JPS6161262B2 - - Google Patents
Info
- Publication number
- JPS6161262B2 JPS6161262B2 JP54078077A JP7807779A JPS6161262B2 JP S6161262 B2 JPS6161262 B2 JP S6161262B2 JP 54078077 A JP54078077 A JP 54078077A JP 7807779 A JP7807779 A JP 7807779A JP S6161262 B2 JPS6161262 B2 JP S6161262B2
- Authority
- JP
- Japan
- Prior art keywords
- filter
- optical filter
- chip
- adhesive
- ccd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000003384 imaging method Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 230000009977 dual effect Effects 0.000 claims description 6
- 238000001723 curing Methods 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Description
【発明の詳細な説明】
この発明はCCD（チヤージカツプルドデバイ
ス）等の電荷転送素子を用いた固体撮像装置のア
ツセンブリ方法に係り、特にCCDチツプ上にカ
ラーフイルタを貼り合わせるアツセンブリ方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for assembling a solid-state imaging device using a charge transfer element such as a CCD (charge coupled device), and particularly to a method for assembling a color filter on a CCD chip.
固体撮像装置を用いたテレビジヨンカメラの研
究が最近盛んである。固体撮像装置にはCCD、
BBD（バケツトブリゲードデバイス）等電荷転
送素子を用いたものがある。何れも半導体基板に
絶縁層を介して電極を多数配列した構造を有し、
半導体基板の内部にポテンシヤル井戸を作り、こ
のポテンシヤル井戸に光電効果によつて発生させ
た電荷を蓄積し、電極に所定の規則に従つて電圧
を印加することにより、蓄積した電荷を半導体基
板表面に沿い一方向に転送して出力端子から信号
として読みとらせるものである。 Recently, research on television cameras using solid-state imaging devices has been active. Solid-state imaging devices include CCD,
Some devices use a charge transfer device such as a BBD (bucket brigade device). Both have a structure in which a large number of electrodes are arranged on a semiconductor substrate with an insulating layer interposed between them.
A potential well is created inside the semiconductor substrate, charges generated by the photoelectric effect are accumulated in the potential wells, and a voltage is applied to the electrodes according to a predetermined rule, thereby transferring the accumulated charges to the surface of the semiconductor substrate. The signal is transmitted in one direction along the line and read as a signal from the output terminal.
従来の単管式カラー撮像装置、例えば周波数分
離方式の単管式装置に於ては、画素は撮像管の一
様に形成された光導電膜であり、個々に分離する
ものでなく連続につながつているので、任意の場
所に選択出来た。従つて色信号を分離するための
光学フイルタは、撮像管のフエースプレートの
ほゞ中央に貼り合わせれば良く、位置合わせにつ
いての精度を要しない。又位相分離方式や、三電
極方式では光導電膜から信号を取り出すための透
明な信号電極が分割されていると、この分割に対
応した画素が形成されるので、光学フイルタの貼
り合わせは周波数分離方式よりも幾分複雑にな
る。しかしこれ等の光学フイルタは、ストライプ
状が主であり、この意味でストライプと電極との
整合は、例えば水平方向で精度良く行われていれ
ば足りる。 In a conventional single-tube color imaging device, such as a frequency-separated single-tube device, the pixels are a photoconductive film formed uniformly in the image pickup tube, and they are not separated individually but connected continuously. Since it is attached, you can select any location. Therefore, the optical filter for separating color signals can be attached approximately to the center of the face plate of the image pickup tube, and precision in positioning is not required. In addition, in the phase separation method or the three-electrode method, if the transparent signal electrode for extracting signals from the photoconductive film is divided, pixels corresponding to this division are formed, so the bonding of the optical filter is frequency separation. It's a little more complicated than the method. However, these optical filters mainly have a striped shape, and in this sense, it is sufficient that the alignment between the stripes and the electrodes is performed with high accuracy, for example, in the horizontal direction.
固体撮像装置、例えばCCD素子を用いるもの
ではＸ，Ｙ方向に規則正しく配列されているため
に、光学フイルタの貼り合わせもまたＸ，Ｙ方向
の整合が要求され、ストライプ又はドツト状光学
フイルタを用いるため、位置合わせ精度を極めて
高く要する。 Solid-state imaging devices, such as those using CCD elements, are arranged regularly in the X and Y directions, so alignment in the X and Y directions is also required when bonding optical filters together. , extremely high alignment accuracy is required.
