JPS6141238Y2 - - Google Patents
Info
- Publication number
- JPS6141238Y2 JPS6141238Y2 JP1981169488U JP16948881U JPS6141238Y2 JP S6141238 Y2 JPS6141238 Y2 JP S6141238Y2 JP 1981169488 U JP1981169488 U JP 1981169488U JP 16948881 U JP16948881 U JP 16948881U JP S6141238 Y2 JPS6141238 Y2 JP S6141238Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- wiring layer
- circuit chip
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 For example Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981169488U JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981169488U JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874346U JPS5874346U (ja) | 1983-05-19 |
| JPS6141238Y2 true JPS6141238Y2 (en, 2012) | 1986-11-25 |
Family
ID=29961476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981169488U Granted JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874346U (en, 2012) |
-
1981
- 1981-11-16 JP JP1981169488U patent/JPS5874346U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874346U (ja) | 1983-05-19 |
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