JPS6162515A - Resin composition for sealing semiconductor - Google Patents

Abstract

PURPOSE:To provide the titled composition having excellent moisture resistance, reliability of high-temperature electrical characteristics, mold-releasability, printability, and continuous moldability, by adding a specific amount of an internal release agent consisting of a specific higher fatty acid intramolecular monoamide compound to an epoxy resin. CONSTITUTION:An epoxy resin is compounded with 0.01-10wt% internal release agent consisting of a higher fatty acid intramolecular monoamide compound of formula (m and n are >=14) (preferably a condensation product of a >=16C long-chain monobasic saturated fatty acid and a >=15C long-chain aliphatic primary amine, and having a melting point of 80-120 deg.C), to obtain the objective composition.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor encapsulation resin composition for encapsulating a semiconductor element, which has particularly excellent reliability such as moisture resistance and high temperature electrical properties, and is easy to mold. The present invention relates to a resin composition for semiconductor encapsulation that sometimes has good mold releasability and also has good marking properties on molded products obtained.

[Prior art]

Conventionally, hermetic methods using metals, ceramics, etc. have been used as the encapsulation technology for semiconductor devices, but in recent years resin encapsulation has become more economically advantageous in terms of productivity and cost. It is becoming mainstream.

Epoxy resins for low-pressure molding, which are suitable for mass production and capable of low-pressure transfer molding, are widely used as such resins for semiconductor encapsulation.

In such a transfer molding method, it is a common practice to add an internal release agent to the resin composition in advance to enable the molded semiconductor to be removed from the gold. Conventionally commonly used internal mold release agents include long chain fatty acids such as stearic acid, long chain fatty acid metal salts such as zinc stearate, long chain fatty acid ester waxes such as carnauba wax, and ethylene bisstearin. Bisamide-based waxes such as acid amide are known, but all of these conventional release agents have poor moisture resistance, reliability such as high-temperature electrical properties, mold releasability, and imprintability on the surface of molded products. I couldn't say it was satisfactory.

In other words, long-chain fatty acids and their metal salts have relatively good mold releasability and imprintability, but they tend to fail in reliability tests such as the pressure Kutsker test and pressure Kutsker bias test, and have poor moisture resistance. acknowledged to be inferior. Furthermore, although ester waxes have excellent mold releasability and reliability, they are inferior in stamping properties, and in particular, as the number of moldings increases, the stamping properties deteriorate extremely. Although bisamide waxes have excellent reliability and stamping properties, they have the disadvantage of poor release properties.

[Purpose of the invention]

The present invention was made as a result of intensive studies to solve the above-mentioned drawbacks, and it has been found that when a specific higher fatty acid intramolecular monoamide compound is added as an internal mold release agent to the conventional epoxy resin for semiconductor packaging, the moisture resistance is improved by K. The present invention provides (1) an epoxy resin and a higher fatty acid represented by the formula [A]. A resin composition for semiconductor encapsulation characterized by containing 0.01 to 10% of an intramolecular monoamide compound, CH, (-CH, +rnCONH+CH2+nCH, [
A] (m, n are integers of 14 or more) and (a higher fatty acid intramolecular heptanoamide compound condenses a long-chain monovalent saturated fatty acid with 16 or more carbon atoms and a long-chain aliphatic primary amine with 15 or more carbon atoms) The present invention relates to a resin composition for semiconductor encapsulation according to claim 1, characterized in that the composition is made of a resin composition.

The epoxy resin used in the present invention is bispheno-y A
'fill epoxy resins, novolac type epoxy resins, reso/L/thin type epoxy resins, halogenated epoxy resins, glycidyl ester type epoxy resins, polymer type epoxy resins, etc. As curing agents, amine type curing agents,
Aliphatic polyamine, polyamide resin, aromatic diamine,
Acid anhydride curing agent Lewis acid complex compound, aromatic polyamine, polycarboxylic acid, polycarboxylic acid hydrazide, boron trifluoride monoethylamine, dicyandiamide, imidazole, phenolic resin, melamine resin, acrylic resin,
area resin, incyanate, etc. Fillers include glass fiber, metal whiskers, carbon fiber, Kepler fiber, polyester fiber, polyamide fiber, pulp, asbestos, crystalline silica, fused silica, alumina, calcium carbonate, magnesium carbonate. , hydroxide, sium, aluminum hydroxide, antimony dioxide, Merck, titanium oxide, etc. can be added. Other colorants such as carbon black and iron oxide, coupling agents, and curing accelerators may also be added. Among the mold release agents used in the present invention, the high fatty acid intramolecular monoamide compound is represented by formula [A], but other conventional mold release agents may also be added.