この発明は接合の作業性を良好に且つ位置合わ
せを高精度にして光学フイルタの貼り合わせを行
なわせる固体撮像装置のアツセンブリ方法を提供
するもので、以下図面について更に詳細に説明す
る。 The present invention provides a method for assembling a solid-state imaging device in which optical filters are bonded together with good bonding workability and highly accurate positioning, and will be described in more detail below with reference to the drawings.
第１図に固体撮像装置、特にCCD素子チツプ
１を示す。この素子は撮像部となる感光部２と蓄
積部３とから成り、フレームトランスフアー方式
例である。チツプの一面には周囲に外部への電極
取り出し域となるボンデイングパツド４が配列さ
れている。又成るべく画素に影響しない部分に複
数の例えば十字型標点５がこの例で一対設けられ
てある。或いは二色フイルタに合わせるとき二対
設けられることもある。 FIG. 1 shows a solid-state imaging device, particularly a CCD element chip 1. This device consists of a photosensitive section 2 serving as an imaging section and a storage section 3, and is an example of a frame transfer system. On one side of the chip, bonding pads 4 are arranged around the periphery, which serve as an area for taking out electrodes to the outside. Also, in this example, a pair of plurality of cross-shaped markers 5 are provided in portions that do not affect pixels as much as possible. Alternatively, two pairs may be provided when matching with a two-color filter.
第２図は第１図CCDチツプの他面をセラミツ
クパツケージ６にマウントした状態で示してい
る。セラミツクパツケージ６は接着剤７により
CCDチツプ１を貼りつけられている。普通接着
剤７は、CCDの基板とチツプとの電気的接続を
はかるため、導電性である。尚ダイヤタツチ部等
の詳細については図面に省略してある。CCDチ
ツプがセラミツクパツケージに固定されチツプマ
ウント体９を形成した時点で、ボンデイングパツ
ドとセラミツクパツケージ側の電極引き出し域と
が、アルミニウム又は金等のボンデイングワイヤ
により結線される。この結線は図示されていない
けれども、セラミツク基板内部を経てセラミツク
パツケージの側面に引き出され、ソケツトを介し
て外部回路に接続される。このCCDチツプは、
例えば色ストライプフイルタである光学フイルタ
を貼り合わせカラー撮像装置として用いられる。
貼り合わせ許容精度は数μｍ、望ましくは２μｍ
以内である。第３図に光学フイルター例として色
ストライプフイルタ１１を示す。このフイルタは
透明硝子基板１１０の一面でCCD感光部に相当
する位置に色ストライプフイルタ１２を形成す
る。この色ストライプフイルタは単板式カラーカ
メラに於いては赤、青、縁の三色ストライプであ
り、二板式カラーカメラに於いては青と赤の二色
光を分離出来る二色ストライプである。CCDチ
ツプと光学フイルタとの貼り合わせで位置合わせ
に用いる例えば十字型標点１３が、ストライプ形
成と同時又は前後に形成されている。標点はスト
ライプの平行をとるために少くとも一対を設け
る。 FIG. 2 shows the other side of the CCD chip of FIG. 1 mounted on a ceramic package 6. As shown in FIG. Ceramic package 6 is attached with adhesive 7.
CCD chip 1 is attached. The adhesive 7 is usually conductive in order to establish an electrical connection between the CCD substrate and the chip. Note that details of the diamond touch portion and the like are omitted in the drawings. When the CCD chip is fixed to the ceramic package to form the chip mount body 9, the bonding pad and the electrode lead-out area on the ceramic package side are connected with a bonding wire made of aluminum, gold, or the like. Although this connection is not shown, it is led out through the inside of the ceramic substrate to the side of the ceramic package and connected to an external circuit via a socket. This CCD chip is
For example, optical filters such as color stripe filters are bonded together and used as a color imaging device.
Admissible bonding accuracy is several μm, preferably 2 μm
Within FIG. 3 shows a color stripe filter 11 as an example of an optical filter. This filter forms a color stripe filter 12 on one surface of a transparent glass substrate 110 at a position corresponding to the CCD photosensitive area. This color stripe filter is a three-color stripe of red, blue, and an edge in a single-plate color camera, and a two-color stripe that can separate blue and red two-color light in a two-plate color camera. For example, a cross-shaped marker 13, which is used for positioning when bonding the CCD chip and the optical filter, is formed at the same time as or before and after the stripe formation. At least one pair of gauge points should be provided to keep the stripes parallel.
