JPH0428157B2 - - Google Patents
Info
- Publication number
- JPH0428157B2 JPH0428157B2 JP18431284A JP18431284A JPH0428157B2 JP H0428157 B2 JPH0428157 B2 JP H0428157B2 JP 18431284 A JP18431284 A JP 18431284A JP 18431284 A JP18431284 A JP 18431284A JP H0428157 B2 JPH0428157 B2 JP H0428157B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- laser element
- mount
- needle
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 82
- 230000010355 oscillation Effects 0.000 claims description 36
- 230000003287 optical effect Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 11
- 238000003909 pattern recognition Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18431284A JPS6163075A (ja) | 1984-09-03 | 1984-09-03 | 半導体レ−ザ素子ダイボンデイング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18431284A JPS6163075A (ja) | 1984-09-03 | 1984-09-03 | 半導体レ−ザ素子ダイボンデイング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163075A JPS6163075A (ja) | 1986-04-01 |
| JPH0428157B2 true JPH0428157B2 (https=) | 1992-05-13 |
Family
ID=16151132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18431284A Granted JPS6163075A (ja) | 1984-09-03 | 1984-09-03 | 半導体レ−ザ素子ダイボンデイング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163075A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2544969B2 (ja) * | 1988-11-01 | 1996-10-16 | ローム株式会社 | レ―ザダイオ―ド用チップボンディング装置におけるボンディングヘッド |
| WO2005029658A1 (ja) * | 2003-09-22 | 2005-03-31 | Murata Manufacturing Co., Ltd. | 発光素子の装着方法および装着装置 |
-
1984
- 1984-09-03 JP JP18431284A patent/JPS6163075A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6163075A (ja) | 1986-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |