JPS6140138B2 - - Google Patents
Info
- Publication number
- JPS6140138B2 JPS6140138B2 JP3144679A JP3144679A JPS6140138B2 JP S6140138 B2 JPS6140138 B2 JP S6140138B2 JP 3144679 A JP3144679 A JP 3144679A JP 3144679 A JP3144679 A JP 3144679A JP S6140138 B2 JPS6140138 B2 JP S6140138B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- thickness
- protective film
- semiconductor substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 21
- 239000008188 pellet Substances 0.000 description 19
- 239000002184 metal Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3144679A JPS55123145A (en) | 1979-03-16 | 1979-03-16 | Manufactureing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3144679A JPS55123145A (en) | 1979-03-16 | 1979-03-16 | Manufactureing method of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55123145A JPS55123145A (en) | 1980-09-22 |
| JPS6140138B2 true JPS6140138B2 (zh) | 1986-09-08 |
Family
ID=12331471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3144679A Granted JPS55123145A (en) | 1979-03-16 | 1979-03-16 | Manufactureing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55123145A (zh) |
-
1979
- 1979-03-16 JP JP3144679A patent/JPS55123145A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55123145A (en) | 1980-09-22 |
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