JPS6154654A - 液冷装置 - Google Patents

液冷装置

Info

Publication number
JPS6154654A
JPS6154654A JP59176708A JP17670884A JPS6154654A JP S6154654 A JPS6154654 A JP S6154654A JP 59176708 A JP59176708 A JP 59176708A JP 17670884 A JP17670884 A JP 17670884A JP S6154654 A JPS6154654 A JP S6154654A
Authority
JP
Japan
Prior art keywords
cooling
liquid
pipe
cooling liquid
boiling point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59176708A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317222B2 (enExample
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59176708A priority Critical patent/JPS6154654A/ja
Publication of JPS6154654A publication Critical patent/JPS6154654A/ja
Publication of JPH0317222B2 publication Critical patent/JPH0317222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/73—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59176708A 1984-08-27 1984-08-27 液冷装置 Granted JPS6154654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59176708A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59176708A JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Publications (2)

Publication Number Publication Date
JPS6154654A true JPS6154654A (ja) 1986-03-18
JPH0317222B2 JPH0317222B2 (enExample) 1991-03-07

Family

ID=16018364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59176708A Granted JPS6154654A (ja) 1984-08-27 1984-08-27 液冷装置

Country Status (1)

Country Link
JP (1) JPS6154654A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005284138A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 光学装置およびプロジェクタ
WO2007102498A1 (ja) 2006-03-06 2007-09-13 Tokyo University Of Science Educational Foundation Administrative Organization 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品
US8061414B2 (en) 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
WO2016075838A1 (ja) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
WO2017037860A1 (ja) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
US9653380B2 (en) 2015-05-26 2017-05-16 Fujitsu Limited Method for manufacturing component built-in substrate
US20180092243A1 (en) * 2015-03-30 2018-03-29 Exascaler Inc. Electronic-device cooling system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005284138A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 光学装置およびプロジェクタ
US8061414B2 (en) 2004-12-22 2011-11-22 Tokyo University Of Science Educational Foundation Administrative Organization Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof
WO2007102498A1 (ja) 2006-03-06 2007-09-13 Tokyo University Of Science Educational Foundation Administrative Organization 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品
WO2016075838A1 (ja) * 2014-11-14 2016-05-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
JPWO2016075838A1 (ja) * 2014-11-14 2017-10-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法
US20170332514A1 (en) * 2014-11-14 2017-11-16 Exascaler Inc. Cooling system and cooling method for electronic equipment
US20180092243A1 (en) * 2015-03-30 2018-03-29 Exascaler Inc. Electronic-device cooling system
US10123454B2 (en) * 2015-03-30 2018-11-06 Exascaler Inc. Electronic-device cooling system
US9653380B2 (en) 2015-05-26 2017-05-16 Fujitsu Limited Method for manufacturing component built-in substrate
WO2017037860A1 (ja) * 2015-08-31 2017-03-09 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム
CN107924896A (zh) * 2015-08-31 2018-04-17 株式会社ExaScaler 电子设备的冷却系统
CN107924896B (zh) * 2015-08-31 2021-07-23 株式会社ExaScaler 电子设备的冷却系统

Also Published As

Publication number Publication date
JPH0317222B2 (enExample) 1991-03-07

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