JPS6139555Y2 - - Google Patents

Info

Publication number
JPS6139555Y2
JPS6139555Y2 JP15559980U JP15559980U JPS6139555Y2 JP S6139555 Y2 JPS6139555 Y2 JP S6139555Y2 JP 15559980 U JP15559980 U JP 15559980U JP 15559980 U JP15559980 U JP 15559980U JP S6139555 Y2 JPS6139555 Y2 JP S6139555Y2
Authority
JP
Japan
Prior art keywords
pulp
flame
layers
sound
retardant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15559980U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5777511U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15559980U priority Critical patent/JPS6139555Y2/ja
Publication of JPS5777511U publication Critical patent/JPS5777511U/ja
Application granted granted Critical
Publication of JPS6139555Y2 publication Critical patent/JPS6139555Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Paper (AREA)
  • Building Environments (AREA)
JP15559980U 1980-10-30 1980-10-30 Expired JPS6139555Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15559980U JPS6139555Y2 (zh) 1980-10-30 1980-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15559980U JPS6139555Y2 (zh) 1980-10-30 1980-10-30

Publications (2)

Publication Number Publication Date
JPS5777511U JPS5777511U (zh) 1982-05-13
JPS6139555Y2 true JPS6139555Y2 (zh) 1986-11-13

Family

ID=29514781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15559980U Expired JPS6139555Y2 (zh) 1980-10-30 1980-10-30

Country Status (1)

Country Link
JP (1) JPS6139555Y2 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode

Also Published As

Publication number Publication date
JPS5777511U (zh) 1982-05-13

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