JPS6157706B2 - - Google Patents
Info
- Publication number
- JPS6157706B2 JPS6157706B2 JP56031369A JP3136981A JPS6157706B2 JP S6157706 B2 JPS6157706 B2 JP S6157706B2 JP 56031369 A JP56031369 A JP 56031369A JP 3136981 A JP3136981 A JP 3136981A JP S6157706 B2 JPS6157706 B2 JP S6157706B2
- Authority
- JP
- Japan
- Prior art keywords
- header
- liquid refrigerant
- evaporation container
- condensing
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031369A JPS57147258A (en) | 1981-03-06 | 1981-03-06 | Cooler for electric component part |
KR1019810005029A KR890002138B1 (ko) | 1981-03-06 | 1981-12-21 | 전기부품의 냉각장치 |
BR8201181A BR8201181A (pt) | 1981-03-06 | 1982-03-05 | Aparelho de resfriamento para resfriar componentes eletricos que produzem calor durante o funcionamento |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031369A JPS57147258A (en) | 1981-03-06 | 1981-03-06 | Cooler for electric component part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57147258A JPS57147258A (en) | 1982-09-11 |
JPS6157706B2 true JPS6157706B2 (enrdf_load_stackoverflow) | 1986-12-08 |
Family
ID=12329332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56031369A Granted JPS57147258A (en) | 1981-03-06 | 1981-03-06 | Cooler for electric component part |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS57147258A (enrdf_load_stackoverflow) |
KR (1) | KR890002138B1 (enrdf_load_stackoverflow) |
BR (1) | BR8201181A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9656555B2 (en) | 2012-01-30 | 2017-05-23 | Mitsubishi Electric Corporation | Electric motor vehicle main circuit system |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2007116460A1 (ja) | 2006-03-31 | 2009-08-20 | 三菱電機株式会社 | 電車用の電力変換装置 |
JP2009135142A (ja) * | 2007-11-28 | 2009-06-18 | Toyota Industries Corp | 沸騰冷却装置 |
JP4666084B2 (ja) * | 2009-03-13 | 2011-04-06 | 三菱電機株式会社 | 電車用の電力変換装置 |
-
1981
- 1981-03-06 JP JP56031369A patent/JPS57147258A/ja active Granted
- 1981-12-21 KR KR1019810005029A patent/KR890002138B1/ko not_active Expired
-
1982
- 1982-03-05 BR BR8201181A patent/BR8201181A/pt unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9656555B2 (en) | 2012-01-30 | 2017-05-23 | Mitsubishi Electric Corporation | Electric motor vehicle main circuit system |
Also Published As
Publication number | Publication date |
---|---|
BR8201181A (pt) | 1983-01-18 |
KR830008397A (ko) | 1983-11-18 |
KR890002138B1 (ko) | 1989-06-20 |
JPS57147258A (en) | 1982-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4036291A (en) | Cooling device for electric device | |
US6263959B1 (en) | Plate type heat pipe and cooling structure using it | |
JP3451737B2 (ja) | 沸騰冷却装置 | |
JPH0563954B2 (enrdf_load_stackoverflow) | ||
US20030117824A1 (en) | Power converter enclosure | |
JPH05243441A (ja) | 放熱装置 | |
JPS6157706B2 (enrdf_load_stackoverflow) | ||
JP3654323B2 (ja) | 沸騰冷却装置 | |
US4862321A (en) | Cooling system for heating body | |
JP3409434B2 (ja) | インバータ | |
JPS6130292Y2 (enrdf_load_stackoverflow) | ||
JPH06120383A (ja) | 半導体冷却装置 | |
JPS5856272B2 (ja) | 超電導装置 | |
JP3355726B2 (ja) | 沸騰冷却装置 | |
JPS6345004Y2 (enrdf_load_stackoverflow) | ||
JPS5941307B2 (ja) | 半導体素子用沸騰冷却装置 | |
JPH1026297A (ja) | 液化ガス容器 | |
JP7683258B2 (ja) | 沸騰冷却装置、および発熱体の冷却方法 | |
JP3173764B2 (ja) | 沸騰冷却装置 | |
JP2585479B2 (ja) | 沸騰冷却装置 | |
JP4375124B2 (ja) | 半導体装置用の沸騰冷却装置 | |
JP7168850B2 (ja) | 蒸発器及び冷却システム | |
JP2002031454A (ja) | 沸騰冷却装置 | |
JPS6131622B2 (enrdf_load_stackoverflow) | ||
JP2023121508A (ja) | 冷却装置 |