CH, +CH, +mC0NH+CH, )n-CH, [A
] (m, n are integers of 14 or more) The amount of the higher fatty acid intramolecular monoamide compound added is BR (2) Although not limited, it is preferably 0.01 to 10% by weight. That is, the higher fatty acid intramolecular monoamide is 0. .01
% or less, the effect as a mold release agent is not expressed;
%, the crosslinking density after curing of the epoxy resin will drop significantly; the mechanical properties, electrical properties, etc. of the two-cured product will be impaired, and the protective function of the semiconductor element will no longer be fulfilled. The higher fatty acid intramolecular monoamide compound represented by formula [A] can be obtained by condensing a long-chain monovalent saturated fatty acid having 16 or more carbon atoms and a long-chain aliphatic primary amine having 15 or more carbon atoms.

The present invention uses a higher fatty acid intramolecular monoamide compound represented by formula [A] as an internal mold release agent for an epoxy resin (there are two methods, and the method of the present invention satisfies all of reliability, mold releasability, imprintability, etc.). It has now become possible to provide a resin composition for conductor sealing that can

Conventional amide waxes are widely used as internal mold release agents for molding materials because they have good heat resistance compared to other waxes. This is because the wax that oozes out on the surface of the gold oxide has good heat resistance, so it does not gel and accumulate indoors, so it does not significantly damage the appearance of the molded product. In this way, conventional amide waxes with excellent continuous moldability have good reliability and stamping properties, but on the other hand, they have insufficient mold release properties.Most conventional amide waxes have stearic acid, An intramolecular polyamide compound obtained by condensing a higher fatty acid such as behenic acid or montanic acid with a polyvalent amine such as ethylenediamine, or an intramolecular polyamide compound obtained by reacting a higher fatty acid with ammonia and condensing it by methylolization with formalin. It is a compound with high polarity and compatibility with epoxy resins, etc. (Because it is rich in waxes, it can act as an internal mold release agent in the same amount as waxes such as other higher fatty acids, metal salts of higher fatty acids, and higher fatty acid esters.) It is thought that even if the molded product surface and the mold surface are is highly crystalline and has a high melting point of 115°C to 160°C, which is one of the reasons why it has poor mold releasability. There are saturated fatty acid intramolecular polyamide compounds, and although these waxes have a relatively low melting point of 80 to 130°C, they are not satisfactory in terms of heat resistance (poor) and long-term moldability.

Therefore, the present inventors took advantage of the heat resistance, reliability, and good marking properties of amide waxes; as a result of intensive studies to improve mold release properties, we found that
The higher fatty acid intramolecular monoamide compound obtained by condensing the above long-chain monovalent saturated fatty acid with a long-chain aliphatic primary amine having 15 or more carbon atoms has a melting point of 80 to 120°C, which is higher than conventional amide waxes. The present invention was completed based on the knowledge that the mold release property is low, the mold release property is good, and long-term moldability, reliability, and stampability are all satisfied. The number of carbon atoms in long-chain monovalent saturated fatty acids and long-chain aliphatic primary amines is limited to a specific number (;; the fatty acid intramolecular amide compound obtained by condensing the carbon numbers below this range exhibits mold releasability. Because you can't.

〔Effect of the invention〕

The present invention is characterized in that it is made by blending a specific higher fatty acid intramolecular monoamide compound as an internal mold release agent into an epoxy resin composition consisting of an epoxy resin, a curing agent, a filler, and an additive. Injection molding, etc.::
It is suitable for molding a large number of electronic parts, and can satisfy reliability, stampability, mold releasability, and continuous moldability.

Next, the present invention will be specifically explained using examples.

〔Example〕

In addition, unless otherwise specified in (:), it refers to
This indicates the part.

Example 1 284 g (1
mole), Steari A/7myy (C15H3yNH,)
2691 (1 mo/l/ ) and toluene 100c
The mixture was placed in a three-hole flask equipped with a thermometer, a reflux condenser, and a stirrer, and heated to 120° C. with stirring. The condensation reaction between carboxylic acid and amine becomes active at 120°C to 130°C.
Keep at 0℃. Then gradually increase the temperature to 180℃ over 2 hours:
The condensation reaction was completed by raising the temperature twice. The toluene remaining in the reaction system was removed under reduced pressure, and the product was
It was taken out at a temperature above ℃ and cooled to solidify.

