JPS6162515A - 半導体封止用樹脂組成物 - Google Patents
半導体封止用樹脂組成物Info
- Publication number
- JPS6162515A JPS6162515A JP18436984A JP18436984A JPS6162515A JP S6162515 A JPS6162515 A JP S6162515A JP 18436984 A JP18436984 A JP 18436984A JP 18436984 A JP18436984 A JP 18436984A JP S6162515 A JPS6162515 A JP S6162515A
- Authority
- JP
- Japan
- Prior art keywords
- fatty acid
- higher fatty
- long
- resin composition
- intramolecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18436984A JPS6162515A (ja) | 1984-09-05 | 1984-09-05 | 半導体封止用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18436984A JPS6162515A (ja) | 1984-09-05 | 1984-09-05 | 半導体封止用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6162515A true JPS6162515A (ja) | 1986-03-31 |
JPH0378403B2 JPH0378403B2 (enrdf_load_stackoverflow) | 1991-12-13 |
Family
ID=16152016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18436984A Granted JPS6162515A (ja) | 1984-09-05 | 1984-09-05 | 半導体封止用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6162515A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6475554A (en) * | 1987-09-17 | 1989-03-22 | Toshiba Corp | Epoxy resin composition and resin-sealing type semiconductor device |
-
1984
- 1984-09-05 JP JP18436984A patent/JPS6162515A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6475554A (en) * | 1987-09-17 | 1989-03-22 | Toshiba Corp | Epoxy resin composition and resin-sealing type semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0378403B2 (enrdf_load_stackoverflow) | 1991-12-13 |
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