JPS6142891B2 - - Google Patents
Info
- Publication number
- JPS6142891B2 JPS6142891B2 JP13488477A JP13488477A JPS6142891B2 JP S6142891 B2 JPS6142891 B2 JP S6142891B2 JP 13488477 A JP13488477 A JP 13488477A JP 13488477 A JP13488477 A JP 13488477A JP S6142891 B2 JPS6142891 B2 JP S6142891B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- electrode
- acoustic wave
- surface acoustic
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 31
- 238000010897 surface acoustic wave method Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02921—Measures for preventing electric discharge due to pyroelectricity
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
- H03H9/02653—Grooves or arrays buried in the substrate
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13488477A JPS5467792A (en) | 1977-11-09 | 1977-11-09 | Elastic surface wave element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13488477A JPS5467792A (en) | 1977-11-09 | 1977-11-09 | Elastic surface wave element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5467792A JPS5467792A (en) | 1979-05-31 |
| JPS6142891B2 true JPS6142891B2 (enrdf_load_stackoverflow) | 1986-09-24 |
Family
ID=15138749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13488477A Granted JPS5467792A (en) | 1977-11-09 | 1977-11-09 | Elastic surface wave element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5467792A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013108608A1 (ja) * | 2012-01-20 | 2013-07-25 | パナソニック株式会社 | 弾性波センサ |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09153758A (ja) * | 1995-09-29 | 1997-06-10 | Toshiba Corp | 弾性表面波デバイス |
| JP2008078739A (ja) * | 2006-09-19 | 2008-04-03 | Fujitsu Media Device Kk | 弾性波デバイスおよびフィルタ |
| CN110868181A (zh) * | 2019-11-29 | 2020-03-06 | 清华大学 | 一种具有gs分层式电极的薄膜材料声表面波器件及其制备方法与应用 |
| CN111010126A (zh) * | 2019-12-12 | 2020-04-14 | 无锡市好达电子有限公司 | 一种分层式电极的声表面波滤波器结构及其制备方法 |
| CN112383288A (zh) * | 2020-11-16 | 2021-02-19 | 清华大学 | 一种温度补偿的免封装声表面波器件及其制备方法 |
-
1977
- 1977-11-09 JP JP13488477A patent/JPS5467792A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013108608A1 (ja) * | 2012-01-20 | 2013-07-25 | パナソニック株式会社 | 弾性波センサ |
| US9322809B2 (en) | 2012-01-20 | 2016-04-26 | Panasonic Intellectual Property Management Co., Ltd. | Elastic wave sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5467792A (en) | 1979-05-31 |
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