JPS6154691A - Stem for semiconductor laser - Google Patents

Stem for semiconductor laser

Info

Publication number
JPS6154691A
JPS6154691A JP17709784A JP17709784A JPS6154691A JP S6154691 A JPS6154691 A JP S6154691A JP 17709784 A JP17709784 A JP 17709784A JP 17709784 A JP17709784 A JP 17709784A JP S6154691 A JPS6154691 A JP S6154691A
Authority
JP
Japan
Prior art keywords
stem
laser
chip
semiconductor laser
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17709784A
Other languages
Japanese (ja)
Inventor
Naotaka Otsuka
尚孝 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP17709784A priority Critical patent/JPS6154691A/en
Publication of JPS6154691A publication Critical patent/JPS6154691A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent a second return to a disk of laser beams returning to a stem by forming a stem surface at an acute angle or an obtuse angle without being shaped at a straight angle to a die bonding surface. CONSTITUTION:The surface of a laser stem 1 as the lower section of the end surface of a laser chip 2 is machined obliquely without running parallel with the end surface of the chip 2. Consequently, returning laser beams 6 are not projected to a disk again by inclining the surface of the stem 1. Accordingly, the stem has no adverse effect on a tracking board.

Description

【発明の詳細な説明】 く技術分野〉 本発明は半導体レーザステムに関するものである。[Detailed description of the invention] Technical fields> The present invention relates to a semiconductor laser stem.

〈従来技術〉 従来の半導体レーザ用ステムの構成を第２図に示す。<Conventional technology> FIG. 2 shows the structure of a conventional stem for a semiconductor laser.

図に於いて、１１はレーザステム、１２はレーザチップ
、１３はダイボンド面、１４はステム面、１５はレーザ
光、１６は戻り光を示す。In the figure, 11 is a laser stem, 12 is a laser chip, 13 is a die bonding surface, 14 is a stem surface, 15 is a laser beam, and 16 is a returned light.

従来の半導体レーザ用ステムは、第２図に示すように、
発光するレーザチップ端面の下部にあるステム面が、レ
ーザチップ端面と同一面上にある（つまり、ダイボンド
面と垂直である）ため、ディスクのトラッキングサーボ
に用いるビームの戻り光が、そのステム面で反射し、そ
の反射光が再びディスクに戻り、トラッキングサーボを
乱し、サーボをかからなくしている。The conventional stem for semiconductor laser, as shown in Fig. 2,
The stem surface at the bottom of the end surface of the laser chip that emits light is on the same plane as the end surface of the laser chip (in other words, it is perpendicular to the die bond surface), so the return light of the beam used for disk tracking servo is directed to the stem surface. The reflected light returns to the disk and disturbs the tracking servo, causing the servo to not work.

〈発明の目的〉 本発明は上記の欠点を除去することを目的としてなされ
たものであり、ステムに戻ってくるレーザ光が再びディ
スクに戻らないように、ステム面をダイボンド面と直角
にしないで、鋭角または鈍角にしたものである。<Purpose of the Invention> The present invention has been made for the purpose of eliminating the above-mentioned drawbacks, and the stem surface is not perpendicular to the die bonding surface so that the laser beam that returns to the stem does not return to the disk again. , an acute or obtuse angle.

〈実施例〉 本発明の一実施例を第１図に示す。<Example> An embodiment of the present invention is shown in FIG.

図に於いて、１はレーザステム、２はレーザチップ、８
はダイボンド面、４はステム面、５はレーザ光、６は戻
り光を示す。In the figure, 1 is the laser stem, 2 is the laser chip, and 8
4 represents the die bonding surface, 4 represents the stem surface, 5 represents the laser beam, and 6 represents the returned light.

このように、ステム面を斜めにすることにより、戻って
きたレーザ光は再びディスクに入射することはなく、ト
ラッキングサーボに悪い影響は与えないことになる。By slanting the stem surface in this way, the returned laser light will not enter the disk again, and will not have a negative effect on the tracking servo.