As a result of targeting the melting point of the reaction product, it was found that it was 91°C, which is 30 to 40"C higher than the melting point of the carboxylic acid and amine of Rinka. On the other hand, when the infrared absorption spectrum of the product was measured, , 1710 cIL of raw material carboxylic acid
The absorption of the carbonyl of 1640 completely disappeared, and instead the absorption of the carbonyl of the amide was 1640! It was found that the condensation reaction between carboxylic acid and amine occurred almost quantitatively, and the resulting reaction product was the desired higher fatty acid intramolecular monoamide compound.

Next, 5.5 parts of this heptanoamide compound was used as an internal mold release agent to prepare cresol novolac epoxy Φ (Eboxy) Lt 22.
0) 100 parts, 30 parts of brominated phenolic novolac epoxy (epoxy equivalent 300), 60 parts of phenolic novolac hardener (molecule [750), 05 parts of 2-ethyl-4-methylimidazole, 400 parts of crystalline silica powder, silane 2D parts of coupling agent, 30 parts of antimony trioxide,
A molding material obtained by blending, mixing and kneading with 2.0 parts of carbon black was used as a resin composition for semiconductor encapsulation.

Example 2 Behenic acid (CfIHas C00H) 3401 (
1% x), stearylamine 2691 (1% x), and toluene 130 were reacted in the same manner as in Example 1 to obtain a higher fatty acid intramolecular monoamide compound. The melting point of this compound was 93°C. Subsequently, 35 parts of this compound was blended as an internal mold release agent in the same composition as in Example 1 to obtain a resin composition for semiconductor encapsulation.

Example 3 Montanic acid (e,,H!,C00H) 42411 (1
MoA/ ), 269 p (1 mole) of stearylamine, and 150 p of toluene were reacted in the same manner as in Example 1 to obtain a higher fatty acid intramolecular monoamide compound. The melting point of this compound was 95°C. Then this compound 25
A resin composition for encapsulating a semiconductor was obtained by blending the same composition as in Example 1, using 50% as an internal mold release agent.

Example 4゜Higher fatty acid intramolecular monoamide compound obtained in Example 15.
An epoxy resin composition for semiconductor encapsulation was obtained by blending the same composition as in Example 1 with 0 part of carnauba wax and 0.5 part of carnauba wax as an internal mold release agent.

Comparative Example 1-6 An epoxy resin composition for semiconductor encapsulation of No. 62!1 was obtained by blending the same composition as in Example 1, except for the internal release formulation described in Table 1 below.

Table 1 The above composition was molded using a transfer molding machine at a pressure of 60 K.
A molded product was molded under the conditions of a y/di mold temperature of 175° C. and a molding time of 2 minutes and 30 seconds, and was further subjected to boiling and arching at 175° C. for 4 hours to obtain a semiconductor encapsulated product. The mold releasability during molding, the long-term moldability, the reliability of the molded product, and the stampability were as shown in Table 2. Evaluation of each characteristic was carried out as follows (2).

(a) Of the upper and lower m-type molds, only the lower mold was equipped with a dowel pin, and then continuous molding was performed to produce a finished product (no dowel pin) (represented by the number of moldings at which the two molded products adhered to each other and did not easily release from the plate).

(b) Long-term moldability The number of moldings is shown by the number of moldings when the surface of the molded product becomes dirty and the appearance of the molded product starts to become cloudy when continuous molding is performed using a molded product with a mirror-like surface.

(C) Reliable IC encapsulation) Two pressure shoes test (PCG: 120℃ water vapor, 2 atmospheres)
The corrosion of the aluminum wiring was investigated. Aluminum corrosion (open occurrence due to two reasons was detected and expressed as the initial failure occurrence time).

(d) Stamping property The surface of the IC sealing product obtained was stamped with $7224 silver ink manufactured by Markem, and after ink air was applied at 150°C for 1 hour, a peel test was carried out with cellophane tape to confirm that even a small amount of text could be printed. If there are any omissions, it is considered defective.

Claims (2)

[Claims] (1) A resin composition for semiconductor encapsulation, comprising an epoxy resin and a higher fatty acid intramolecular monoamide compound represented by formula [A] in an amount of 0.01 to 10% by weight. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [A] (m and n are integers of 14 or more) (2) Higher fatty acid intramolecular monoamide compound has 16 carbon atoms
2. The resin composition for semiconductor encapsulation according to claim 1, which is formed by condensing the above long-chain monovalent saturated fatty acid with a long-chain aliphatic primary amine having 15 or more carbon atoms.