JPS6161262B2 - - Google Patents

Info

Publication number
JPS6161262B2
JPS6161262B2 JP54078077A JP7807779A JPS6161262B2 JP S6161262 B2 JPS6161262 B2 JP S6161262B2 JP 54078077 A JP54078077 A JP 54078077A JP 7807779 A JP7807779 A JP 7807779A JP S6161262 B2 JPS6161262 B2 JP S6161262B2
Authority
JP
Japan
Prior art keywords
filter
optical filter
chip
adhesive
ccd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54078077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS562674A (en
Inventor
Okio Yoshida
Hiroo Takemura
Takeshi Miura
Tetsuo Ogawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Topcon Corp
Original Assignee
Toshiba Corp
Tokyo Kogaku Kikai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Kogaku Kikai KK filed Critical Toshiba Corp
Priority to JP7807779A priority Critical patent/JPS562674A/ja
Publication of JPS562674A publication Critical patent/JPS562674A/ja
Publication of JPS6161262B2 publication Critical patent/JPS6161262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Color Television Image Signal Generators (AREA)
  • Optical Filters (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP7807779A 1979-06-22 1979-06-22 Assembling method of solid state image sensing device Granted JPS562674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7807779A JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7807779A JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Publications (2)

Publication Number Publication Date
JPS562674A JPS562674A (en) 1981-01-12
JPS6161262B2 true JPS6161262B2 (en:Method) 1986-12-24

Family

ID=13651770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7807779A Granted JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Country Status (1)

Country Link
JP (1) JPS562674A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155758U (en:Method) * 1987-03-30 1988-10-13

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846188B2 (ja) * 1980-03-19 1983-10-14 松下電器産業株式会社 固体撮像素子の製造方法
JPS60185350U (ja) * 1984-05-17 1985-12-09 ソニー株式会社 色フイルタ−貼り合せ装置
JPH02105458A (ja) * 1988-10-13 1990-04-18 Nec Corp 固体撮像装置とその製造方法
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010552B2 (ja) * 1976-08-09 1985-03-18 関西ペイント株式会社 感光性接着剤組成物
JPS5384413A (en) * 1976-12-29 1978-07-25 Matsushita Electric Ind Co Ltd Solid state pickup device
JPS5952535B2 (ja) * 1977-01-21 1984-12-20 キヤノン株式会社 光学装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155758U (en:Method) * 1987-03-30 1988-10-13

Also Published As

Publication number Publication date
JPS562674A (en) 1981-01-12

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