第１図では、ダイボンド面とステム面のなす角は鋭角に
なっているが、先に述べたように、鈍角でも良い。In FIG. 1, the angle formed between the die bonding surface and the stem surface is an acute angle, but as described above, it may be an obtuse angle.

〈発明の効果〉 以」二説明したように、本発明によれば、上記従来の欠
点を除去することができる、きわめて有用な半導体レー
ザステムを提供することができるものである。<Effects of the Invention> As described above, according to the present invention, it is possible to provide an extremely useful semiconductor laser stem that can eliminate the above-mentioned conventional drawbacks.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明に係るレーザステムの構成を示す図、第
２図は従来のレーザステムの構成を示す図である。 符号の説明 １：レーザステム、２：レーザチップ、３：ダイボンド
面、４：ステム面、５：レーザ光、６：戻り光。 代理人　弁理士　福　士　愛　彦（他２名）■ 第２図FIG. 1 is a diagram showing the configuration of a laser stem according to the present invention, and FIG. 2 is a diagram showing the configuration of a conventional laser stem. Explanation of symbols 1: Laser stem, 2: Laser chip, 3: Die bond surface, 4: Stem surface, 5: Laser light, 6: Return light. Agent Patent attorney Aihiko Fukushi (and 2 others) ■ Figure 2

Claims (1)

【特許請求の範囲】[Claims] １、発光するレーザチップ端面の下部にあるステム面を
、レーザチップ端面と平行にせず斜めに加工したことを
特徴とする半導体レーザステム。1. A semiconductor laser stem characterized in that the stem surface at the bottom of the end face of the laser chip that emits light is processed to be oblique rather than parallel to the end face of the laser chip.
JP17709784A 1984-08-24 1984-08-24 Stem for semiconductor laser Pending JPS6154691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17709784A JPS6154691A (en) 1984-08-24 1984-08-24 Stem for semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17709784A JPS6154691A (en) 1984-08-24 1984-08-24 Stem for semiconductor laser

Publications (1)

Publication Number Publication Date
JPS6154691A true JPS6154691A (en) 1986-03-18

Family

ID=16025082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17709784A Pending JPS6154691A (en) 1984-08-24 1984-08-24 Stem for semiconductor laser

Country Status (1)

Country Link
JP (1) JPS6154691A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012298A (en) * 1988-08-31 1991-04-30 Minolta Camera Kabushiki Kaisha Sheet transporting apparatus provided for a copying machine
US5037083A (en) * 1988-08-31 1991-08-06 Minolta Camera Kabushiki Kaisha Sheet storing apparatus for sheets ejected from a copying machine and a method of controlling it
US5083761A (en) * 1988-08-31 1992-01-28 Minolta Camera Kabushiki Kaisha Sheet storing apparatus for sheets ejected from a copying machine
US5288064A (en) * 1992-02-20 1994-02-22 Sharp Kabushiki Kaisha Paper pressing mechanism for paper feeding device
KR20130118620A (en) * 2012-04-20 2013-10-30 주식회사 탑 엔지니어링 Nozzle of resin applying apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106091A (en) * 1980-12-23 1982-07-01 Mitsubishi Electric Corp Semiconductor laser device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106091A (en) * 1980-12-23 1982-07-01 Mitsubishi Electric Corp Semiconductor laser device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012298A (en) * 1988-08-31 1991-04-30 Minolta Camera Kabushiki Kaisha Sheet transporting apparatus provided for a copying machine
US5037083A (en) * 1988-08-31 1991-08-06 Minolta Camera Kabushiki Kaisha Sheet storing apparatus for sheets ejected from a copying machine and a method of controlling it
US5083761A (en) * 1988-08-31 1992-01-28 Minolta Camera Kabushiki Kaisha Sheet storing apparatus for sheets ejected from a copying machine
US5288064A (en) * 1992-02-20 1994-02-22 Sharp Kabushiki Kaisha Paper pressing mechanism for paper feeding device
KR20130118620A (en) * 2012-04-20 2013-10-30 주식회사 탑 엔지니어링 Nozzle of resin applying apparatus

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