この光学フイルタをCCDチツプに貼り合わせ
たカラー撮像用固体装置１５を第４図に示す。
CCDチツプ１上に光透過性接着剤１４を介して
光学フイルタ１１が色ストライプフイルタ１２を
備えている側で貼り合わされている。 FIG. 4 shows a color imaging solid-state device 15 in which this optical filter is bonded to a CCD chip.
An optical filter 11 is bonded onto the CCD chip 1 via a light-transmitting adhesive 14 on the side provided with the color stripe filter 12.
第４図固体装置１５はこの発明によると以下の
ようにして形成される。 The solid state device 15 of FIG. 4 is formed according to the invention as follows.
まずこの実施例方法で使用したアツセンブリ装
置の配置を第５図に示す。この装置はチツプマウ
ント体９を固定出来る作業台２１、CCDチツプ
に貼り合わせる光学フイルタを把持出来るフイル
タホルダー２３、貼り合わせの位置決め用双対物
顕微鏡２７及び光学フイルタ接着剤硬化用の紫外
光源２９を備えている。 First, FIG. 5 shows the arrangement of the assembly apparatus used in this embodiment method. This device is equipped with a work table 21 that can fix a chip mount body 9, a filter holder 23 that can hold an optical filter to be bonded to a CCD chip, a dual objective microscope 27 for positioning the bonding, and an ultraviolet light source 29 for curing the optical filter adhesive. ing.
作業台２１は、微動機構２２により順次水平面
内で直交する二方向及び垂直方向のＸ，Ｙ，Ｚ三
方向の移動並びに水平面求角θの廻転をすること
が出来る。微動機構は通常のねじ駆動のXYテー
ブル、Ｚ軸を用いればよろしい。チツプマウント
体の作業台上への固定は、真空吸引によるチヤツ
ク方式でよい。従つて作業台は卓面上にチツプマ
ウント体を保持出来るように排気系路を付属して
いる。フイルタホルダー２３は、例えば排気系に
連結され作業台上方にある端面に貼りわせられる
予定の光学フイルタ１１を保持出来る。このホル
ダーも微動機構２４により作業台と同様に直交す
る二方向及び垂直方向のＸ，Ｙ，Ｚ三方向の移動
並びに水平面求角θの回転を可能にしている。貼
り合わせの位置決め用双対物顕微鏡２７は二個の
接眼レンズ２５と、二個の対物レンズ２６を備
え、一般顕微鏡と同様に少くとも垂直方向の微動
機構２８或いは更に退避をはかる水平面内での回
転機構が付加されていてよい。この双対物顕微鏡
では同一視野内の左右に半視野づつ結像させるこ
とが出来、それぞれの半視野に光学的な位置合わ
せに用いられる基準線が設けられている。紫外光
源２９は、自在に位置を移動出来る例えばアーム
群に保持されて光学フイルタ配置体を照射可能に
備えられ、この光源を駆動する電源３０を付属し
ている。 The workbench 21 can be sequentially moved in two orthogonal directions in a horizontal plane and in three vertical directions (X, Y, Z) and rotated by a desired angle θ in the horizontal plane by a fine movement mechanism 22. For the fine movement mechanism, it is sufficient to use a normal screw-driven XY table and Z axis. The chip mount body may be fixed on the workbench by a chuck method using vacuum suction. Therefore, the workbench is provided with an exhaust system so that the chip mount can be held on the tabletop. The filter holder 23 can hold, for example, an optical filter 11 that is connected to an exhaust system and is to be attached to an end surface above a workbench. This holder also allows movement in two orthogonal directions and three vertical directions (X, Y, and Z) and rotation in the horizontal plane by a desired angle θ, similarly to the work table. The dual objective microscope 27 for positioning the bonded material is equipped with two eyepiece lenses 25 and two objective lenses 26, and, like a general microscope, has at least a fine movement mechanism 28 in the vertical direction or rotation in a horizontal plane for retraction. A mechanism may be added. This dual objective microscope can form images in left and right half fields within the same field of view, and each half field is provided with a reference line used for optical alignment. The ultraviolet light source 29 is held by, for example, a group of arms that can be freely moved, and is equipped to irradiate the optical filter arrangement, and is attached with a power source 30 for driving this light source.
