JPS6162515A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPS6162515A
JPS6162515A JP18436984A JP18436984A JPS6162515A JP S6162515 A JPS6162515 A JP S6162515A JP 18436984 A JP18436984 A JP 18436984A JP 18436984 A JP18436984 A JP 18436984A JP S6162515 A JPS6162515 A JP S6162515A
Authority
JP
Japan
Prior art keywords
fatty acid
higher fatty
long
resin composition
intramolecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18436984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0378403B2 (en:Method
Inventor
Toshiro Takeda
敏郎 竹田
Akira Toko
都甲　明
Koichi Tanaka
孝一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP18436984A priority Critical patent/JPS6162515A/ja
Publication of JPS6162515A publication Critical patent/JPS6162515A/ja
Publication of JPH0378403B2 publication Critical patent/JPH0378403B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18436984A 1984-09-05 1984-09-05 半導体封止用樹脂組成物 Granted JPS6162515A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18436984A JPS6162515A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18436984A JPS6162515A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6162515A true JPS6162515A (ja) 1986-03-31
JPH0378403B2 JPH0378403B2 (en:Method) 1991-12-13

Family

ID=16152016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18436984A Granted JPS6162515A (ja) 1984-09-05 1984-09-05 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6162515A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475554A (en) * 1987-09-17 1989-03-22 Toshiba Corp Epoxy resin composition and resin-sealing type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475554A (en) * 1987-09-17 1989-03-22 Toshiba Corp Epoxy resin composition and resin-sealing type semiconductor device

Also Published As

Publication number Publication date
JPH0378403B2 (en:Method) 1991-12-13

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