JPS6151418B2 - - Google Patents
Info
- Publication number
- JPS6151418B2 JPS6151418B2 JP8427477A JP8427477A JPS6151418B2 JP S6151418 B2 JPS6151418 B2 JP S6151418B2 JP 8427477 A JP8427477 A JP 8427477A JP 8427477 A JP8427477 A JP 8427477A JP S6151418 B2 JPS6151418 B2 JP S6151418B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- pellets
- tape
- pellet
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 235000012431 wafers Nutrition 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 description 31
- 230000000873 masking effect Effects 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8427477A JPS5419624A (en) | 1977-07-15 | 1977-07-15 | Adhering method of adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8427477A JPS5419624A (en) | 1977-07-15 | 1977-07-15 | Adhering method of adhesive tape |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1325884A Division JPS59196380A (ja) | 1984-01-30 | 1984-01-30 | 熱収縮粘着テ−プ |
| JP59013257A Division JPS59171137A (ja) | 1984-01-30 | 1984-01-30 | ペレット取り外し方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5419624A JPS5419624A (en) | 1979-02-14 |
| JPS6151418B2 true JPS6151418B2 (de) | 1986-11-08 |
Family
ID=13825865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8427477A Granted JPS5419624A (en) | 1977-07-15 | 1977-07-15 | Adhering method of adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5419624A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147129A (ja) * | 1982-02-26 | 1983-09-01 | Nitto Electric Ind Co Ltd | 半導体ウエハの固定方法 |
| JPH06105753B2 (ja) * | 1984-03-27 | 1994-12-21 | 日東電工株式会社 | 半導体ウエハの処理方法 |
| JPH06105752B2 (ja) * | 1984-03-27 | 1994-12-21 | 日東電工株式会社 | 半導体ウエハの処理方法 |
-
1977
- 1977-07-15 JP JP8427477A patent/JPS5419624A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5419624A (en) | 1979-02-14 |
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