以下このアツセンブリ装置によつて固体撮像装
置を組立てる実施例方法について述べる。作業台
２１上にまずチツプマウント体９を真空吸引して
取付ける。CCD素子チツプ１の十字型標点５を
双対物顕微鏡２７の視野内基準線に合わせるよう
作業台をＸ，Ｙ方向、θ角範囲に動かして所定の
位置に合わせる。又色ストライプフイルタ１２を
備えた光学フイルタ１１は、色ストライプフイル
タ１２がチツプに対向するようにフイルタホルダ
ー２３に吸引保持させる。次にフイルタホルダー
の微動機構を用い、チツプマウント体上方に光学
フイルタを配置する。光学フイルタは既に位置合
わせされたチツプマウント体より高所にあるから
双対物顕微鏡２７の焦点位置を、光学フイルタの
十字型標点位置にまで垂直のＺ方向で上げること
が必要である。この操作によつて顕微鏡２７が
Ｘ，Ｙ方向にはずれないように構成しておくと、
視野内の基準線に光学フイルタの十字型標点を合
わせるとき元のチツプ上の標点５の位置を正しく
取ることになる。 An example method for assembling a solid-state imaging device using this assembly device will be described below. First, the chip mount body 9 is mounted on the workbench 21 by vacuum suction. The work table is moved in the X and Y directions and in the θ angle range to align the cross-shaped reference point 5 of the CCD element chip 1 with the reference line within the field of view of the dual objective microscope 27, and the workbench is adjusted to a predetermined position. Further, the optical filter 11 having the color stripe filter 12 is suctioned and held by the filter holder 23 so that the color stripe filter 12 faces the chip. Next, using the fine movement mechanism of the filter holder, place the optical filter above the chip mount body. Since the optical filter is located higher than the already aligned chip mount, it is necessary to raise the focal position of the dual objective microscope 27 in the vertical Z direction to the cross-shaped gage position of the optical filter. If the structure is configured so that the microscope 27 does not come off in the X and Y directions due to this operation,
When aligning the cross-shaped reference point of the optical filter with the reference line within the field of view, the position of the reference point 5 on the original chip is correctly determined.
光学フイルタの位置合わせを終えてから、フイ
ルタホルダを顕微鏡下方から一旦移動させる。こ
の移動は水平面内での回転又は垂直方向の引上げ
の何れか手段を使い分ければ良ろしい。移動によ
つてCCDチツプ上に適当な空間が空き、接着剤
を滴下出来る。接着剤として光透過性紫外線硬化
接着剤例えばNorland Optical Adhesive60又は
61（商品名）或いはSummers Laboratories社の
UV―71又はUV―74（商品名）等を用いる。適当
量の接着剤を滴下し、フイルタホルダを再びチツ
プマウント体上方の元の位置に移動する。このと
きCCDチツプと光学フイルタ上の十字型標点に
よる位置合わせが再度実現される。この点を確認
しもしも何れか一方がずれている時は微動調整し
補正する。フイルタホルダは、光に対して透過性
材料から成ることが好ましい。 After completing the alignment of the optical filter, move the filter holder from below the microscope. For this movement, either rotation in the horizontal plane or pulling up in the vertical direction may be used. The movement frees up an appropriate space on the CCD chip, allowing the adhesive to be dripped. As adhesive, a light-transparent UV-curing adhesive such as Norland Optical Adhesive 60 or
61 (product name) or Summers Laboratories
Use UV-71 or UV-74 (product name). Drop an appropriate amount of adhesive and move the filter holder back to its original position above the chip mount. At this time, alignment using the CCD chip and the cross-shaped reference points on the optical filter is realized again. Check this point and if either one is out of alignment, make a slight adjustment to correct it. Preferably, the filter holder consists of a material that is transparent to light.
フイルタホルダをＺ方向微動軸により下方に押
し下げ接着剤１４に光学フイルタをふれさせる。
更に下方に押し下げ光学フイルタとCCDチツプ
間で接着剤の厚さを例えば凡そ10μｍであるよう
にする。この厚さを置くには、顕微鏡下で、チツ
プ側と光学フイルタ側の十字型標点の両者が焦点
深度内で双方共に認められる状態を目安とすれば
よろしい。 The filter holder is pushed down by the Z-direction fine movement shaft to make the optical filter touch the adhesive 14.
