, since the component mark is displayed on the sheet Il, electronic components can be easily mounted on the board.
なお、上記実施例では金属層としてｈ１層を用いた場合
について述べたが、これに限らない。In addition, although the case where the h1 layer was used as a metal layer was described in the said Example, it is not limited to this.
例えば、銅層、パーマロイ層、シェーパロイ層を用いて
もよい。かかる金属層を用いれば、電磁遮蔽効果を有し
た印刷配線板を得ることができる。For example, a copper layer, permalloy layer, or shaperloy layer may be used. By using such a metal layer, a printed wiring board having an electromagnetic shielding effect can be obtained.
また、上記実施例では、４層構造のシートの場合につい
て述べたが、これに限らず、例えば第４図に示すヌロく
、接着剤層１２、第１の絶縁層１３、電磁遮蔽金属層１
７、第２の絶縁層１５、放熱金属層１８及び第３の絶縁
層１９の６層構造のシートでもよい。かかるシートを用
いた印刷配線板によれば、放熱効果及び電磁遮蔽効果を
得ることかできる。なお、第５図に示す如く、接着剤）
−１２、第１の絶縁層１３及び放熱金属層１８の３層構
造のシートでもよい。かかるシートを用いた印刷配線板
ｌこよれば、放熱効果を得ることができる。Further, in the above embodiments, the case of a sheet having a four-layer structure is described, but the invention is not limited to this. For example, as shown in FIG.
7. The sheet may have a six-layer structure including the second insulating layer 15, the heat dissipating metal layer 18, and the third insulating layer 19. A printed wiring board using such a sheet can provide heat dissipation effects and electromagnetic shielding effects. In addition, as shown in Figure 5, adhesive)
-12, the sheet may have a three-layer structure including the first insulating layer 13 and the heat dissipating metal layer 18. A printed wiring board using such a sheet can provide a heat dissipation effect.
以上詳述した如く本発明ζこよれば、放熱効果及び電磁
遮蔽効果を容易に得ることのできる印刷配線板を提供で
きるものである。As detailed above, according to the present invention, it is possible to provide a printed wiring board that can easily obtain heat dissipation effects and electromagnetic shielding effects.
第１図（ａｌは従来の印刷配勝板の斜視因、同図（ｂ）
は同図（ａ）のｘ−ｘＨに后う断面図、第２凶は本発明
の一実施例に係る印刷配線板の断ＵｉＩ図、第３図（、
ＪはＭ２図の印刷配線基板に係るシートの平面図、同図
（ｂ）は同一（ａＪのＹ−Ｙ縁に沿う断面図、第゛４図
及び第５因は夫々その他のシートの断面図である。
！・・・印刷配線基板、２・・・ＤＩＰ型ＩＣ，、？・
・・抵抗、ＩＩ・・・シート、１２・・・接着剤層、１
３゜１５．１９・・・絶縁層、１４・・・Ａｌ層（金属
層）、１６・・・人、ＩＩ・・・ｔａ遮断金属層、１８
・・・放熱金属層。
出願人代理人 弁理士 鈴 江 武 彦第１図
（ａ）
第２図
第３図Figure 1 (al is the perspective factor of the conventional printed distribution board, the same figure (b)
is a cross-sectional view taken along line x-xH in FIG.
J is a plan view of the sheet related to the printed wiring board in figure M2, the figure (b) is the same (a sectional view along the Y-Y edge of J, and figures 4 and 5 are sectional views of other sheets, respectively) !...Printed wiring board, 2...DIP type IC,...?-
...Resistance, II...Sheet, 12...Adhesive layer, 1
3゜15.19... Insulating layer, 14... Al layer (metal layer), 16... Person, II... ta blocking metal layer, 18
...heat dissipation metal layer. Applicant's representative Patent attorney Takehiko Suzue Figure 1 (a) Figure 2 Figure 3
Claims (2)
品が実装される部分に設けられたシートとを具備し、前
記シートが接着剤層と絶縁層と放熱効果及び電磁遮蔽効
果を有した金属層とから構成され、かつ金属層が接地さ
れていることを特徴とする印刷配線板。(1) Comprising a printed wiring board and a sheet provided on at least a portion of the board where electronic components are mounted, the sheet being a metal layer having an adhesive layer, an insulating layer, and a heat dissipation effect and an electromagnetic shielding effect. 1. A printed wiring board characterized in that the metal layer is grounded.
許請求の範囲第１項記載の印刷配線板。(2) The printed wiring board according to claim 1, characterized in that an Al layer is used as the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19000684A JPS6167983A (en) | 1984-09-11 | 1984-09-11 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19000684A JPS6167983A (en) | 1984-09-11 | 1984-09-11 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6167983A true JPS6167983A (en) | 1986-04-08 |
Family
ID=16250808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19000684A Pending JPS6167983A (en) | 1984-09-11 | 1984-09-11 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6167983A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022538291A (en) * | 2019-06-28 | 2022-09-01 | ニコベンチャーズ トレーディング リミテッド | Apparatus for aerosol generating device |
-
1984
- 1984-09-11 JP JP19000684A patent/JPS6167983A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022538291A (en) * | 2019-06-28 | 2022-09-01 | ニコベンチャーズ トレーディング リミテッド | Apparatus for aerosol generating device |
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