JPS6143715A - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS6143715A
JPS6143715A JP60158157A JP15815785A JPS6143715A JP S6143715 A JPS6143715 A JP S6143715A JP 60158157 A JP60158157 A JP 60158157A JP 15815785 A JP15815785 A JP 15815785A JP S6143715 A JPS6143715 A JP S6143715A
Authority
JP
Japan
Prior art keywords
pellet
optical system
bonding
recognition
outward appearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60158157A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355214B2 (enrdf_load_stackoverflow
Inventor
Haruo Amada
春男 天田
Masahiro Horii
堀井　将弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60158157A priority Critical patent/JPS6143715A/ja
Publication of JPS6143715A publication Critical patent/JPS6143715A/ja
Publication of JPS6355214B2 publication Critical patent/JPS6355214B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP60158157A 1985-07-19 1985-07-19 ワイヤボンダ Granted JPS6143715A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60158157A JPS6143715A (ja) 1985-07-19 1985-07-19 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60158157A JPS6143715A (ja) 1985-07-19 1985-07-19 ワイヤボンダ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8944878A Division JPS5516445A (en) 1978-07-24 1978-07-24 Wire bonder

Publications (2)

Publication Number Publication Date
JPS6143715A true JPS6143715A (ja) 1986-03-03
JPS6355214B2 JPS6355214B2 (enrdf_load_stackoverflow) 1988-11-01

Family

ID=15665510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60158157A Granted JPS6143715A (ja) 1985-07-19 1985-07-19 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS6143715A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188177U (enrdf_load_stackoverflow) * 1975-01-11 1976-07-14
JPS5310268A (en) * 1976-07-15 1978-01-30 Cho Onpa Kogyo Co Method of preventing image of heated semiconductor pellet from flickering of heat haze

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188177U (enrdf_load_stackoverflow) * 1975-01-11 1976-07-14
JPS5310268A (en) * 1976-07-15 1978-01-30 Cho Onpa Kogyo Co Method of preventing image of heated semiconductor pellet from flickering of heat haze

Also Published As

Publication number Publication date
JPS6355214B2 (enrdf_load_stackoverflow) 1988-11-01

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