Press down further so that the thickness of the adhesive between the optical filter and the CCD chip is approximately 10 μm, for example. In order to set this thickness, it is sufficient to set the condition such that both the cross-shaped gauge marks on the chip side and the optical filter side are both visible within the depth of focus under a microscope.
所望にフイルタホルダが押し下げられた状態で
顕微鏡を退避移動し、紫外線光源を移動して光学
フイルタ上方から紫外線を短時間例えば二分間照
射して予備硬化を行なう。予備硬化前に脱泡及び
接着剤厚さの均一化をはかつてフイルタホルダー
を、排気系から遮断し真空吸引を停止させるか、
又は空気を流しこんでフイルタホルダーから光学
フイルタをはなしても良い。但し予備硬化時点で
光学フイルタがずれないように、適当な加圧棒例
えば全体を加圧出来るスプリングにより光学フイ
ルタ抑をえてもよろしい。この加圧棒は紫外線を
透過するものであることが好ましい。紫外線硬化
接着剤は紫外線を照射されて硬化するため、光学
フイルタの位置合わせ後の滴下のほか、作業台上
にチツプマウント体を配置した時点で、又は作業
台に配置するに先立つてCCDチツプ上に滴下し
ておいてもよろしい。接着剤は、予備硬化したあ
と光学フイルタ貼付体を作業台から取り外し、別
の場所で例えば約２時間紫外線を照射して、本硬
化させる。この時点で接着剤への紫外線透過は、
例えばストライプフイルタで紫外線遮断域がある
ような場合でも透過域からの回折にたすけられ硬
化を完全にする。 With the filter holder pressed down as desired, the microscope is retracted, the ultraviolet light source is moved, and ultraviolet light is irradiated from above the optical filter for a short period of time, for example, two minutes to perform preliminary curing. To remove air bubbles and make the adhesive thickness uniform before pre-curing, it is necessary to isolate the filter holder from the exhaust system and stop vacuum suction.
Alternatively, the optical filter may be removed from the filter holder by blowing air into it. However, in order to prevent the optical filter from shifting during preliminary curing, the optical filter may be held down by a suitable pressure rod, such as a spring that can press the entire surface. Preferably, this pressure rod is transparent to ultraviolet rays. Since UV curing adhesive is cured by irradiation with UV rays, it can be dripped on the CCD chip at the time the chip mount is placed on the workbench or before it is placed on the workbench, in addition to being dripped after aligning the optical filter. You can also drip it on. After the adhesive is precured, the optical filter attached body is removed from the workbench, and the adhesive is irradiated with ultraviolet rays for about 2 hours at another location to be fully cured. At this point, UV transmission to the adhesive is
For example, even in the case of a striped filter that has an ultraviolet blocking area, the curing is completed with the help of diffraction from the transmitting area.
このようなこの発明の方法によると、光学フイ
ルタの位置ぎめ終了後短時間に紫外線硬化剤が予
備硬化し、その後の位置ずれを防止出来ると共
に、位置合わせ装置の使用効率を上昇する利点が
ある。このため硬化に到る間、特別な治具を要す
ることがない。又予備硬化は位置合わせ微調整の
時間的余裕をとゞめる程度に行われることも有利
な点である。又熱的に硬化させるものでないた
め、作業台に加熱装置を要しない。更に予備硬化
時点で、光学フイルタ貼合わせ体はアツセンブリ
装置からとり外され、他の場所で自在に本硬化出
来る点でも便利である。 According to the method of the present invention, the ultraviolet curing agent is precured in a short time after the end of positioning the optical filter, which has the advantage of preventing subsequent positional displacement and increasing the efficiency of use of the positioning device. Therefore, no special jig is required during the curing process. It is also advantageous that the preliminary curing is carried out to the extent that sufficient time is available for fine alignment adjustment. Also, since it is not thermally hardened, no heating device is required on the workbench. Furthermore, it is convenient in that the optical filter bonded body can be removed from the assembly device at the time of preliminary curing and main curing can be carried out at any other location.
このようにして得られるカラー撮像用固体装置
で、光学フイルタは色ストライプフイルタの他市
松状等ドツト状フイルタ、必要な画素にのみ光を
入射するように配置された光シールド膜等であつ
ても良い。又電荷転送素子としてはCCD素子の
他MOS型素子、BBD素子等であつてもよろし
い。 In the solid-state device for color imaging obtained in this way, the optical filter may be a color stripe filter, a checkered or dot-shaped filter, a light shield film arranged so that light enters only the necessary pixels, etc. good. In addition to the CCD element, the charge transfer element may be a MOS type element, a BBD element, or the like.
