JPS6139195B2 - - Google Patents
Info
- Publication number
- JPS6139195B2 JPS6139195B2 JP52069167A JP6916777A JPS6139195B2 JP S6139195 B2 JPS6139195 B2 JP S6139195B2 JP 52069167 A JP52069167 A JP 52069167A JP 6916777 A JP6916777 A JP 6916777A JP S6139195 B2 JPS6139195 B2 JP S6139195B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- boron phosphide
- phosphide compound
- thermal printing
- surface protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- -1 boron phosphide compound Chemical class 0.000 claims description 23
- 238000007651 thermal printing Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 64
- 230000001681 protective effect Effects 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 15
- 239000010936 titanium Substances 0.000 description 15
- 229910052719 titanium Inorganic materials 0.000 description 15
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 14
- 229910052750 molybdenum Inorganic materials 0.000 description 14
- 239000011733 molybdenum Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 10
- 238000007639 printing Methods 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- 230000004044 response Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- FFBGYFUYJVKRNV-UHFFFAOYSA-N boranylidynephosphane Chemical compound P#B FFBGYFUYJVKRNV-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- MUJOIMFVNIBMKC-UHFFFAOYSA-N fludioxonil Chemical compound C=12OC(F)(F)OC2=CC=CC=1C1=CNC=C1C#N MUJOIMFVNIBMKC-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6916777A JPS544146A (en) | 1977-06-11 | 1977-06-11 | Heat-sensitive printing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6916777A JPS544146A (en) | 1977-06-11 | 1977-06-11 | Heat-sensitive printing head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS544146A JPS544146A (en) | 1979-01-12 |
JPS6139195B2 true JPS6139195B2 (enrdf_load_stackoverflow) | 1986-09-02 |
Family
ID=13394872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6916777A Granted JPS544146A (en) | 1977-06-11 | 1977-06-11 | Heat-sensitive printing head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS544146A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137240U (ja) * | 1983-03-02 | 1984-09-13 | 株式会社津石製作所 | 組立て板材の連続搬送装置 |
JPS6023151U (ja) * | 1983-07-21 | 1985-02-16 | トヨタ自動車株式会社 | 軟質薄板材の取出装置 |
-
1977
- 1977-06-11 JP JP6916777A patent/JPS544146A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS544146A (en) | 1979-01-12 |
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