JPS6149415A - 製造皿 - Google Patents

製造皿

Info

Publication number
JPS6149415A
JPS6149415A JP17133184A JP17133184A JPS6149415A JP S6149415 A JPS6149415 A JP S6149415A JP 17133184 A JP17133184 A JP 17133184A JP 17133184 A JP17133184 A JP 17133184A JP S6149415 A JPS6149415 A JP S6149415A
Authority
JP
Japan
Prior art keywords
molding
wafer
inlet
members
melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17133184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329169B2 (enExample
Inventor
Takashi Sawatani
沢谷　敬司
Takashi Yokoyama
敬志 横山
Ichiro Hide
一郎 秀
Takeyuki Matsuyama
松山　岳之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoxan Corp
Hoxan Co Ltd
Original Assignee
Hoxan Corp
Hoxan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoxan Corp, Hoxan Co Ltd filed Critical Hoxan Corp
Priority to JP17133184A priority Critical patent/JPS6149415A/ja
Publication of JPS6149415A publication Critical patent/JPS6149415A/ja
Publication of JPH0329169B2 publication Critical patent/JPH0329169B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02625—Liquid deposition using melted materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Photovoltaic Devices (AREA)
  • Recrystallisation Techniques (AREA)
JP17133184A 1984-08-17 1984-08-17 製造皿 Granted JPS6149415A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17133184A JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17133184A JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Publications (2)

Publication Number Publication Date
JPS6149415A true JPS6149415A (ja) 1986-03-11
JPH0329169B2 JPH0329169B2 (enExample) 1991-04-23

Family

ID=15921248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17133184A Granted JPS6149415A (ja) 1984-08-17 1984-08-17 製造皿

Country Status (1)

Country Link
JP (1) JPS6149415A (enExample)

Also Published As

Publication number Publication date
JPH0329169B2 (enExample) 1991-04-23

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