第１図はCCD素子チツプの一面を示す平面
図、第２図は第１図チツプの他面をセラミツクパ
ツケージにマウントしたチツプマウント体断面
図、第３図は色ストライプフイルタ断面図、第４
図は第３図フイルタを第１図チツプに貼り合わせ
たカラー撮像用固体装置断面図、第５図は実施例
方法で用いたアツセンブリ装置配置図である。
Figure 1 is a plan view showing one side of the CCD element chip, Figure 2 is a cross-sectional view of the chip mount body in which the other side of the chip shown in Figure 1 is mounted on a ceramic package, Figure 3 is a cross-sectional view of a color stripe filter, and Figure 4 is a cross-sectional view of a color stripe filter.
The figure is a sectional view of a solid-state device for color imaging in which the filter of FIG. 3 is bonded to the chip of FIG. 1, and FIG. 5 is a layout diagram of an assembly device used in the embodiment method.
Claims (1)
以上の標点を有する固体撮像素子に接着剤を介し
て貼り合わせるアツセンブリ方法に於いて、フイ
ルタ及び素子の互に隔てられて設けられているそ
れぞれ少くとも二個の標点を双対物顕微鏡で観察
し乍ら所定に位置を合わせ、介在させた紫外線硬
化接着剤を紫外線照射し予備硬化して光学フイル
タ貼布体を形成した後接着剤を本硬化させること
を特徴とする固体撮像装置のアツセンブリ方法。1 In an assembly method in which an optical filter having two or more gauge points is bonded to a solid-state image sensor having two or more gauge points via an adhesive, the filter and the element are provided separated from each other. At least two gauge points are observed with a dual objective microscope, and the positions are aligned, and the interposed ultraviolet curing adhesive is irradiated with ultraviolet rays to pre-cure to form an optical filter patch, and then the adhesive is removed. A method for assembling a solid-state imaging device, characterized by performing main curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7807779A JPS562674A (en) | 1979-06-22 | 1979-06-22 | Assembling method of solid state image sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7807779A JPS562674A (en) | 1979-06-22 | 1979-06-22 | Assembling method of solid state image sensing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS562674A JPS562674A (en) | 1981-01-12 |
| JPS6161262B2 true JPS6161262B2 (en) | 1986-12-24 |
Family
ID=13651770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7807779A Granted JPS562674A (en) | 1979-06-22 | 1979-06-22 | Assembling method of solid state image sensing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS562674A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155758U (en) * | 1987-03-30 | 1988-10-13 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5846188B2 (en) * | 1980-03-19 | 1983-10-14 | 松下電器産業株式会社 | Manufacturing method of solid-state image sensor |
| JPS60185350U (en) * | 1984-05-17 | 1985-12-09 | ソニー株式会社 | Color filter bonding device |
| JPH02105458A (en) * | 1988-10-13 | 1990-04-18 | Nec Corp | Solid-state image sensing device and its manufacture |
| DE3923023A1 (en) * | 1989-07-12 | 1991-01-24 | Siemens Ag | UV CURABLE ADHESIVE FOR A SEMICONDUCTOR CHIP ASSEMBLY PROCESS |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5319351A (en) * | 1976-08-09 | 1978-02-22 | Kansai Paint Co Ltd | Photosensitive adhesive composition |
| JPS5384413A (en) * | 1976-12-29 | 1978-07-25 | Matsushita Electric Ind Co Ltd | Solid state pickup device |
| JPS5390872A (en) * | 1977-01-21 | 1978-08-10 | Canon Inc | Optical device |
-
1979
- 1979-06-22 JP JP7807779A patent/JPS562674A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5319351A (en) * | 1976-08-09 | 1978-02-22 | Kansai Paint Co Ltd | Photosensitive adhesive composition |
| JPS5384413A (en) * | 1976-12-29 | 1978-07-25 | Matsushita Electric Ind Co Ltd | Solid state pickup device |
| JPS5390872A (en) * | 1977-01-21 | 1978-08-10 | Canon Inc | Optical device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155758U (en) * | 1987-03-30 | 1988-10-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS562674A (en) | 1981-01-12 |
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