JPS6157379B2 - - Google Patents
Info
- Publication number
- JPS6157379B2 JPS6157379B2 JP23370083A JP23370083A JPS6157379B2 JP S6157379 B2 JPS6157379 B2 JP S6157379B2 JP 23370083 A JP23370083 A JP 23370083A JP 23370083 A JP23370083 A JP 23370083A JP S6157379 B2 JPS6157379 B2 JP S6157379B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- copper
- semiconductor devices
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370083A JPS59145747A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370083A JPS59145747A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP606182A Division JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145747A JPS59145747A (ja) | 1984-08-21 |
| JPS6157379B2 true JPS6157379B2 (US20090163788A1-20090625-C00002.png) | 1986-12-06 |
Family
ID=16959175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23370083A Granted JPS59145747A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145747A (US20090163788A1-20090625-C00002.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199742A (ja) * | 1986-02-27 | 1987-09-03 | Ngk Insulators Ltd | 高強度銅基合金及びその製造方法 |
| JPH0219434A (ja) * | 1988-07-07 | 1990-01-23 | Dowa Mining Co Ltd | ワイヤーハーネスのターミナル用銅基合金 |
| KR0175968B1 (ko) * | 1994-03-22 | 1999-02-18 | 코오노 히로노리 | 전자기기용 고강도고도전성 구리합금 |
-
1983
- 1983-12-13 JP JP23370083A patent/JPS59145747A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59145747A (ja) | 1984-08-21 |
