JPS6143857B2 - - Google Patents
Info
- Publication number
- JPS6143857B2 JPS6143857B2 JP55149777A JP14977780A JPS6143857B2 JP S6143857 B2 JPS6143857 B2 JP S6143857B2 JP 55149777 A JP55149777 A JP 55149777A JP 14977780 A JP14977780 A JP 14977780A JP S6143857 B2 JPS6143857 B2 JP S6143857B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- integrated circuit
- multilayer wiring
- wiring board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14977780A JPS5772357A (en) | 1980-10-24 | 1980-10-24 | Mounting method of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14977780A JPS5772357A (en) | 1980-10-24 | 1980-10-24 | Mounting method of integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5772357A JPS5772357A (en) | 1982-05-06 |
JPS6143857B2 true JPS6143857B2 (US08087162-20120103-C00010.png) | 1986-09-30 |
Family
ID=15482490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14977780A Granted JPS5772357A (en) | 1980-10-24 | 1980-10-24 | Mounting method of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5772357A (US08087162-20120103-C00010.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0103068B1 (de) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen |
JPH07108748B2 (ja) * | 1985-07-05 | 1995-11-22 | ミノルタ株式会社 | 複写機 |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
DE4210835C1 (US08087162-20120103-C00010.png) * | 1992-04-01 | 1993-06-17 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | |
FR2781924B1 (fr) * | 1998-07-30 | 2002-11-29 | St Microelectronics Sa | Procede de montage de circuits integres |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48101085A (US08087162-20120103-C00010.png) * | 1972-03-31 | 1973-12-20 | ||
JPS5370672A (en) * | 1976-12-06 | 1978-06-23 | Ibm | Ic assembly |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233814Y2 (US08087162-20120103-C00010.png) * | 1971-12-29 | 1977-08-02 |
-
1980
- 1980-10-24 JP JP14977780A patent/JPS5772357A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48101085A (US08087162-20120103-C00010.png) * | 1972-03-31 | 1973-12-20 | ||
JPS5370672A (en) * | 1976-12-06 | 1978-06-23 | Ibm | Ic assembly |
Also Published As
Publication number | Publication date |
---|---|
JPS5772357A (en) | 1982-05-06 |
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