JPS6145608Y2 - - Google Patents

Info

Publication number

JPS6145608Y2

JPS6145608Y2 JP6405881U JP6405881U JPS6145608Y2 JP S6145608 Y2 JPS6145608 Y2 JP S6145608Y2 JP 6405881 U JP6405881 U JP 6405881U JP 6405881 U JP6405881 U JP 6405881U JP S6145608 Y2 JPS6145608 Y2 JP S6145608Y2

Authority

JP

Japan

Prior art keywords

dielectric resonator

dielectric

electronic circuit

unit

conductor

Prior art date

1981-04-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004020 conductor Substances 0.000 claims description 59
• 230000005284 excitation Effects 0.000 claims description 22
• 230000008878 coupling Effects 0.000 description 15
• 238000010168 coupling process Methods 0.000 description 15
• 238000005859 coupling reaction Methods 0.000 description 15
• 230000010355 oscillation Effects 0.000 description 9
• 238000004519 manufacturing process Methods 0.000 description 4
• 230000003321 amplification Effects 0.000 description 3
• 229910052751 metal Inorganic materials 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 238000003199 nucleic acid amplification method Methods 0.000 description 3
• 238000010586 diagram Methods 0.000 description 2
• 239000003973 paint Substances 0.000 description 2
• 230000002093 peripheral effect Effects 0.000 description 2
• 230000035939 shock Effects 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 239000004830 Super Glue Substances 0.000 description 1
• GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 238000004026 adhesive bonding Methods 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 230000004323 axial length Effects 0.000 description 1
• 238000005520 cutting process Methods 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 229920006332 epoxy adhesive Polymers 0.000 description 1
• FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 description 1
• 230000010354 integration Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1