JPS6166931U - - Google Patents
Info
- Publication number
- JPS6166931U JPS6166931U JP15240984U JP15240984U JPS6166931U JP S6166931 U JPS6166931 U JP S6166931U JP 15240984 U JP15240984 U JP 15240984U JP 15240984 U JP15240984 U JP 15240984U JP S6166931 U JPS6166931 U JP S6166931U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- fusible resin
- electronic component
- pair
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 6
- 239000002648 laminated material Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 2
- 229920000554 ionomer Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
Description
第１図および第２図は本考案の一実施例に係る
フイルムパツケージ形電解コンデンサを示すもの
で、第１図は平面図、第２図は第１図イ−イ断面
図、第３図は第１図および第２図を構成する三層
ラミネート積層材を示す斜視図、第４図は他の実
施例に係る三層ラミネート積層材を示す斜視図、
第５図は従来の参考例に係るフイルムパツケージ
形電子部品の構成を説明するための斜視図である
。
１…アルミ箔、２…ハンダ付け可能な金属箔、
３…外周部、４，１３…欠如部、５…熱融着性樹
脂シート、７…三層ラミネート積層材、８…接続
端子、９…コンデンサ素子、１０…シール部、１
２…三層ラミネート積層材。
1 and 2 show a film package type electrolytic capacitor according to an embodiment of the present invention. FIG. 1 is a plan view, FIG. FIG. 4 is a perspective view showing a three-layer laminate material according to another embodiment;
FIG. 5 is a perspective view for explaining the structure of a film package type electronic component according to a conventional reference example. 1... Aluminum foil, 2... Solderable metal foil,
3... Outer peripheral part, 4, 13... Missing part, 5... Heat-fusible resin sheet, 7... Three-layer laminate material, 8... Connection terminal, 9... Capacitor element, 10... Seal part, 1
2...Three-layer laminate material.
Claims (1)
略中心部に欠如部を有する熱融着性樹脂シートと
の中間にアルミ箔を介在させた一対の三層ラミネ
ート積層材と、該一対の積層材の熱融着性樹脂シ
ート間に挾持した電子部品素子と、該素子と前記
欠如部に位置するアルミ箔部とを接続した一対の
接続端子と、前記熱融着性樹脂シート同志の接触
周辺全体に設けたシール部とを具備したことを特
徴とするフイルムパツケージ形電子部品。 (2) ハンダ付け可能な金属が銅、ニツケル、鉄
などからなることを特徴とする実用新案登録請求
の範囲第(1)項記載のフイルムパツケージ形電子
部品。 (3) 熱融着性樹脂シートがアイオノマー、ポリ
エチレン、ポリプロピレン、アイオノマー−ポリ
エチレンの混合物からなることを特徴とする実用
新案登録請求の範囲第(1)項または第(2)項記載の
フイルムパツケージ形電子部品。[Claims for Utility Model Registration] (1) A pair of three-piece metal foil in which aluminum foil is interposed between a solderable metal foil and a heat-fusible resin sheet having a notch in the center excluding the outer periphery. a layer laminate material, an electronic component element sandwiched between the heat-fusible resin sheets of the pair of laminate materials, a pair of connection terminals connecting the element and the aluminum foil portion located in the missing portion; A film package cage-type electronic component characterized by comprising a seal portion provided around the entire contact area between heat-fusible resin sheets. (2) The film package type electronic component according to claim (1) of the utility model registration, characterized in that the solderable metal is made of copper, nickel, iron, etc. (3) The film package type according to claim 1 or 2 of the utility model registration claim, wherein the heat-fusible resin sheet is made of an ionomer, polyethylene, polypropylene, or a mixture of ionomer and polyethylene. electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15240984U JPS6166931U (en) | 1984-10-09 | 1984-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15240984U JPS6166931U (en) | 1984-10-09 | 1984-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6166931U true JPS6166931U (en) | 1986-05-08 |
Family
ID=30710470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15240984U Pending JPS6166931U (en) | 1984-10-09 | 1984-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166931U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55107225A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Electric double layer capacitor and method of manufacturing same |
-
1984
- 1984-10-09 JP JP15240984U patent/JPS6166931U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55107225A (en) * | 1979-02-09 | 1980-08-16 | Matsushita Electric Ind Co Ltd | Electric double layer capacitor and method of manufacturing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6114650B2 (en) | ||
| JPS61103668U (en) | ||
| JPS5830297U (en) | Chip type discharge element | |
| JPS6166931U (en) | ||
| JPH01127231U (en) | ||
| JPH0150097B2 (en) | ||
| JP2531404Y2 (en) | Thin electric double layer capacitor | |
| JPS6355423U (en) | ||
| JPS6112667Y2 (en) | ||
| JPS6237915U (en) | ||
| JPS634428Y2 (en) | ||
| JPS6221527U (en) | ||
| JPH0338624U (en) | ||
| JPS6242231U (en) | ||
| JPS60181996U (en) | Electrode terminal extraction structure | |
| JPH0310423U (en) | ||
| JPS6276506U (en) | ||
| JPH02189U (en) | ||
| JPS62162824U (en) | ||
| JPS62146319U (en) | ||
| JPS62182725U (en) | ||
| JPS6264002U (en) | ||
| JPS6166934U (en) | ||
| JPS61177348U (en) | ||
| JPS6194332U (en) |