JPS6163075A - 半導体レ−ザ素子ダイボンデイング方法 - Google Patents

半導体レ−ザ素子ダイボンデイング方法

Info

Publication number
JPS6163075A
JPS6163075A JP18431284A JP18431284A JPS6163075A JP S6163075 A JPS6163075 A JP S6163075A JP 18431284 A JP18431284 A JP 18431284A JP 18431284 A JP18431284 A JP 18431284A JP S6163075 A JPS6163075 A JP S6163075A
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser element
mount
needle
photodetector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18431284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428157B2 (https=
Inventor
Masao Kitsukawa
橘川 政雄
Yukio Yoshikawa
幸男 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sokuhan Co Ltd
Original Assignee
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sokuhan Co Ltd filed Critical Tokyo Sokuhan Co Ltd
Priority to JP18431284A priority Critical patent/JPS6163075A/ja
Publication of JPS6163075A publication Critical patent/JPS6163075A/ja
Publication of JPH0428157B2 publication Critical patent/JPH0428157B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP18431284A 1984-09-03 1984-09-03 半導体レ−ザ素子ダイボンデイング方法 Granted JPS6163075A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18431284A JPS6163075A (ja) 1984-09-03 1984-09-03 半導体レ−ザ素子ダイボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18431284A JPS6163075A (ja) 1984-09-03 1984-09-03 半導体レ−ザ素子ダイボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6163075A true JPS6163075A (ja) 1986-04-01
JPH0428157B2 JPH0428157B2 (https=) 1992-05-13

Family

ID=16151132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18431284A Granted JPS6163075A (ja) 1984-09-03 1984-09-03 半導体レ−ザ素子ダイボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6163075A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02122683A (ja) * 1988-11-01 1990-05-10 Rohm Co Ltd レーザダイオード用チップボンディング装置におけるボンディングヘッド
WO2005029658A1 (ja) * 2003-09-22 2005-03-31 Murata Manufacturing Co., Ltd. 発光素子の装着方法および装着装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02122683A (ja) * 1988-11-01 1990-05-10 Rohm Co Ltd レーザダイオード用チップボンディング装置におけるボンディングヘッド
WO2005029658A1 (ja) * 2003-09-22 2005-03-31 Murata Manufacturing Co., Ltd. 発光素子の装着方法および装着装置
CN100420109C (zh) * 2003-09-22 2008-09-17 株式会社村田制作所 用于安装发光元件的方法和设备

Also Published As

Publication number Publication date
JPH0428157B2 (https=) 1992-05-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees