JPS6166934U - - Google Patents
Info
- Publication number
- JPS6166934U JPS6166934U JP15240884U JP15240884U JPS6166934U JP S6166934 U JPS6166934 U JP S6166934U JP 15240884 U JP15240884 U JP 15240884U JP 15240884 U JP15240884 U JP 15240884U JP S6166934 U JPS6166934 U JP S6166934U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- pair
- fusible resin
- resin sheet
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000002648 laminated material Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims 3
- 239000004698 Polyethylene Substances 0.000 claims 2
- 229920000554 ionomer Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- 239000004743 Polypropylene Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
Description
第１図〜第４図は本考案の一実施例に係り、第
１図は完成されたフイルムパツケージ形電解コン
デンサを示す斜視図、第２図は成形体とコンデン
サ素子とを接続した状態を示す斜視図、第３図は
成形体を示す斜視図、第４図はラミネート積層材
を示す斜視図、第５図および第６図は本考案の他
の実施例に係り、第５図は成形体とコンデンサ素
子を接続した状態を示す斜視図、第６図はラミネ
ート積層材を示す斜視図、第７図は従来の参考例
に係るフイルムパツケージ形電子部品を説明する
ための斜視図である。
１…コンデンサ素子、２，３…接続端子、４…
頂点、５…底辺、６，７…リード端子、８…クサ
ビ形成形体、９…接続部、１０…熱融着性樹脂シ
ート、１１…耐熱性プラスチツクフイルム、１２
…アルミ箔、１４…三層ラミネート積層材、１５
…シール部。
Figures 1 to 4 relate to one embodiment of the present invention, with Figure 1 being a perspective view showing a completed film package type electrolytic capacitor, and Figure 2 showing the state in which the molded body and the capacitor element are connected. 3 is a perspective view showing a molded product, FIG. 4 is a perspective view showing a laminate, FIGS. 5 and 6 relate to other embodiments of the present invention, and FIG. 5 is a molded product. 6 is a perspective view showing a laminate material, and FIG. 7 is a perspective view illustrating a film package type electronic component according to a conventional reference example. 1... Capacitor element, 2, 3... Connection terminal, 4...
Vertex, 5... Bottom, 6, 7... Lead terminal, 8... Wedge forming body, 9... Connecting portion, 10... Heat fusion resin sheet, 11... Heat resistant plastic film, 12
...Aluminum foil, 14...Three-layer laminate material, 15
...Seal part.
Claims (1)
フイルムとの中間にアルミ箔を介在させた一対の
三層ラミネート積層材と、該一対の積層材の熱融
着性樹脂シート間に挾持した電子部品素子と、該
素子の同一方向から導出した一対の接続端子と、
前記熱融着性樹脂シート間の一端部間に挾持した
クサビ形成形体と、該成形体の頂点と底辺間に貫
通植設した一対のリード端子と、前記接続端子と
リード端子の前記頂点からの導出部とを接続した
接続部と、前記熱融着性樹脂シートと前記成形体
との接触部および熱融着性樹脂シート同志の接触
周辺全体に設けたシール部とを具備したことを特
徴とするフイルムパツケージ形電子部品。 (2) 熱融着性樹脂シートがアイオノマー、ポリ
エチレン、ポリプロピレン、アイオノマーとポリ
エチレンの混合物からなることを特徴とする実用
新案登録請求の範囲第(1)項記載のフイルムパツ
ケージ形電子部品。 (3) 成形体がプラスチツク、ガラス、セラミツ
クからなることを特徴とする実用新案登録請求の
範囲第(1)項または第(2)項記載のフイルムパツケ
ージ形電子部品。[Scope of Claim for Utility Model Registration] (1) A pair of three-layer laminate materials with aluminum foil interposed between a heat-fusible resin sheet and a heat-resistant plastic film, and heat fusion of the pair of laminate materials. an electronic component element sandwiched between elastic resin sheets, a pair of connection terminals led out from the same direction of the element,
A wedge-formed body held between one end of the heat-fusible resin sheet, a pair of lead terminals inserted between the apex and the bottom of the molded body, and a pair of lead terminals extending from the apex of the connecting terminal and the lead terminal. It is characterized by comprising a connecting part that connects the lead-out part, and a sealing part provided around the contact part between the heat-fusible resin sheet and the molded body and the entire periphery of the contact between the heat-fusible resin sheets. Film packaging electronic components. (2) The film package type electronic component according to claim 1, wherein the heat-fusible resin sheet is made of an ionomer, polyethylene, polypropylene, or a mixture of an ionomer and polyethylene. (3) A film package type electronic component according to claim 1 or 2 of the utility model registration, characterized in that the molded body is made of plastic, glass, or ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15240884U JPS6166934U (en) | 1984-10-09 | 1984-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15240884U JPS6166934U (en) | 1984-10-09 | 1984-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6166934U true JPS6166934U (en) | 1986-05-08 |
Family
ID=30710469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15240884U Pending JPS6166934U (en) | 1984-10-09 | 1984-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166934U (en) |
-
1984
- 1984-10-09 JP JP15240884U patent/JPS6166934U/ja active Pending
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