JPS6157555U - - Google Patents

Info

Publication number
JPS6157555U
JPS6157555U JP1984143239U JP14323984U JPS6157555U JP S6157555 U JPS6157555 U JP S6157555U JP 1984143239 U JP1984143239 U JP 1984143239U JP 14323984 U JP14323984 U JP 14323984U JP S6157555 U JPS6157555 U JP S6157555U
Authority
JP
Japan
Prior art keywords
board
electronic component
component mounting
electronic components
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984143239U
Other languages
English (en)
Japanese (ja)
Other versions
JPH039341Y2 (un
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984143239U priority Critical patent/JPH039341Y2/ja
Publication of JPS6157555U publication Critical patent/JPS6157555U/ja
Application granted granted Critical
Publication of JPH039341Y2 publication Critical patent/JPH039341Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1984143239U 1984-09-20 1984-09-20 Expired JPH039341Y2 (un)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984143239U JPH039341Y2 (un) 1984-09-20 1984-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984143239U JPH039341Y2 (un) 1984-09-20 1984-09-20

Publications (2)

Publication Number Publication Date
JPS6157555U true JPS6157555U (un) 1986-04-17
JPH039341Y2 JPH039341Y2 (un) 1991-03-08

Family

ID=30701541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984143239U Expired JPH039341Y2 (un) 1984-09-20 1984-09-20

Country Status (1)

Country Link
JP (1) JPH039341Y2 (un)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143072A (un) * 1974-05-08 1975-11-18
JPS5593286A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Electronic circuit and method of fabricating same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143072A (un) * 1974-05-08 1975-11-18
JPS5593286A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Electronic circuit and method of fabricating same

Also Published As

Publication number Publication date
JPH039341Y2 (un) 1991-03-08

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