JPS6142837U - semiconductor element - Google Patents

semiconductor element

Info

Publication number
JPS6142837U
JPS6142837U JP10855185U JP10855185U JPS6142837U JP S6142837 U JPS6142837 U JP S6142837U JP 10855185 U JP10855185 U JP 10855185U JP 10855185 U JP10855185 U JP 10855185U JP S6142837 U JPS6142837 U JP S6142837U
Authority
JP
Japan
Prior art keywords
semiconductor element
bonding material
abstract
metal powder
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10855185U
Other languages
Japanese (ja)
Inventor
昭二 滝島
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP10855185U priority Critical patent/JPS6142837U/en
Publication of JPS6142837U publication Critical patent/JPS6142837U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のハンダによる加熱接合構造を示す図、第
２図は本考案のマウント接合構造を示す図である。 １・・・基体、２・・・半導体チップ、５・・・接合材
、６・・・シリコン系樹脂、７・・・金属粉末。FIG. 1 is a diagram showing a conventional heat bonding structure using solder, and FIG. 2 is a diagram showing a mount bonding structure of the present invention. DESCRIPTION OF SYMBOLS 1... Base body, 2... Semiconductor chip, 5... Bonding material, 6... Silicon resin, 7... Metal powder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップを基体に接合材により接合させた半導体素
子において、該接合材が弾性を具えたシリコン系樹脂に
導電性金属粉末を混入して構成されていることを特徴と
する半導体素子。1. A semiconductor device in which a semiconductor chip is bonded to a base using a bonding material, wherein the bonding material is made of an elastic silicone resin mixed with conductive metal powder.
JP10855185U 1985-07-16 1985-07-16 semiconductor element Pending JPS6142837U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10855185U JPS6142837U (en) 1985-07-16 1985-07-16 semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10855185U JPS6142837U (en) 1985-07-16 1985-07-16 semiconductor element

Publications (1)

Publication Number Publication Date
JPS6142837U true JPS6142837U (en) 1986-03-19

Family

ID=30667733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10855185U Pending JPS6142837U (en) 1985-07-16 1985-07-16 semiconductor element

Country Status (1)

Country Link
JP (1) JPS6142837U (en)

Similar Documents

Publication Publication Date Title
JPS6142837U (en) semiconductor element
JPS59177949U (en) semiconductor equipment
JPS6117751U (en) Tape carrier semiconductor device
JPS59164241U (en) Ceramic package
JPS6025146U (en) semiconductor equipment
JPS5933254U (en) semiconductor equipment
JPS5889946U (en) semiconductor equipment
JPS5851448U (en) Power transistor mounting structure
JPS60125144U (en) thermal head
JPS6076040U (en) semiconductor equipment
JPS6020151U (en) semiconductor integrated circuit
JPS5952633U (en) high frequency element
JPS5851443U (en) semiconductor element
JPS58184840U (en) semiconductor equipment
JPS58182438U (en) semiconductor equipment
JPS59107155U (en) semiconductor circuit device
JPS59189242U (en) Resin-encapsulated semiconductor device
JPS5987135U (en) Glass sealed case for semiconductor devices
JPS60190053U (en) Hybrid integrated circuit device
JPS5974735U (en) integrated circuit device
JPS58114049U (en) semiconductor equipment
JPS59191744U (en) semiconductor equipment
JPS5967933U (en) Semiconductor electrode extraction structure
JPS587346U (en) semiconductor equipment
JPS58147259U (en) semiconductor element